Quality Reliability Report 2004 (Period Covered: 2003) DC04-
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Quality Reliability Report 2004
(Period Covered: 2003)
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Table Contents
Table Contents
CHAPTER ZILOG'S QUALITY CULTURE RELIABILITY QUALITY ASSURANCE POLICY STATEMENT. ZiLOG QUALITY POLICY MISSION STATEMENT. ZiLOG'S QUALITY RELIABILITY PROGRAM Harmony Between Design Process Training. Order Acknowledgment Policy Test Guardbanding Product Characterization Process Qualification. Product Qualification Measurement, Direct Indirect. Measurement Direct Indirect Field Quality Engineers Product Analysis Oxide Charge Breakdown (Qbd) Statistical Process Control Total Quality Program. ZiLOG Vendor Year Award Lead-Free Products Environmental Protection Recycling ZiLOG ENVIRONMENTAL, HEALTH SAFETY POLICY CERTIFICATION 9000 CERTIFICATION FOUNDRIES/SUBCONTRACTORS. QUALITY RELIABILITY TREND CHARTS Rate (FIT Failure Time: Failures Billion Hours) Electrical. R/QA Organizational Chart. CHAPTER CUSTOMER QUALITY SUPP0RT SYSTEM CUSTOMER FAILURE ANALYSIS/CORRELATION PROCEDURE Guideline Information Needed Factory With CFA's. Summary Test Equipment. Summary Test Equipment. Summary Test Equipment. CUSTOMER NOTIFICATION SYSTEM
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Table Contents
CHAPTER QUALIFICATION REQUIREMENTS. Product/Process Qualification Requirements. Product/Process Qualification Requirements. ZiLOG Product Qualification Summary. Package Qualification Requirements ZiLOG Package Qualification Summary CHAPTER QUALITY MONITOR SYSTEMS FAILURE RATE PREDICTION CALCULATIONS Z85230VSC Rate Calculation TESTING METHODOLOGY. LATCHUP TESTING METHODOLOGY. ZiLOG'S RELIABILITY SUMMARY EARLY LIFE LONG TERM LIFE PRESSURE POT. TEMPERATURE CYCLE. HIGHLY ACCELERATED STRESS TEST PACKAGE INTEGRITY TEST Reliability Monitor Testing Requirements Early Life Test, HRS, 125°C Early Life Test, HRS, 125°C Long-Term Life Test, 150°C, 5V,184 HRS. Long-Term Life Test, 125°C,1000 Early Life Test Summary. Long-Term Life Test Summary. Pressure Test, 121°C, ATM. Temperature/Humidity Test, 85°C/85% Temperature Cycling Test, Condition -65°C 150°C Highly Accelerated Stress Test (HAST), 140°C ATM. Package Integrity Test C-Mode Scanning Acoustic Microscope Monitor. CHAPTER ASSEMBLY TEST INFORMATION PACKAGE TYPES. TECHNOLOGY DATA. PRE/POST PACKAGING DEVICE TEST PROCEDURES PLASTICS PROCESS FLOW. PLASTIC-STANDARD ASSEMBLY/TEST PROCESS HANDLING STORAGEOF SURFACE MOUNT DEVICES HANDLING. LEAD PROTECTION PROTECTION. STORAGE UNPACKING CAUTION SOLDERING. DESOLDERING
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Table Contents
THERMAL CHARACTERISTICS Calculation Device Junction Temperature. Device Table Summary Thermal Characteristics ZiLOG Plastic Packages Device Table Summary Thermal Resistance Hermetic Packages CHAPTER QUALITY SYSTEMS QUALITY SYSTEMS SUBCONTRACTING. TRACEABILITY AVAILABILITY DOCUMENTATION MONITORING. QUALITY DATA TESTING (QA/Operating). TEST TAPE SUPPORT. WHAT HAPPENS WHEN FAILURES OCCUR?. WHEN MANUFACTURING PERFORMED OFFSHORE, WHAT CONTROLS? AVAILABILITY PROGRAMMING FACILITIES. AUDIT. STATISTICAL PROCESS CONTROL SCOPE CONTROL CHARTS DESIGN EXPERIMENTS. DOCUMENT CONTROL SYSTEM. FLOW CHART FABRICATION TYPICAL PROCESS CHAPTER QUALITY RELIABILITY GLOSSARY.
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CHAPTER ZiLOG's Quality Culture
CHAPTER
ZiLOG's Quality Culture
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CHAPTER ZiLOG's Quality Culture
ZiLOG's Quality Culture
RELIABILITY QUALITY ASSURANCE POLICY STATEMENT
ZiLOG's philosophy towards quality been consistently aimed continuous product improvement optimization processes associated with design, manufacture, test delivery products that conform established requirements total customer satisfaction. been ZiLOG tradition that customer main driving force company-wide goal achieve highest quality possible. Through excellent management personnel, equipment, materials, environmental resources, ZiLOG well positioned success.
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CHAPTER ZiLOG's Quality Culture
ZiLOG QUALITY POLICY MISSION STATEMENT
"ZiLOG designs, builds, tests, delivers quality through constant product process improvements total customer satisfaction." ZiLOG designs quality solutions matching designs established process parameters. Hence, product design will always guardbanded relative process capabilities. ZiLOG builds quality that different contributing factors work harmoniously achieve maintain required level product quality reliability. ZiLOG rigorously tests products processes customers receive highest quality reliability. ZiLOG delivers quality customers receive solutions that meet their expectations contract requirements.
ZiLOG, subscribe philosophy that quality everyone's responsibility. employees ZiLOG believe that there compromise Reliability Quality products. information provided this report reflects their determination provide finest possible products.
ZiLOG proud Reliability Quality programs pleased share this data with customers. further information, contact ZiLOG's Director Reliability Quality Assurance.
Mike Burgdorf Director Reliability Quality Assurance
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CHAPTER ZiLOG's Quality Culture
ZiLOG'S QUALITY RELIABILITY PROGRAM
ZiLOG's Quality Reliability Program based careful study principles laid down such pioneers Deming Juran. Even more importantly, have benefited from observation practical implementation those principles practiced Japanese, European American manufacturing facilities. ZiLOG program begins with employee involvement. Whether judgment performance based perfection with incoming inspection, trouble free service field, timely accurate customer service, recognize that employees ultimately control these factors. Hence, quality program broadly shared throughout organization. Harmony Between Design Process High product quality reliability VLSI products possible only there structural harmony between product design manufacturing. Great care taken ensure that statistical process control limits observed within manufacturing plants properly guardband design technology used configure circuit layout ZiLOG's automated design methodology. Through technique that call Process Templating, technology file automated design system periodically updated ensure that product design parameters fall within statistical control limits with which process actually operated. simple terms, Process Template profile displayed process evaluation parameters that automatically recorded from test patterns wafers they proceed through production line. These parameters translated into design technology file attributes every product design bears lock relationship process. Training integrity product design manufacturing process depends skills employees. ZiLOG training emphasizes fundamentals involved product design processing quality reliability. Customer Service, important aspect ZiLOG's quality performance vendor, also depends upon people clearly understanding their jobs obligations customers. This aspect training also part overall curriculum administered ZiLOG.
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CHAPTER ZiLOG's Quality Culture
Order Acknowledgment Policy definition vendor quality performance that vendor "does what promises acknowledges." Acceptable reliability quality achieved only ZiLOG customer agreement product delivery specifications. Test Guardbanding physical attribute absolute. Customers' test methods differ from ZiLOG's variations test equipment, temperature specification interpretation. ensure that every ZiLOG product performs full customer expectations, ZiLOG uses "waterfall" methodology testing. first electrical tests made circuit both parameters, wafer probe operation, guardbanded final test specifications. final test specifications both parameters, turn, guardbanded quality control outgoing sample. quality control outgoing sample guardbanded data sheet specifications. This technique "waterfall" guardbanding eliminates circuits that marginal customer's expectations long before they shipping container. Product Characterization Every ZiLOG product design evaluated over extremes operating temperature, supply voltage, clock frequency prior production release. This information permits proper guardbanding test program waterfall identification marginal "corners" design tolerances. product characterization summary, which details more important tolerances identified process this exhaustive product design evaluation, available ZiLOG's customers. Process Qualification ZiLOG also qualifies every process prior production exhaustive stress sequence performed test chips representative products. Once process regime qualified, process re-qualification performed time there major process change, whenever process template statistical quality limits significantly exceeded adjusted. Product Qualification addition characterization, every ZiLOG product design fully qualified comprehensive series life, electrical, environmental tests before release production. Whenever possible, both industry standard environmental life tests employed. Again, qualification summary available customers which details certain life environmental data taken course these evaluations. Please Qualification Requirements example ZiLOG Package Qualification Summary Device Qualification Summary. Measurement, Direct Indirect
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CHAPTER ZiLOG's Quality Culture
frequently said that want improve something, need measure Therefore, ZiLOG measures outgoing quality "parts million" maintenance careful records statistical sampling production lots prepared shipment. This information then translated statement parts million outgoing quality performance. course, thing ZiLOG think doing good outgoing product quality another customer agree. Therefore, certain customers provide with their incoming inspection data that helps calibrate outgoing performance terms actual results field. fact that ZiLOG been awarded "ship stock" status many customers testifies success this area. Measurement Direct Indirect Just ZiLOG records outgoing quality terms parts million, also measures outgoing product reliability terms "FITS" Failures billion device hours. This calculation done using results weekly operating life test measurements circuits performed accordance with standard specifications. Field Quality Engineers ZiLOG maintains force skilled Field Application Engineers, also trained Field Quality Engineers. These engineers available immediate call consult customers problems they experiencing with ZiLOG product performance. Product Analysis Product Analysis facilities, staffed experienced professionals, exist each ZiLOG site provide rapid evaluation in-process in-field rejects. ZiLOG pleased share product analysis reports specific products with customer upon request. Oxide Charge Breakdown (Qbd) Gate oxide quality ZiLOG's major fabrication processes monitored weekly through extraction wafer level data from parametric test database. ZiLOG's test based J-ramp test specified JEDEC Standard JESD35- "Procedure Wafer-Level Testing Thin Dielectrics." Statistical Process Control ZiLOG employs Statistical Process Control critical process steps. Deviations from norms must evaluated review board.
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CHAPTER ZiLOG's Quality Culture
Total Quality Program ZiLOG employees actively participate meetings where methods proposed, reviewed, adopted. These meetings enable department more precise accurate manner. ZiLOG Vendor Year Award ZiLOG proud many quality performance awards received from customers. turn, ZiLOG makes annual award vendor done best overall ZiLOG. Lead-Free Products Lead-free versions ZiLOG products (except BGA) available. ZiLOG responding requests from European Community customers products that adhere Wastes from Electric Electronic Equipment (WEEE) Restriction Hazardous Substances (RoHS) directives. These regulations, which effectively require manufacturers take responsibility recycling end-of-life products, state that lead other hazardous substances must regulated July 2006. ZiLOG uses percent pure matte (Sn) plating lead free products. devices rated peak temperatures 255°C (compared 240°C standard products) mold compounds that Br/Sb/PBB/PBDE-free. packages meet requirements joint IPC/JEDEC J-STD-020 standard. parts will identified with unique ZiLOG part number that includes (for Green), indicate environmentally friendly packages. Customers request lead free version currently shipping ZiLOG device contacting ZiLOG's worldwide sales offices. Environmental Protection Recycling ZiLOG committed environmental protection-recycling project that becoming international requirement. ZiLOG prefers that materials used package finished products recyclable and/or manufactured from recycled material. "Recyclable" symbol already found shipping boxes, tubes reels, shipping trays QFP/VQFP products.
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CHAPTER ZiLOG's Quality Culture
ZiLOG ENVIRONMENTAL, HEALTH SAFETY POLICY
ZiLOG's mission create superior value stakeholders. health safety employees, proper care environment, paramount importance. ZiLOG's concern them only good corporate citizenship, it's also good business. ZiLOG committed continuously improving Environmental, Health Safety Management System. Strict compliance with applicable regulations considered minimum standard neither production goals financial objectives shall excuse noncompliance. core values ZiLOG's Management System Create, maintain promote safe healthful workplace employees. Comply with intent well letter relevant regulations Federal, State Local levels. goals objectives measure progress toward them. Promote respect environment among employees. Conserve resources minimize waste reducing, reusing, recycling. Integrate considerations into business planning, decision making, daily activities. Provide resources training carry this policy. Prevent accidents minimize environmental impacts. Communicate performance. Respond concerns communities which business. Support public policy development. Encourage contractors suppliers adopt standards similar own. Exchange knowledge technology.
These core values build tradition quality, innovation, continuous improvement. Each employee personally responsible making these value part everyday work life ZiLOG.
Thorburn Chief Executive Officer ZiLOG, Inc.
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CHAPTER ZiLOG's Quality Culture
CERTIFICATION ZiLOG extremely proud have received following 9000 certification awards, which reflect stringent quality standards which ZiLOG products manufactured. FACILITY/LOCATION ZiLOG Electronics Philippines, Inc. (ZEPI) Manila, Philippines Final Test Shipment Semiconductors CERTIFICATION RECEIVED 9002 Re-certified 7/98 Yarsley International Certification Services Camberley, Surrey, 14001 Certified 11/99 International Certification Services Zurich, Switzerland
ZiLOG Nampa Nampa, Idaho Wafer Fabrication
9001 Re-certified 9/98 National Standards Authority Ireland. 14001 Certified 3/99 National Standards Authority Ireland.
(*ISO International Standards Organization) 9000 CERTIFICATION FOUNDRIES/SUBCONTRACTORS FACILITY Wafer Foundries: TSMC Assembly Subcontractors: Amkor Unisem NSEB LOCATION Taiwan Taiwan PROGRAM 9002/QS9000 9002/TS16949
Batam, Indoneasia Manila, Manila, Taiwan Malaysia Thailand
9002/QS9000 9002/QS9000 9002/QS9000 9002/QS9000 9002/QS9000
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CHAPTER ZiLOG's Quality Culture
QUALITY RELIABILITY TREND CHARTS Figure Rate (FIT Failure Time: Failures Billion Hours)
Figure Electrical
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CHAPTER ZiLOG's Quality Culture
Figure R/QA Organizational Chart
Director Reliability Quality Assurance Mike Burgdorf
Principal Engineer Reliability Quality Assurance Joseph Brajkovich
Director Quality Assurance Nampa Mike Burgdorf
Manager Quality Assurance Asia Malie Fonte
Manager Quality Systems Margo Goldberg
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CHAPTER Customer Quality Support System
CHAPTER
Customer Quality Support System
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CHAPTER Customer Quality Support System
Customer Quality Support System
CUSTOMER FAILURE ANALYSIS/CORRELATION PROCEDURE ZiLOG complete Customer Failure Analysis (CFA) system. Using this system, customer return units failure analysis test correlation. sequence events procedure follows: Customer suspects failure. customer completes request. Figure 3-1. request assigned number tracking. customer returns unit(s) factory. Product/Test Engineering performs go/no-go electrical test. unit(s) test results given Failure Analysis Engineer. unit(s) fail test, Failure Analysis Engineer performs electrical physical analysis, generates report. Figure 3-2. unit(s) pass test, Failure Analysis Engineer generates report returns unit(s) customer. goal provide complete report within working days from time unit(s) received. ZiLOG customer will work together reduce types failures zero. procedure several communication tools that used achieve this goal, proving overall effectiveness since inception 1985.
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CHAPTER Customer Quality Support System
Figure Guideline Information Needed Factory With CFA's Purpose: eliminate time spent researching failed component/part history order concentrate finding root cause failure complaint customer
OP184
FAILURE ANALYSIS QUESTIONNAIRE
GENERAL INFORMATION: Initiated Customer Name: Customer Address: Phone Parts Under Warranty? NOTE: Failure analysis warranty parts information only. PART INDENTITY: Device: Customer Application: Date/bb Code: Qty. being returned: Total devices lot: Qty. failed devices: Date: B.U.:
Qty. devices tested/inspected:
FAILURE DESCRIPTION: Incoming: Assembly: Noise Option? part removed with other parts? failure follow part? this application this device? this failure mode? Final Test: Field Return:
long service before failure occurred?
Additional processing temperatures which part seen before failure occurred:
there Customer board test program available ZiLOG? there failing passing samples available correlation work? Process steps part seen time failure: RETURNS: Programmer used: Option Bits Selected: Software Rev:
Checksum:
NOTE: most thorough analysis, please include file Customer's code. ADDITIONAL DETAILS:
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CHAPTER Customer Quality Support System
Table Summary Test Equipment Equipment ZEPI Wetting Balance Tester ISOMET Speed Curve Tracer Tester Tester HAST Polimet Polisher High Power Scope Power Scope Etch Plates Pressure Cooker Plasmod Plasma Etcher Digital Multimeter Power Supply Timer Acoustic Microscope Profile Projector Temperature/Humidity Test Chamber Temperature/Humidity Test Chamber Salt Atmospheric Chamber Mechanical Shock Tester Test Thermal Shock Temperature Cycle Toolmaker Scope Hardness Tester Plating Thickness Measuring Equipment Wirepull Tester Wirepull Tester Beam Balance Shear Tester Particle Counter Flow Thru Cooler Digital Linear Gauge Brand Multicore Must Buehler Tektronix IMCS Oryx 11000 Express Test Buehler Olympus Bausch Lomb Novus Technologies Ready-Heat Electric Steroclave March Inst Leica S420 Fluke Gralab Sonoscan C-SAM 3100 Mitutoyo ESPEC Sexton ESPEC Associated Lansmont Unholtz-Dickie Tabai Ransco Unitron Ames Precision Fischerscope Unitek Westbond None Atcor Neslab -Usage Solderability Test Cross-Section Analysis Bench Check VZAP Testing VZAP Testing Reliability Test Cross-Section Analysis External/Internal Visual Inspection External/Internal Visual Inspection Decapping Plastic Devices Solderability-Steam Aging Reliability Test Topside Etch Visual Elemental Analysis Latchup Test Latchup Test Timed Operations Delamination Inspection Dimensional Inspection Temperature/Humidity Test Moisture Resistance Test Salt Atmosphere Test Mechanical Shock Test Test Thermal Shock Test Temp Cycle Test Dimensional Check Leadframe Plating Thickness In-Process Wirepull Testing In-Process Wirepull Testing Weight Measurement Shear Test Airborne Particle Measurement Viscosity Check Wafer Thickness Check
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CHAPTER Customer Quality Support System
Table Summary Test Equipment Equipment ZEPI Incubator Ball Shear Tester High Power Scope Meter Chatillion Gauge Coplanarity Tester MP-4 Land Camera With Stage Floodlights High Power Microscope w/Video Camera Brand Millipore Olympus Chatillion RVSI Polaroid Leitz, Usage Bacteria Monitor Wirebond Check Inspection Check Push Test Coplanarity Check Photo Duplicating, Macrophotography 8X10 Wafer Level Inspection
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CHAPTER Customer Quality Support System
Table Summary Test Equipment Equipment Nampa Zoom Stereoscope 5-50X Brand Nikon Usage X-Section Mounting, Low-Power Inspection Package Visual Microphotography Film Radiography Sample Prep (Backup) Package Cross High Temp Analysis 1100C Bake Recovering Bake Recovering Sample Storage Chemical Safety Chemical Safety Cross-Section Wafer Reliability Analysis Chemical Etch Wafer Pressure Test Chip Unzip Chemical Heating Sample Cleaning Sample Cleaning Topside Etch Descum Part Decapsulation Part Decapsulation Timed Operations Chemical Measurement Penetrant Test EPROM Erasing Bench Check Bench Check Waveform Photo Bench Temperature Testing Microprobing Trace Cutting
High Power Microscope w/Camera, Nikon 1000X Long-Working Distance Objectives X-Ray System Faxitron Gold Coater Denton Vacuum Low-Speed Diamond Buehler Bench Furnace Lindberg High Temperature Ovens: 175C Blue 150C Blue 125C Blue Exhaust Hood Kewaunee Sink w/Exhaust Plastics 3-Wheel Polisher Buehler Plate PC100 Corning Plate PC100 Corning Plate Lindberg Plate Corning Plate Arthur Thomas Type 2000 Ultrasonic Cleaner Bransonic Ultrasonic Cleaner Branson 3510 Plasma Etcher Tegal Etch Rinse Enterprises Cerdip Opener Enterprises Timers Gralab Dial-O-Gram Ohaus Light Blak-Ray Light Logical Devices, Inc. Curve Tracer Tektronix Curve Tracer Tektronix Camera Tektronix Temperature Forcing Unit Temptronic Microprobe Station Wentworth Laser Cutter Wave LAZE Microprobe Device Socket Cards:
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CHAPTER Customer Quality Support System
Table Summary Test Equipment Equipment Nampa LCC/PLCC Lead Lead Narrow Pitch High Power Microscope 400x High Power Microscope 1000x S440 With SIMS (SIMS working) Brand ZiLOG Designed Micromanipulator ZiLOG Designed Nikon Nikon Leica Bench Microprobe Work Visual Microscope Visual Chip Unzip Inspection High Power Imaging Micro Cross Sectioning, Device Modification Elemental Analysis Imaging Device Deprocessing Product Visual Examination Feature Size Measurement Video Camera Inch Color Video Print Signal Waveform Monitor Parametric Tester Capacitance Measure Emission Microscope, Device Microprobe, Emission Microscope, Microprobe Liquid Crystal (Room Hot) Usage
Reactive Etcher (REI), 8-Inch Polycon, DIC, Confocal, Fluorescence, W/8x8" Stage W/Micron Stage Readout W/Sony Color Video Oscilloscopes 4145A w/LCR Meter Visionary 2000 W/MP2000 Probe Package Device Thermal Socket Cards: Lead PLCC Lead PLCC Lead PLCC Lead PLCC Lead PQFP Lead Lead VQFP Lead Lead Lead (300 Mil) Blazer Tester W/8" Probe Station 4156B Precision Semiconductor Parameter Analyzer 35665A Dynamic Signal Analyzer
Trion Leica-Reichert Semprex Optronics Sony Tektronics 7704 Hypervision Carl Suss Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Wentworth
Bitmapping, Device Test Microprobe Parametric Tester Tester
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CHAPTER Customer Quality Support System
Table Summary Test Equipment Equipment Nampa 4275A Multi-Frequency Meter 4274A Multi-Frequency Meter Microminipulator Test Station 4155B Semiconductor Parameter Analyzer PQFP 17x17 PLCC PLCC Display 1340A Philips XL30 SFEG Multiprep Techprep 4500x High Power Optical Microscope High Temperature Oven Photographic Printer Printer (color) Camera Chip Unzip Brand Micromanipulator Agilent Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Philips Allied High Tech Nikon Eclipse L200 Usage Tester (Inductance, capacitance, resistance instrument) Tester (Inductance, capacitance, resistance instrument) Probe Test Parameter Tester Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Signal Display Ultra High Resolution SEI, (Solid State) Parallel Polishing Bright field, Dark field, Numarsky, Confocal inspection, Digital Camera1280 1944 Hammer Testing, Curing High Quality Photographic Printer Photographic Printer Polaroid Photographs Backside Analysis
Grieve Codonics Tektronics Polaroid Hypervision
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CHAPTER Customer Quality Support System
Table Summary Test Equipment Equipment Jose Spectrum Analyzer Pre-Amplifier Plotter Biconical Antenna Periodic Antenna Brand HP-8591A HP8447D HP-7550A #CEAB-100 #CEAL-100 Usage Near Field Testing Near Field Testing Near Field Testing Near Field Testing Near Field Testing
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CHAPTER Customer Quality Support System
OUTSIDE LABS RIGA Analytical Lab, Inc. 3375 Scott Blvd., Suite Santa Clara, 95051 Charles Evans Assoc. Chesapeake Drive Redwood City, 94063 BridgePoint Tech. Mfg. 4007 Commercial Drive Austin, 78744
CUSTOMER NOTIFICATION SYSTEM Corporate R/QA notifies customer with formal change notification letter major process design changes customer requests notification such. following list criteria which certain customers need notified: Process: size, passivation, metallization, mask changes. Materials finishes: either internally externally, including symbolization. Internal Connection Methods: including lead bonding attach. Packaging: sealing encapsulation techniques, including lead bonding attach. Test Parameters: which affect correlation. Anti-Static Handling: procedures packaging.
Shown following pages example change notification letter that gives customer schedule conversion, stating that: customer will given days request qualification samples from ZiLOG. product will shipped within days from date letter, unless ZiLOG receives written notice from customer continue shipping their current qualified product.
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CHAPTER Customer Quality Support System
June 2000
Subject: Customer Change Notification Z80S183 Z80L183 Revision Change From Dear Customer: Please advised that ZiLOG process changing current Z80S183/Z80L183 revision Mixed Signal 180. Z80S183/Z80L183 revision fully compatible with existing Z80S183/Z80L183 with exception following improvements: Improved Sleep Mode current less than less than 700µa modes Watch Timer functional. Register location changed from reflect die. Z80S183/Z80L183 have date code lower left corner package follow yyww convention, where year week. improved will stamped date code later than 0025. wish receive qualification samples product, contact ZiLOG field sales office serving your area. Sincerely,
Mike Burgdorf Director Reliability Quality Assurance
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CHAPTER Qualification Requirements
CHAPTER Qualification Requirements
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CHAPTER Qualification Requirements
Qualification Requirements
Product/Process Qualification Requirements Procedures SOP0940, SOP0903 SOP0909, ZiLOG performs initial qualification processes, products packages. Re-qualification required when material changes occur. Table Product/Process Qualification Requirements Sample Size Acceptance Criteria MIL-STD 883C/Procedure 3015 QCC1425 EIA/JESD78 1005
Test CMOS Latchup
Test Conditions Min. PTIC, NTIC
Operating Life
1/77
150°C, Hour/Full Qual -65°C 150°C Cycles/Qual 1000 Cycles/Test Hours 121°C Hours 140° A
Temp Cycle
0/45 1010, Condition
Pressure
0/45
QCM-075
HAST
0/45 QCM-087
Package Integrity 0/10 240°C, Note: Process Qual requires three lots, Product Qual requires lot.
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CHAPTER Qualification Requirements
ZiLOG Product Qualification Summary
PRODUCT QUALIFICATION SUMMARY
ZiLOG Authorized Distribution
Document Control Nbr.: QR-9392
Rev.:
Page
DATE:
12-4-01 0.35 Burgdorf
PRODUCT: WRITTEN
Z86L88 Joseph Brajkovich
PROCESS: APPROVED:
INTRODUCTION This report summarizes qualification results Z86L88 Microcontroller.
INFORMATION SUMMARY qualification tests were performed MIL-STD-883 and/or internal ZiLOG procedures.
PRODUCT QUALIFICATION Test Description Latch-up Burn-in Temperature cycle Pressure HAST Package integrity Test Method MIL-STD-883/3015 QCC1425 MIL-STD-883/1005 MIL-STD-883/1010 120° 140° 240° seconds TYPE 0.35 Z86L88/G Condition Condition Test Condition 150° Condition Test Test Test Test Result PASS PASS 0/77 hours 0/50 1000 cycles 0/50 hours 0/50 hours 0/15
QUALIFICATION Process Device
DOC. QR-0656 QR-1098
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Package Qualification Requirements Sample Size Acceptance Criteria 0/15 0/15 0/15 0/15 1/77 MIL-STD 883C/Procedure 2003 2016 2004 1004 1004 2019.5 2011, Condition 2011, Condition 1005 150°C, Hour/Full Qual -65°C 150°C Cycles/Qual 1000 Cycles/Test Hours 121°C Hours 140°C, A240°C, 2012 Mil-STD Test Method
Test Solderability Physical Dimensions Lead Fatigue External Visual Internal Visual Shear Bond Strength Bond Shear Operating Life
Test Conditions LTPD 15/Leads Mil-STD Mil-STD Mil-STD Mil-STD Min.
Temp Cycle
0/45
1010, Condition
Pressure HAST
0/45 0/45
QCM-075 QCM-087
Package Integrity X-Ray Solder Dunk
0/15 0/32
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CHAPTER Qualification Requirements
ZiLOG Package Qualification Summary
PACKAGE QUALIFICATION SUMMARY
Document Control Nbr.: QR-3002 Page
Rev.: OP25
PACKAGE TYPE: WRITTEN
Joseph Brajkovich
DATE: APPROVED:
1-27-99 Alice Baluni
INTRODUCTION This report summarizes qualification results package.
INFORMATION SUMMARY qualification tests were performed MIL-STD-883 and/or internal ZiLOG procedures.
PACKAGE QUALIFICATION Test Description Bond Strength Bond Shear Shear Physical Dimensions Resistance Solvents Lead Fatigue Solderability Pressure Temperature Cycle Burn-In Package Integrity Solder Dunk Test Method MIL-STD-883/2011 MIL-STD-883/2011 MIL-STD-883/2019.5 MIL-STD-883/2016 MIL-STD-883/2015 MIL-STD-883/2004 MIL-STD-883/2003 QCM-075 MIL-STD-883/1010 MIL-STD-883/1005 seconds seconds Condition Condition Spec Spec Test Method Test Method Test Method Test Method Spec Condition Test Method After 1000 Temp Cycle Test Result 6.8/8.2/7.5 min/max/ave 0/15 0/15 0/45 0/45 1000 cycles 0/77 1000 0/15
QUALIFICATION
Package
TYPE
DOC. QR-0308
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CHAPTER Quality Monitor Systems
CHAPTER Quality Monitor Systems
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CHAPTER Quality Monitor Systems
Quality Monitor Systems
FAILURE RATE PREDICTION CALCULATIONS ZiLOG estimates operating life products through statistical methods. possible guarantee lifetime individual part because tests determine this destructive. Therefore, only statistics predict typical behavior groups parts. These predictions, methods they based documented reports. report based process specific data derated reflect individual device characteristics. reports available ZiLOG's products. Other factors that affect device lifetime include actual operating hours, ambient temperature, stability power supply, board assembly other handling practices. these factors outside control ZiLOG dramatically shorten lifetime device. failure rate each product process function time, temperature applied power. primary temperature course, product junction temperature. This externally influenced ambient temperature internally influenced power dissipated die. power dissipation, turn, function duty cycle applied VCC. case CMOS, product power dissipation also function operating frequency. ZiLOG product failure rates were derived from accelerated life test results accumulated ongoing basis part ZiLOG reliability monitor. accelerated life test reliability data includes both infant mortality (early life results 0-160 hours) long term life results (168-1000 hours). Various interim time points sample sizes used. Life test performed either 125°C 1000 hours equivalent 150°C hours.
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acceleration obtained when using high temperature life stressing, calculated various stress application temperatures using widely accepted Arrhenius equation follows: exp(-Ea(T1 T2)/k(T1)(T2)) Where Acceleration factor Activation energy (eV) Application junction temperature (°K) Stress junction temperature (°K) Boltzmann Constant 8.62 10-5 (eV/°K)
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Z85230VSC Rate Calculation acceleration obtained when using high temperature life stressing calculated various stress application temperatures using widely accepted Arrhenius equation follows: (-Ea (T1) (T2))) Where Acceleration factor Activation energy (eV) Application junction temperature (°K) Stress junction temperature (°K) Boltzmann Constant 8.62 10-5
Assume application 55C, stress 125°C 8.62 105. Consider typical CMOS product Z85230 operating with 100% duty cycle PLCC package. Then with this would give 330°K 400°K. (-.7(330 400) 8.62 (330) (400) 1000 hours life stress 125°C equivalent 75,000 hours system application operation 55°C. Failure Rate Estimation: Given High Temperature Operating Life stress results: Hours 0/76 0/837 0/10,759 1/6,152 0/7,520 0/22,470 0/38,258 0/61,646 0/12,992 0/8,394 Hours 0/76 0/760 1000 Hours 0/76 0/606
Z85230 Monitor 1994 Monitor 1995 Monitor 1996 Monitor 1997 Monitor 1998 Monitor 1999 Monitor 2000 Monitor 2001 Monitor 1H-2002
0/231 0/200
0/77 0/231 0/200
Failure Rate Estimations made assuming Poisson distribution using Chi2 density function assign confidence values estimate general population follows: Confidence Fails then Chi2 4.05
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Given reject from 29,527,680 device hours 125°C. Then using Chi2 this gives median failure rate 4.05/2 rejects 29,527,680 device hours 0.0686 rejects device hours. Failure rate 0.0686 dev. hrs. 68.6 dev. hrs. 68.6 68.6/75 55°C above) 109/1 124,471 years
Failure Rate MTBF
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TESTING METHODOLOGY ZiLOG unqualified commitment quality reliability and, part this commitment, ZiLOG strives provide best possible protection each products. Since 1983, ZiLOG ongoing electrostatic discharge development program monitor improve protection circuitry. During event, protection circuitry must absorb power pulse while allowing little damage occur internal circuitry chip. 3000 volt pulse induce transient currents approaching amp, management these transient currents that good protection. ZiLOG, protection circuits have been developed optimize handling pulse currents, paying close attention current flow patterns, minimizing current density crowding problems that cause damage circuitry. ZiLOG's products tested their immunity part routine internal qualification procedures. test hardware compliance with JEDEC JESD22-A1214B Human Body Model. LATCHUP TESTING METHODOLOGY ZiLOG unqualified commitment quality reliability and, part this commitment, also strives provide each products with best possible latchup protection. ZiLOG ongoing program monitor improve latchup protection circuitry. Latchup occur result either current injection (positive negative) supply over voltage. latchup action that parasitic SCR, converting from high-impedance state, impedance, regenerative, state. resulting current flow exceed design capabilities device. Damage occur interconnections (bond wires metallization) result thermal heating effects excessive current flow. During conditions, which lead latchup, device must able shunt triggering event (the positive negative injection current) without damage device. ZiLOG targeted minimum latchup requirement designs minimize risk latchup. addition, ZiLOG recommends that customer careful analysis system transients ensure that maximum undershoot overshoot applied potentials violated. Absolute maximum ratings are: voltage with respect 0.3V +7.0V voltages inputs with respect 0.3V. ZiLOG's products tested their latchup immunity part routine internal qualification procedures.
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CHAPTER Quality Monitor Systems
ZiLOG'S RELIABILITY SUMMARY ZiLOG's reliability program unique, that reliability testing takes place standard production material point assembly. Reliability testing been integrated into manufacturing process. This flow creates "Quick Reaction" reliability monitor, allows ZiLOG ensure integrity material prior shipment, gather trend analysis data internal corrective actions, maintain meaningful database customer review. tests currently employed under ZiLOG's quick reaction reliability monitor, include early life (burn-in), steam pressure pot, temperature cycle. Testing conditions included with attached test results. addition early life testing, long-term life test performed selected lots gather data. Test conditions calculations included with attached data. Following brief descriptions various reliability tests included this program: EARLY LIFE Early Life testing, also called burn-in, typically performed 125°C hours. dynamic static bias employed, depending device that being tested. Early Life test results expose process assembly defects. These results valuable measure given fabrication assembly process. LONG TERM LIFE Long Term Life testing generally performed 150°C hours 125°C 1000 hours. Either dynamic static bias used stress device appropriately. These test results used estimate field operation lifetime device. This data applied products manufactured using same fabrication process PRESSURE Pressure testing performed 121°C, PSIG, 100% relative humidity. This test evaluates ability plastic device withstand long-term effects humid environment. TEMPERATURE CYCLE Temperature Cycle testing performed -65°C 150°C temperature. This test uses air-to-air environment. 215°C cold temperature difference determines proper thermal expansion matching exists between materials used device manufacture. temperature cycle simulates thermal stresses device undergoes during power-up power-down events.
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CHAPTER Quality Monitor Systems
HIGHLY ACCELERATED STRESS TEST Highly Accelerated Stress Test (HAST) performed 141°C temperature Relative Humidity (RH) pressure with alternate bias. This test replaces traditional 85/85 test greatly reduces time taken evaluate ability plastic encapsulated device withstand long-term effects biased humid environment. PACKAGE INTEGRITY TEST Package Integrity testing ensures integrity surface mount devices terms package cracking, bonding craters, marked deterioration result heat application during soldering operation. This includes testing units each legs follows: CONTROL TEST 10-SECOND SOLDER DUNK 240°C 10-HOUR *PPT 10-SECOND SOLDER DUNK 240°C 10-HOUR *PPT 3-HOUR OVEN BAKE 150°C 10-SECOND SOLDER DUNK 240°C
TEST
(*PPT Pressure Testing 121°C, 100% ATM) End-points room temperature electrical test, visual inspection, mark permanency crater test.
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CHAPTER Quality Monitor Systems
Table Reliability Monitor Testing Requirements Test Conditions Temp cycle Product Tested Each type Frequency Monthly Allowable Rejects Test -65° 150°C 100, 500, 1000 cycles 168, 121°C, 100% A168 hrs, 125°C hrs, 150°C hours, 125°C 10-hr Pressure Pot, second solder dunk JESD22-A114B ZiLOG spec
Pressure
Package/Fab Process assembly process flow assembly process flow PLCC package Each revision device Each revision device pkg/fab process
Monthly
Burn-in Life test Package Integrity Latch-up CMOS HAST
Weekly Every Months Weekly
needed
Monthly
Solderability Solder thickness monitor Lead fatigue test
Each package type package type with solder Each package type
Monthly Weekly
NMOS hours CMOS hours 140°C, AMil Test Method
Weekly
ZiLOG spec
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CHAPTER Quality Monitor Systems
Table Early Life Test, HRS, 125°C NMOS PLASTIC Device Type Z0853008PSC Z0853006PSC Z0853008VSC Z0853006VSC Z0847006PSC Z0853008PSC Z0847006PSC Z0847006PSC Z0853008VSC AJ0086SA AJ1390APA BJ1734P BJOO86T AJ0462SPA AJ0086SA AJ0462SPA AJ0678PPA BJ12274Q Z08030LC Z08030LC Z08030LC Z08030LC Z08440JC Z08030LC Z08440JC Z08440JC Z08030LC PROCESS Z1493 Z1493 Z1493 Z1493 Z1495 Z1493 Z1495 Z1495 Z1493 FAIL NOTES
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CHAPTER Quality Monitor Systems
Table Early Life Test, HRS, 125°C CMOS PLASTIC Device Type
Z86C3312PECR2035 Z16C3220VSC00TR Z16C3220VSC00TR Z8018008VSC Z84C0010FEC Z8932320VECR50XPTR Z8F6403FT020SC EZ80F92AF020SC Z84C0010FEC Z8641708BSCR3212 Z84C1510FEC Z84C1510FEC Z8932320VECR50XPTR Z86E0208PSC1925 ZHX1810 Z84C0010FEC Z86E3016PSC Z86L8108SSCR528HTR Z84C0010FEC Z86C3312PECR2035 ZHX1010 Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z86L8108PSCR5101 Z86E3016PSC Z84C0010FEC Z86E3016PSC Z86E3016PSC Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z86L8108PSCR5101 Z86L8108PSCR5101 Z84C9008VED1380TR
BZ242HX0AC A018UW0RAXA B018UW0RB KZ230FLOS BZ222KT0XA B250NP0P AR61105.A5X KYR61001.7B BZ246BU0QA BYH1665B AZ239KROPX1 K239KROPD B52NP0P BZ243FY0F CITIZEN BZ246BU0AQB B239UW0B NZHCN3A.05C BZ222KT0XA BZ242HX0AC BZJ0349BB BZJ0347AAPB BZJ0349B BZJ0347AAP BZHCN00.1PB B239UW0B BZ222KT0XA NZ246AA0QA NZ246AA0QB BZJ0349B BZJ0349A E125BN0QBBB E125BN0QBBC BZHCN00.1PB NZHCN00.01P BZJ0347AAPF
Process
Fail Notes
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CHAPTER Quality Monitor Systems
Table Early Life Test, HRS, 125°C CMOS PLASTIC Device Type
Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z0221524VSCR50A5 Z86C3012PECR3495 Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z85C3008VSC EZ80F91NA050SC2058 Z84C9008VED1380TR Z8F0822PJ020EC Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR EZ80F91AZ050SC Z84C9008VEC EZ80F92AZ020SC Z8F6423FT020SC Z84C9008VED1380TR Z84C9008VED1380TR Z8018216FSC SZ86E3016PSC Z86E3016PSC Z8S18010VSC Z8S18033VSC Z86E0208PSC1925 Z8F4623FT020SC2071 Z8F6423FT020SC Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR Z84C9008VED1380TR
BZJ0347AAPG BZJ0161QAA BZJ0347AAQ BZJ0347AAPH BZJ0347AAP1 KZ237PZ0 BZJ1599AB BZJ1568SA BZJ1568PB BZJ1568PA AZJ1443APB R48057 BZJI568TB AR61271.0QA BZJ2359PAAF BZJ2359PABB BZJ2359PAAB BJZ2359PAB BZJ2359PAAAA BR48057.1AB BZJ1471 K1R46343.1V 61271 BZJ1990R BZJI1990RB KY246DF0Q NZ246AA0QA NZ246AA0QB BJ1451AP KJ0184AS BZ243FYOF R61339.R2 AR61212-7SP BZJ2865QBA BZJ2865QA BZJ2359PBBE BZJ2865QBA
Process
Fail Notes
Z86C30GA Z84C90EA Z84C90EA Z84C90EA Z85A30CA Z80F91AB Z84C90EA Z8F082AA Z84C90EA Z84C90EA Z84C90EA Z84C90EA Z84C90EA Z80F91AB Z84C90EA Z80F92AC Z8F642BA Z84C90EA Z84C90EA Z80182LA Z86E40DE Z86E40DE Z8S180PA Z8S180PA Z86E02AA Z8F642BA Z8F642BA Z84C90EA Z84C90EA Z84C90EA Z84C90EA
Z5126 Z4120 Z4120 Z4120 Z4120 0.35u Z4120 0.35um Flash Z4120 Z4120 Z4120 Z4120 Z4120 0.35u Z4120 0.35u 0.35um Flash Z4120 Z4120 Z6120 Z5220 Z5220 Z6120 Z6120 Z5220 0.35um Flash 0.35um Flash Z4120 Z4120 Z4120 Z4120
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CHAPTER Quality Monitor Systems
Table Long-Term Life Test, 150°C, 5V,184 CMOS PLASTIC Device Type Z16C3220VSC00TR Z16C3220VSC00TR Z8018008VSC Z84C1510FEC Z84C1510FEC Z84C0010FEC Z8641708BSCR3212 Z86D747PZ008SC2066 Process A018UW0RAXA B018UW0RB KZ230KFLOS AZ239KROPX1 K239KROPD BZ246BU0AQB BYH1665B EBMGSL9.A Z86D74AA Fail Notes
Table Long-Term Life Test, 125°C,1000 CMOS PLASTIC Device Type Z16C3220VSC00TR Z16C3220VSC00TR Z8018008VSC Z84C1510FEC Z84C1510FEC Z84C0010FEC Z8641708BSCR3212 Z86E0208PSC1925 Z8S18033VSC Z8S18010VSC Z86C3012PECR3495 Z8018216FSC A018UW0RAXA B018UW0RB KZ230KFLOS AZ239KROPX1 K239KROPD BZ246BU0AQB BYH1665B BZ243FY0F KJ0184AS BJ1451AP BZJ1599AB KY246DF0Q Process Fail Notes
Z86E02AA Z8S180PA Z8S180PA Z86C30GA Z80182LA
Z5220 Z6120 Z6120 Z5126 Z6120
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CHAPTER Quality Monitor Systems
Table Early Life Test Summary Technology 2003 CMOS 2003 NMOS CMOS 2003 Combined NMOS CMOS Plastic Plastic 18,212 Plastic Plastic 8306 Plastic 9,906 Package Type Rejects FITS (55°C,60%,0.7eV)
Table Long-Term Life Test Summary Technology 2003 CMOS 2003 CMOS 2003Combined CMOS 616,000 77,000 539,000
Device 125°C
Rejects
FITS (55°C,60%,0.7eV)
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CHAPTER Quality Monitor Systems
Table Pressure Test, 121°C, ACMOS PLASTIC
Device Type Z84C1516ASC Z84C1510FEC Z86L8108SSCR528HTR Z16C3220VSC00TR Z86L8108PSCR5101 Z84C0010FEC Z16C3220VSC00TR Z86L8108PSCR5101 Z86L8108SSCR528HTR Z84C0010FEC Z8018008VSC Z84C1510FEC Z84C1516ASC Z86L8108SSCR528HTR Z86L8108SSCR528HTR Z86L8108PSCR5101 Z84C1516ASC Z86E0208PSC1925 Z86L8108HSCR530K Z8F0822PJ020SC Z8PE003HZ010SC Z86C0812SECR50HHTR Z86C0812SECR50HHTR Z84C9008VEC Z8624312FECR5307 Z8018008VSC Z8F6403FT020SC Z8S18033VSC Z84C9008VSC Z16C3220FSC AZ239KROPX2 AZ239KROPX1 AZHCN3A.05A A018UEW0RAXA AZHCN00.01P BZ222KT0XA B018UW0RB BZHCN00.1PB BZHCN3A.05B BZ246BU0AQB KZ230FL0S K239KROPD K239KROPE NZHCN3A.05C NZHCN3A.05D NZHCN00.01P AZ239KROPX3 BZ243FY0F ALHFA2K.1QX R61207 AZ230BN0ARX NZJ0688AB NZJ0516BB BJ0160 BJZ0683B KZ242LR0X KR47212.1P KJ0184AS BZJ2866 A018UW0X1RA Rev. Process Z84C90EA Z4120 Z86243AA Z5126 Z80180FB Z4110 Z8F640BB 0.35um Flash Z8S180PA Z6120 Z84C90EA Z4120 Z16C32CB Z5120 Fail Notes
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CHAPTER Quality Monitor Systems
Table Temperature/Humidity Test, 85°C/85% CMOS PLASTIC
Device
Z8702414VSCR5133 Z8624312FECR5307 Z84C9008VEC Z8S18033VSC Z86C08121SECR50HHTR EZ80F93AZ020SC Z86D8608SSCR5345 Z85C3008VSC Z86L825H008SCR5312
BH0153DA BZJ0683B BJ0160 KJ0184AS NZJ0516BB EAER46343A BJ1203Q AZJ1443APB NLHFA65.02P
Process
Z87024HB Z86243AA Z84C90EA Z8S180PA Z86C08FC Z80F92AC Z86D73BB Z85A30CA Z86L88GB
Z5126 Z5126 Z4120 Z6120 Z5126 0.35 Z5222 Z4120 0.35um 3.3v
Fail Notes
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CHAPTER Quality Monitor Systems
Table Temperature Cycling Test, Condition -65°C 150°C CMOS PLASTIC
100X
Device Type Z8S18020VSC Z16C3220VSC00TR Z86L8108SSCR528HTR Z86L8108PSCR5101 Z84C1510FEC Z84C1516ASC Z84C1516ASC Z86L8808SSCR4590 Z84C0010FEC Z86E0208PSC1925 Z86E3012PSC Z86L9808HSCR52F4TR Z86L9808HSCR52F4TR Z16C3220VSC00TR Z84C0010FEC Z8018008VSC Z84C1510FEC Z84C1516ASC Z86C3616SSCR500V Z86L8108SSCR528HTR Z86L8108HSCR530K Z86L8108PSCR5101 Z8PE003HZ010SC Z86L990HZ008SCR52MH Z84C9008VEC Z9023306FSCR51J8 Z8624312FECR5307 Z86C0812SECR50HHTR Z86C0812SECR50HHTR Z849008VEC Z86L99OHZ008SCR52MH EZ80F91NA050SC2058 Z16C3220FSC Z8S18033VSC A222FN0AQ A018UW0RAXA AZHCN3A.05A AZHCN00.01P AZ239KROPX1 AZ239KROPX2 AZ239KROPX3 AHF508.0ABA BZ246BU0AQB BZ243FY0F B239UW0B BHCNQ5.00QB BZHCN3A.05B B018UW0RB BZ222KT0XA KZ230FL0S K239KROPD K239KROPE NZ247NU0Q NZHCN3A.05D ALHFA2K.1QX BZHCN00.1PB AZ230BN0ARX KHCT2M.01P BJ0160 BHCYG500A BZJ0683B NZ0516BB NZJO688AB BJ0160 KHCT2M.01P R48057 A018UW0X1RA KJ0184AS Z4120 0.35um Z5126 Z5126 Z5126 Z4120 0.75um 0.35u Z5120 Z6120 Process
500X
1000X
Fail Notes
Z84C90EA Z90233DA Z86243AA Z86C08FC Z86C08FC Z84C90EA Z86L99DC Z80F91AB Z16C32CB Z8S180PA
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CHAPTER Quality Monitor Systems
Table Highly Accelerated Stress Test (HAST), 140°C ACMOS PLASTIC Device Type
Z8F6403FT020SC Z0221524VSCR50A5 Z86D747PZ008SC2066 EZ80F91NA050SC2058
AR61105.A5X KZ237PZ0 EBMGSL9A R48057
Rev.
Process
Fail Notes
Z86D74AA Z80F91AB
0.5um 0.35u
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CHAPTER Quality Monitor Systems
Table Package Integrity Test CMOS PLASTIC Device Type
Z86K1505PSCR4530 Z16C3220VSC00TR Z86E3312SSC Z8S18033FSC Z84C1516ASC Z86L1608PSCR2566 Z8932320VECR50XPTR Z86L8108SSCR528HTR Z86L4308FSCR4367 Z86L9808HSCR52F4TR Z86C6516PSCR523P1 Z86L8108SSCR528HTR Z84C1510FEC Z8018008VSC Z86E6116PSC Z86L8808SSCR4590 Z8018010PSC Z8933220VECR50XPTR Z84C1510FEC Z8937320ASC Z86L8108PSCR5101 Z8612912SSC00TR Z8S18033FSC Z84C1516ASC Z86L990HZ008SCR52MH Z8624312PECR4095 Z85C3008VSC008TR Z86E3312SSC Z8S18020FSC Z84C1510AEC Z86C0412PSCR4195 Z8932320VECR50XPTR Z84C0010FEC Z86L8108HSCR530KTR Z86E3016PSC Z8622192SSC Z8S18003VSC Z86D1720ASC Z86E4412PSC Z86L1608SSCR2314TR Z8018110FEC
AZ238BUOBAA A018UW0RAXA AZ244BY0AAD A249FP0APB AZ239KROPX3 B234LL0AAP B248AW0 BZHCN3A.05B BZ248BH0B BHCNQT.00QB NZ250AB0P NZHCN3A.05C K239KROPD KZ230FLOS AZ246EXOPA AHF508.0ABA BZ238CK0Q B250NP0P BZ246BU0AQB B814CL8BA NZHCN00.01P NZ247HN0P K245SU0A K231KROPE KHCT2M.01P AZ250BL0APA AZ250AV0APA AZ240RX0QA AJ0182ARA AZ241CK0PB BJ0274AC B251CW0A BZ246BU0AQB BLFHA2K.01P NZ246AA0QA NZ247HL0B KZ44WY0A1 K050EG0 AZ243KP0APA AJ0436DPPA A250BH0APA
Rev.
Process
Fail Notes
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CHAPTER Quality Monitor Systems
Table Package Integrity Test CMOS PLASTIC Device Type
Z86L8108HSCR530K Z8E00110PEC Z8523010VSC Z864308SSCR50AF Z84C0008FEC Z86L0116ASC1937 Z86E5408HSC Z86E1016PSC Z8623312SECR4472 Z8F6403FT020SC Z84C9010ASC Z85C3008PSC Z8523008VSC Z8018006FSC Z84C1510AEC Z86L8108HSCR530K Z86E3312PSC Z8018008VEC Z86E4016FSC Z86E3016PSC Z86C0812SECR50HHTR Z8018033VSC Z8018233FSC Z803220ASC XZ861292PSC Z8018006VEC Z84C1510FEC Z86L8108HSCR530K Z8018006PSC Z8523010VSC Z8624312FECR5307 Z16C3010ASC Z86L8808SSCR52P2TR Z8018008VSC Z8F6403FT020SC EZ80F92AZ020HC Z86C6116PSCR3353 Z85C3008VSC Z86C0208SSCR3808 EZ80F93AZ020SC Z8618108HSCR530K
ALHFA2K.1QX B020BT0RP BZJ0657P BZ250PZ0B BZJ0634A BG2205PP BZ254RW0A NZ246AA0QA NZ250BS0 KR47212.1PK K250349P AZJ0716QXA AZJ0657XA AZJ0824SXA AZ241CK0PA ALHFA2K.1QX BZ245GX0AP BZJ0824Q BZJ0073AQ NZ246AA0QA NZJ0516BB K251JY0AU KJ0061 KH1579U AZJ1273PA AZ223ES0PA AZ242TU0PA AHFA2H.01PA BZJ1378QA BZJ0657P BZJ0638B BZ246DU0 NLHFGJF.2B KZ242LR0X KR47212.1PK K1R46343.1T AZ247AA0PB AZJ1443APB AZJ1213APPB EAE1R46343A ALHFGLY.01A
Rev.
Process
Fail Notes
Z86C61BC Z85A30CA Z86C04CA Z80F92AC Z86L96BBR530K
Z4126 Z4120 Z5126 0.35u 0.35u 3.3V
DC04-0001 Page Revision
CHAPTER Quality Monitor Systems
Table Package Integrity Test CMOS PLASTIC Device Type
Z86C3012PECR3495 Z8S18010VSC Z86D8608SSCR5345 Z86C6116FSCR526L Z86E0412HSC1903 Z86L8808SSCR52XA Z8S18033VSC Z8619340ASC Z85C3016VSC Z86E0412SEC Z8S18020FSC Z8F6422AR020SC Z80F0821HH020SC Z8E00010PSC Z84C9008VED1380TR Z84C2010FEC Z86C3312PSCR2370 Z86L8108SSCR536HTR Z86E5408HSC Z8038220ASC Z86D7308HSC Z85C3008VEC00TR Z86C8316SSCR4564 Z84C1506FEC Z84C1516ASC Z8F0821PH020EC Z9023306PSCR51N6 Z8S18020VEC Z86C1112FSCR508 Z80F91AZ050SC Z86D7308HSC Z86L8808PSCR51JW Z8S18033VSC Z16M1720ASC1868 Z85C3008VSC Z8623012SSC Z8018110FEC EZ80190AZ050EC Z86L8108HSCR535F Z8623312PSCR51XW Z88C0020VEC1977TR
BZJ1599AB BJ1451AP BJ1203Q BZJ1460AP B246ES0ABQ NYHFA65.O6B KJ0184AS K241AR0Q AZJ1675QA AJ2512APA AJ1848CAPA AR61212.7X0 AR61271.9AQ B020BT0PAA BZJ1568SB BZJ0397P N227AD0P ENLHFK12.4C NZ244DL0Q KH1580S KCJ1992AA AZJ0128QA AZ123PA AZJ1651RPA AZJ2864PA AR61271APA BHCE29.0MA BJ2555AR BFJ224 BR480571AB BJ27821NK KZHCNL0.0A8 KJ1473AP K245KT0R AZJ2362X1A AZJ2585RA AJ3264PA AM9U4E.02VQ ALHG17R.03A BZJ2849BA BFJ1569Q
Rev.
Z86C40GA Z8S180PA Z86D73BB Z86C61BCR526L Z86E05EB1986 Z86L88GB52XA Z8S180PA Z86193AB Z85A30CA Z86E08EA Z8S180PA Z8F642BA Z8F082BA Z8E001AD Z84C90EA Z84C20BA Z86C43AA Z86L96BBR536H Z86E02AA Z80382BB Z86D73BB Z85A30CA Z86C83AE4564 Z84C15EA Z84C15EA Z8F082BA Z90233DAR5233 Z8S180PA Z86C21GC Z80F91AB Z86D73BB Z86L88GBR51MK Z8S180PA Z16017BA Z85A30CA Z86230AA Z80181CA Z80190BB Z86L96BR535F Z86243AAR51XW Z88C00CB
Process
Z5126 Z6120 Z5222 Z4126 Z5220 0.35u 3.3V Z6120 Z6120 Z4120 Z5220 Z6120 TSMC 0.35um W/EmbFlash TSMC 0.35um W/EmbFlash Z5220 Z4120 Z3120 Z5126 0.35u 3.3V Z5220 Z36120 Z5222 Z4120 Z5127 Z4120 Z4120 TSMC 0.35um W/EmbFlash Z4120 Z6120 Z3120 .35u 2p4m EmbFlash Z5222 .35u 2p4m EmbFlash Z6120 Z5120 Z4120 Z5120 Z4120 0.35u 3.3V 0.35u 3.3V Z5126 Z4120
Fail Notes
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CHAPTER Quality Monitor Systems
Table Package Integrity Test CMOS PLASTIC Device Type
Z86L8108SSCR535H EZ80F91AZ050SC Z86D7308HSC Z86E0208SECR516FTR Z8619340ASC Z9010204PSCR3855 Z8623316SSCR50JU Z88C0020PSC Z84C9008VSC Z86L8608SSCR5367 Z86E146FZ016SC EZ80F91AZ050SC Z8PE002SZ010SC Z8623316SSCR50JU Z86D7308HSC
EBLHFY7M02 BRA1196.ARA KBJ2782 NJ0010AQA K2411AR0 AZJ4014X1A AZJ310X1A BFJ1569 BZJ2866 BLHG1G6.02R BHN1578BAP BR1196.1A5 N245NU0APB NJ3150 KBJ2782
Rev.
Z86L96BR535H Z80F91AB Z86D73BB Z86E02AA Z86193AB Z86227CA Z86243AAR50JU Z88C00CB Z84C90EA Z86L96BR5367 Z86E36AA Z80F91AB Z8E001BB Z86243AAR50JU Z86D73BB
Process
0.35u 3.3V .35u 2p4m EmbFlash Z5222 Z5220 .35u 2p4m EmbFlash Z4126 Z5126 Z4120 Z4120 0.35u 3.3V Z37220 .35u 2p4m EmbFlash Z5220 Z5126 Z5222
Fail Notes
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CHAPTER Quality Monitor Systems
Table C-Mode Scanning Acoustic Microscope Monitor CMOS PLASTIC Device Type
Z16C3220VSC00TR Z86L9808HSCR52F4TR Z84C0010FEC Z86L9808HSCR52F4TR Z84C0010FEC Z863312PSCR2130 Z16C3220VSC00TR Z84C1510FEC Z84C1516ASC Z84C15ASC Z8S18010VSC Z86L8108SSCR528HTR Z86L8108SSCR528HTR Z86C3616SSCR500V Z86L8108PSCR5101 Z86C3312PECR517F Z8018008VSC Z84C1510FEC Z84C1516ASC Z86E0208PSC1925 Z86L9808HSCR52F4TR Z86L9808HSCR52F4TR Z84C0010FEC Z16C3220VSC00TR Z86L8808SSCR4590 Z84C1516ASC Z86L990HZ008SCR52MH Z8018008VSC Z8019520FSC Z84C1510FEC Z84C1516ASC Z86L8108SSCR528HTR Z86L8108PSCR5101 Z84C1510FEC Z84C1516ASC Z84C1516ASC Z16C3220VSC Z86L8108SSCR528HTR Z86L8108SSCR528HTR Z84C1510FEC
B018UW0RB BHCNQ5.00Q BZ222KT0XA BHCNQ5.00QB BZ246BU0QA B220CD0AAA A018UW0RAXA AZ239KROPX1 AZ239KROPX3 AZ239KROPX2 A222FN0AQ NZHCN3A.05C NZHCN3A.05D NZ247NU0Q NZHCN0C.01P NY214GN0P KZ230FL0S K239KROPD K239KROPE B243FY0F BHCNQ5.00QB BHCNQ5.00QB BZ246BU0AQB B018UW0RB AHF508.0ABA AZ239KROPX3 KHCT2M.01P KZ230FL0S K232CN0A K239KROPD K239KROPE BXHCN3A.05B AZHCN00.01P AZ239KROPX1 AZ239KROPX2 AZ239KROPX3 A018UW0RAXA AZHCN3A.05A NZHCN3A.05C K239KROPD
Rev.
Process
Sample Selection Results
FRESH FRESH FRESH FRESH FRESH 1000X FRESH FRESH FRESH FRESH 100X FRESH FRESH FRESH FRESH 1000X FRESH FRESH FRESH FRESH REFLOW REFLOW FRESH 500X FRESH REFLOW 250X 500X 1000X 500X REFLOW 500X 500X 500X 500X 500X 1000X 500X 500X 500X 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10
DC04-0001 Page Revision
CHAPTER Quality Monitor Systems
Table C-Mode Scanning Acoustic Microscope Monitor CMOS PLASTIC Device Type Rev. Process Sample Selection Results
Z84C1516ASC K239KROPE 500X Z84C0010FEC BZ222KT0A 500X Z86L9808HSCR52F4TR BHCNQ5.00QB 500X Z86E0208PSC1925 BZ243FY03 500X Z84C0010FEC BZ246BU0AQB 1000X Z86L8108SSCR528HTR BZHCN3A.05B 1000X Z86E0208PSC1925 BZ243FY0F 1000X Z84C0010FEC BZ246BU0QA 500X Z84C0010FEC BZ222KT0RA 1000X Z86L8808SSCR54590 AH508.0ABA 500X Z86C1510FEC AZK239KROPX1 500X Z84C1516ASC AZK239KROPX3 1000X Z86L8808SSCR4590 AHF508.0ABA 1000X Z86C1516ASC AZK239KROPX2 1000X Z86L8108SSCR528HTR NZHCN3A.05D 500X Z86E3016PSC NZ246AA0QB FRESH Z86E3016PSC NZ246AA0QA FRESH Z86C3616SSCR500V NZ247NU0Q 1000X Z86E3016PSC NZ246AA0QB 500X Z86L8108SSCR528HTR NZHCN3A.05D 500X Z86L8108SSCR528HTR NZHCN3A.05C 1000X Z86L8108SSCR528HTR NZHCN3A.05B 1000X EZ80F91AZ050SC2050 KBYR61139 500X Z86C1510FEC K239KROPP 1000X Z84C1516ASC K239KROPE 1000X Z16C3220VSC00TR B018UWORB P/POT 0/22 Z84C9008VEC BJQ160 FRESH 0/22 Z8624312FECR5307 BZJ0683B FRESH 0/22 Z16C3010ASC BZ246DU0 FRESH 0/22 Z9023306FSCR51J8 BHCYG5.00A FRESH 0/22 Z8624312FECR5307 BZJ0683B REFLOW 0/22 Z16C3010ASC BZ246DU0 REFLOW 0/22 Z8018008VEC AZ223ES0PA FRESH 0/22 Z84C1510FEC AZ242TU0PA FRESH 0/22 Z84C1510FEC AZ241CKOPA FRESH 0/22 Z86L8108SSCR528HTR AZHCN3A.05A 1000X Z86L8108HSCR530K ALHFA2K.1QX 500X Z16C3220VSC00TR A018UW0RAXA 1000X 0/22 Z8018006VEC AZ222ES0PA REFLOW 0/22 Z8PE003HZ010SC AZ230BN0ARX 500X DC04-0001 Page Revision
CHAPTER Quality Monitor Systems
Table C-Mode Scanning Acoustic Microscope Monitor CMOS PLASTIC Device Type
Z84C1510FEC Z84C1510AEC Z86L8108HSCR530K Z86C0812SECR50HHTR Z86C0812SECR50HHTR Z8081233FSC Z8S18033VSC Z8038220ASC Z8038220ASC Z8018008VSC EZF92AZ020HC Z86F6403FT020SC Z0221524VSCR51JA Z8PE003HZ010SC Z86C0812SECR50HHTR Z86C0812SECR50HHTR Z8624312FECR5307 Z86D8608SSCR5345 Z8S18010VSC Z86C3012PECR3495 Z84C1510AEC Z86C6116PSCR3353 Z85C3008VSC Z86L8808SSCR52XA Z86C0812SECR50HHTR Z86C0812SECR50HHTR Z8F1602AR020EC Z8S18033VSC Z8F3202VSC020SC Z86E0412HSC1903 Z84C3010FEC Z84C2010FEC Z8673312PSC Z86C0208SSCR3808 Z86L8108HSCR530K Z86L8808PSCR51JW Z86L8808SSCR52XA Z8S18033VSC
AZ246TUOPA AZ241CKOPA ALHFA2K.1QX NZJ0688AB NZJ0516BB KJ0061 K251JY0AU KHI579U KH15794 K2242LR0Q K1R46343.1T KR47212.1P KA227EU8AB AZ230BN0ARX NZJ0516BB NZJ0516BA BZJ0683BB BJ1203Q BJ1451AP BJZ519UAB AZJ1285RA AZ247AA0PB AZJJK143APB NYHFA65.06B NZJ0688AB NZJ0516BB KR47212.1PT KJ0184AS BR47456.1AW B246ES0ABQ BZJ0671V BZJ0397P BJ1420AQB AZJ1213APPB ALHFGLY.01A NHFC29.00P NYHFA65.06B KJ0184AS
Rev.
Process
Sample Selection Results
REFLOW REFLOW 1000XTC 250XTC 250XTC FRESH FRESH FRESH REFLOW FRESH FRESH FRESH 1000X 1000X 500X 500X 1000XTC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 100XTC FRESH SAMPLES 1000XTC 1000XTC FRESH SAMPLES FRESH SAMPLES 100XTC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500XTC 500XTC 0/22. 0/22 0/15 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/10
Z86243AA Z86D73BB Z8S180PA Z86C40GA Z84C15EA Z86C61BC Z85A30CA Z86L88GB52XA Z86C08FSCR51R2 Z86C08FSCR51R2 Z8F640BB Z8S180PA Z8F640BB Z86E05EB1986 Z84C30CA Z84C20BA Z86E44AD Z86C04CA Z86L96BBR530K Z86L88GBR51MK Z86L88GB52XA Z8S180PA
Z5126 Z5222 Z6120 Z5126 Z4120 Z4126 Z4120 0.35u 3.3V Z5126 Z5126 TSMC 0.35 Flash Z6120 TSMC 0.35 Flash Z5220 Z3120 Z3120 Z5220 Z5126 0.35u 3.3V .35u 2p4m EmbFlash 0.35u 3.3V Z6120
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CHAPTER Quality Monitor Systems
Table C-Mode Scanning Acoustic Microscope Monitor CMOS PLASTIC Device Type
Z86D747PZ008SC2066 Z88C0020PSC Z8F3202VSC020SC Z84C3010FEC Z84C2010FEC Z86E0812PSC1866 Z0853008VSC Z8E00010PSC EZ80F91NA050SC2058 Z8F0822PJ020SC2055 Z9023306PSCR51N6 Z86D747PZ008SC2066 Z16C3220FSC Z0847006PSC Z86E144PZ016EC Z86C0208PECR4497 Z86C3312PSCR2370 Z8E00110HSCR3912 Z8S18033VSC Z8F2401PM020SC Z8018216FSC Z8F1602AR020EC Z8038220ASC Z8624312FECR5307 EZ80F91NA050SC2058 Z16C3010VEC Z8624312FECR5307 Z9023306PSCR51N6 Z8E00010PSC Z86D7308HSC Z84C1506FEC Z86C3616SSCR5356 Z86C0208PECR4497 Z84C1510AEC Z80189533ASC Z8F1602AR020EC
EBMGSL9.A B224BU0AP BR47456.1AW BZJ0671V BZJ0397P BJ2315AA BJ2274Q B020BT0PAA R48057 R61271.1 BHCE29.0MA EBMGSL9A A018UW0X1RA AJ0462SPA AH1574BPPC AZJ1741APAB N227AD0P N020BS0PA KJ0184AS KAR472131AR KY246DF0Q KR47212.1PT KH1580S BZJ0683B B48057 BZ247RZ0 BZJ0683B BHCE29.0MA B020BT0PAA BJ127831NK AZ2165RPA TSR3350 AZJ1741APAB AZJ1285RA KJ0568A KR47212.1PT
Rev.
Z86D74AA Z88C00CB Z8F640BB Z84C30CA Z84C20BA Z86E08DD Z08030LC Z8E001AD Z80F91AB Z8F082AA Z90233DAR5233 Z86D74AA Z16C32CB Z08440JC Z86E36AA Z86C04CAR51XC Z86C43AA Z8E001AD Z8S180PA Z8F640BB Z80182LA Z8F640BB Z80382BB Z86243AA Z80F91AB Z16C30FA Z86243AA Z90233DAR5233 Z8E001AD Z86D73BB Z84C15EA Z86C36CAR5356 Z86C04CAR51XC Z84C15EA Z80189BA Z8F640BB
Process
Z4120 TSMC 0.35 Flash Z3120 Z3120 Z5220 Z1493 Z5220 .35u 2p4m EmbFlash, TSMC 0.35 Flash Z4120 Z5120 Z1495 Z37220 Z5126 Z5126 Z5220 Z6120 TSMC 0.35 Flash Z6120 TSMC 0.35 Flash Z36120 Z5126 .35u 2p4m EmbFlash, Z3120 Z5126 Z4120 Z5220 Z5222 Z4120 Z6120 Z5126 Z4120 Z36120 TSMC 0.35
Sample Selection Results
100XTC FRESH SAMPLES 1000XTC 1000XTC 1000XTC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 1000XTC FRESH SAMPLES 1000XTC 1000XTC FRESH SAMPLES FRESH SAMPLES 500XTC FRESH SAMPLES FRESH SAMPLES 1000XTC 1000XTC 1000XTC 500XTC FRESH SAMPLES FRESH SAMPLES 1000XTC FRESH SAMPLES CONVECTION REFLOW 500XTC 500XTC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 1000XTC 1000XTC FRESH SAMPLES 1000XTC
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CHAPTER Quality Monitor Systems
Table C-Mode Scanning Acoustic Microscope Monitor CMOS PLASTIC Device Type
Z86E0412HSC1903 Z86C3012PECR3495 Z8S18010VSC Z8624312FECR5307 Z8916620VSC1900TR Z86C0208SSCR3808 Z86C6116PSCR3353 Z85C3008VSC Z84C1506FEC Z88C0020PSC Z84C9010VSC Z84C9010VSC Z86C3012PECR3495 Z86E0412HSC1903 Z8S18010VSC Z84C9008VSC Z88C0020PSC Z86C6116PSCR3353 Z86C0208SSCR3808 EZ80F93AZ020SC Z86D7308HSC Z85C3008VSC
B246ES0ABQ BZJ1599AB BJ1451AP BZJ0683B AJ1596C1D1NK AZJ1213APPB AZ247AADPB AZJ1443APB AZJ2165RPA B224BWOAP B224BW0AP 347L0063 BZJ1599AB B246ES0ABQ BJ145AP BZJ2866 B224BU0AP AZ247AA0PB AZJ12113APPB EAE1R46343A KBJ2782 AZJ1443APB
Rev.
Z86E05EB1986 Z86C40GA Z8S180PA Z86243AA Z89165ADR52N5 Z86C04CA Z86C61BC Z85A30CA Z84C15EA Z88C00CB Z84C90EA Z84C90EA Z86C40GA Z86E05EB1986 Z8S180PA Z84C90EA Z88C00CB Z86C61BC Z86C04CA Z80F92AC Z86D73BB Z85A30CA Flash Z5220 Z5126 Z6120 Z5126
Process
Sample Selection Results
500XTC 500XTC 500XTC CONVECTION REFLOW FRESH SAMPLES 500XTC 500XTC 500XTC 500XTC 500XTC 500XTC FRESH SAMPLES 1000XTC 1000XTC 1000XTC PKG. INT. (LEG 1000XTC 1000XTC 1000XTC 1000XTC 100XTC 1000XTC
Z5121 Z5126 Z4126 Z4120 Z4120 Z4120 Z4120 Z4120 Z5126 Z5220 Z6120 Z4120 Z4120 Z4126 Z5126 0.35u Z5222 Z4120
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CHAPTER Assembly Test Information
CHAPTER Assembly Test Information
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CHAPTER Assembly Test Information
Assembly Test Information
Package types: 132/ Technology Data: attach (method/composition) Wirebond (type/material) Bonding wires (material/diameter) Package seal Lead finish Leadframe material/plating Leadframe plating thickness Moisture Sensitivity Level Surface Mount Devices
Plastic Dual In-line Package (PDIP) Shrink Dual In-line Package (SDIP) Plastic-Leaded Chip Carrier (PLCC) Quad Flat Pack (QFP) Very Small Quad Flat Pack (VQFP) Thin Quad Flat Pack (TQFP) Small Outline Integrated Circuit (SOIC) Shrink Small Outline Package (SSOP) Ball Grid Array (BGA)
Oven cure/silver filled epoxy Ball bond, thermosonic/gold aluminum Crescent bond, thermosonic/gold silver plated frame Gold Transfer epoxy molding Solder plate Pure (Green Product) Copper (A151) spot plate PLCC Copper (A194)/Ag spot plate PDIP, SDIP, SOIC SSOP Copper (A7025)/Ag spot plate VQFP spot 150-400 microinches PLCC, QFP, LQFP TQFP: Floor Life hrs. 30°C/60%
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CHAPTER Assembly Test Information
Pre/Post Packaging Device Test Procedures: Type Testers Provision Testing Speed Provision high temp testing Provisions tape reel shipment devices Provisions tray shipment devices Sentry 15/20/21, Megatest, ITS9000, Teradyne J750 Environmental handlers
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CHAPTER Assembly Test Information PLASTICS PROCESS FLOW Legend:
Material Transport Process
Bank acceptance Inspection/Test
Flow Process/Item Wafer Bank Pack/transport Subcon Subcon Assembly Pack/transport ZEPI Incoming Inspection Subcontract ZilOG Products Electrical Test <For Stress Test Flow only> Burn-In (48hrs specified PSI)/ 100% Electrical Test Room
REJECT
Document
SOM-040 SOM-005
SOM-005 QCM-235
TSM-021
TSM-012/ TSM-021 QCM-108
Electrical Test Gate
Outgoing Shipping Gate
Final Visual Inspection (For visual reject) Finished Goods Bake (for VQFP/QFP/TQFP) Tape Reel required PSI) Pack Shipping Audit Ship
MAM-235
MAM-212 MAM-236 MAM-067 QCM-301 QCM-301
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CHAPTER Assembly Test Information
PLASTIC-STANDARD ASSEMBLY/TEST PROCESS
PLASTIC STANDARD FLOW) BANK WAFER EPOXY ATTACH WIREBOND MOLD STRIPMARK SOLDER PLATE BAKEOUT (FOR PLCC) TRIM/FORM 100% ELECTRICAL TEST SAMPLE ELECTRICAL PRESHIP INSPECTION BAKEOUT QFP/VQFP TAPE REEL (OPTIONAL SOIC, PLCC) PACK
PLASTIC STRESSED FLOW) BANK WAFER EPOXY ATTACH WIREBOND MOLD STRIPMARK SOLDER PLATE BAKEOUT (FOR PLCC) TRIM/FORM 100% ELECTRICAL TEST BURN-IN HOURS 100% ELECTRICAL TEST ROOM PRESHIP INSPECTION BAKEOUT QFP/VQFP TRAY TAPE REEL (OPTIONAL PLCC, QFP, SOIC) PACK
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CHAPTER Assembly Test Information
Handling Storage Surface Mount Devices Handling Components should handled with vacuum pick ensure that coplanarity leads maintained.
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CHAPTER Assembly Test Information
Lead Protection Avoid sliding units with leads contact. solder coating prone contamination/scraping. sliding cannot avoided, contact surface should clean smooth.
Protection Observe protection times. These static sensitive devices.
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CHAPTER Assembly Test Information
Storage/Unpacking Caution plastic body surface mount product subjected high temperatures during printed circuit board assembly operation. moisture that present plastic expand damage unit. Therefore, very important that surface mount before printed circuit board operation begins. ZiLOG assures that unit thoroughly before final packing shipment. units shipped "dry pack" envelope designed keep moisture away from IC's. user should carefully observe following practices assure that units remain moisture free time printed circuit board soldering operation: open pack until ready solder. Product exposed ambient conditions 30C/60%RH less) more than hours. This corresponds moisture sensitivity level Unopened packs stored <40oC/90% When pack must opened short period time (such incoming inspection) should resealed soon possible, ensuring that desiccant remains inside pack. Resealing should done with heat seal best closure bag. units have been exposed more than hours ambient conditions 30C/60%RH(or less) humidity indicator card shows humidity above 20%, devices should baked hours 125oC, before board soldering.
Soldering Recommended surface mount profile standard tin/lead solder plate follows: Maximum 3oC/sec. ramp Maximum 220oC peak temp. Minimum min. cool down from peak temp. 50oC. Please refer Lead-Free products www.zilog.com lead-free soldering recommendations. Desoldering Parts removed board assembly problems suspected failure. boxed-in type desoldering fixture used, following recommended operating parameters: Package Temp: 220oC max. Dwell Time: min. max.
important that above precautions followed ensure integrity packages.
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CHAPTER Assembly Test Information
THERMAL CHARACTERISTICS Calculation Device Junction Temperature Failure rates Failures Time (FITS) obtained from life test data based ambient temperatures (TA), corrected junction temperature (TJ). However, when significant difference between exists, incorporated into Arrhenius Equation accelerated failure rates using following equations: Junction Temp. (TJ): where: (JA) (PD) thermal resistance junction with respect ambient (C/W). maximum power dissipation watts ambient temperature (JC) (PD)
and:
Case Temperature (TC): where: Illustration:
thermal resistance junction with respect case. order calculate junction temperature (TJ) case temperature (TC) static airflow Z86C04 PDIP, following:
25°C, maximum power dissipation this device 0.08 watts. example, ambient temperature denoted assumed 25°C.
Z86C04 plastic (copper); 18°C/watt respectively. Therefore, (0.08) 31.2°C, 31.2 0.08) 29.8°C
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CHAPTER Assembly Test Information
Table 1-1. Device Table Summary Thermal Characteristics ZiLOG Plastic Packages Package Type PDIP PLCC 100L VQFP 100L SOIC SSOP SSOP Package Code
Lead Frame
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CHAPTER Assembly Test Information
Table 1-2. Device Table Summary Thermal Resistance Hermetic Packages PBGA 144L 256L 256L Layer Layer Layer
Notes:
P=Plastic V=PLCC-Plastic Leaded Chip Carrier F=QFP-Plastic Quad Flat Pack A=VQFP-Very Small Quad Flat Pack S=SOIC-Small Outline Integrated Circuit B=PBGA-Plastic Ball Grid Array HZ=SSOP-Shrink Small Outline Package HT=EPT SSOP-Exposed Thin SSOP
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CHAPTER Quality Systems
CHAPTER Quality Systems
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CHAPTER Quality Systems
Quality Systems
QUALITY SYSTEMS Organization: Quality control departments located plants Equipment: Nampa Manila conduct failed material analysis including decapsulation, SEM, microprobe, Emission microscope, X-Ray, EDX, cross-section Sonoscan acoustic microscope. Table complete list test equipment.
SUBCONTRACTING: 100% assembly subcontracted. TRACEABILITY: There complete traceability product date code back through assembly process wafer manufacturing process starting material. AVAILABILITY DOCUMENTATION MONITORING: Documents available either hard copy electronic form (SOP0937). QUALITY DATA: Data availability: Outgoing quality measured quality control acceptance/rejection data each production which reported basis. TESTING (QA/Operating) Test program release procedure: ZiLOG formal test program review/release procedure, Procedures SOP1239. Does sample test? Yes. Lots sampled using statistically valid sampling plan. sample fails, entire re-tested second sample drawn.
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CHAPTER Quality Systems
datasheet tested guaranteed? ZiLOG provides product specifications customer document called data sheet (SOP0302). product specification describes attributes that ZiLOG warrants. product tested full temperature range? product 100% electrically tested prior Does pull samples both Testing? propagation delay tested (e.g., simultaneous switching effect): Simultaneous Fault coverage (Operating QA): close 100% practical Coplanarity requirement SMD: mils maximum; reference seating plane Define failure: Does meet specifications
TEST TAPE SUPPORT: Test tapes, load boards documentation available WHAT HAPPENS WHEN FAILURES OCCUR? sample truncated? Corrective action plan: Plant sample failure analysis overviewed R/QA product segregated (i.e., there protection from mixing)? Automatic binning during electrical test used segregate product. Product traceability customer order maintained unique part numbering system (SOP0937 SOP0902)
WHEN MANUFACTURING PERFORMED OFFSHORE, WHAT CONTROLS?: Same onshore; Manila plant monitored through Inventory Activity Yield (IAY) data collection system Director Quality Assurance Reliability contemporaneous basis, Nampa plant. Reporting continuous. Periodic audits performed offshore facilities ZiLOG personnel. AVAILABILITY PROGRAMMING FACILITIES: ZiLOG develops test programs with facilities located Manila, Jose, Nampa,
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CHAPTER Quality Systems
AUDIT: Availability audit reports: Serialized sheets audit checklists maintained Quality Control organization.
STATISTICAL PROCESS CONTROL SCOPE: major manufacturing processes under control Process stability capability analyses reported monthly. corporate-wide specification defines scope program provides detailed instructions implementing operation. also defines frequency evaluation control limits, training requirements, responsibilities (SOP0918) CONTROL CHARTS: ZiLOG (Nampa) uses 8-Point Zone Control Chart. Zone Control Chart easily adapted nonstandard distributions. Technicians certified Zone Control Chart. Control limits out-of-control action plans written into process specifications. Control limits changed process improvements implemented. DESIGN EXPERIMENTS: processes require rigorous qualification through more Statistical Design Experiments (SDE). Research ongoing improve traditional methodology.
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CHAPTER Quality Systems
DOCUMENT CONTROL SYSTEM ZiLOG's Document Control Department promotes reliability quality through efficient, global document management revision control systems. Document Control Department maintains electronic document management system that accessible ZiLOG employees worldwide hours day. Manufacturing documents available electronically wafer foundry assembly subcontractors. system automatically manages revision control; ensuring users have most upto-date version every time. Corporate Document Control Jose, California, oversees worldwide document management processes revision controlled documents. They also responsible managing design, engineering marketing documents records well company-wide policies procedures. Document Control departments Nampa, Idaho, Manila, Philippines, manage manufacturing, assembly test procedures specifications. Additional details regarding sections contained this document found ZiLOG policies, procedures specifications. General categories listed below. Please contact ZiLOG Director Quality Reliability with specific questions. Corporate-Wide Policies Standard Operating Procedures Business Units, Corporate Communications, Finance, Human Resources, Information Technology, Legal, Operations, Reliability Sales, Strategy, Technology, Design Test Core Process Documents Phases Product Life Cycle Product Process Specific Manufacturing, Assembly Test Procedures Specifications
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CHAPTER Quality Systems
Flow Chart Input Product Demand
Wafer ZiLOG, Nampa,
Wafer Foundry
Wafer Probe ZiLOG, Manila,
Wafer Probe Subcontractor
Assembly Subcontractor
Final Test ZEPI
Final Test
Subcontractor
Ship Customer
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CHAPTER Quality Systems
Fabrication Typical Process
Thickness Barrier Oxidation Silicon Nitride Deposition N-Well Mask Mask Field Implant Poly Mask Implant Mask Source Drain Reoxidation Contact Mask Metal-I Mask Spin Glass Final Inspect Mask Metal Mask Mask Mask Particulate Thickness/ Uniformity Critical Dimension Concentration Etch Rate
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CHAPTER Quality Reliability Glossary
CHAPTER Quality Reliability Glossary
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CHAPTER Quality Reliability Glossary
Quality Reliability Glossary
TERM Accelerated Life Test:
DEFINITION Symbol Angstrom, which equals 10-10 meters (one ten-billionth meter). life test, which applied stress level exceeds that needed actual order shorten time required observe failure. good accelerated test should alter basic modes and/or mechanisms failure. ratio times needed obtain same failure rates under different sets stress conditions involving same failure modes mechanisms. energy level needed activate specific failure mechanism. Auger Electron Spectroscopy typically used interlayer dielectrics passivation films. operation exposing resist covered wafer projection printer. Atmospheric Pressure Chemical Vapor Deposition. method deposition glass used interlayer passivation dielectric. Application Specific Standard Product. Acceptable Quality Level. Generally, percent confidence that material stated will pass sample inspection. connecting package leads specified locations chip fine wire. Exposed aluminum pads chip which wires from package lead frame bonded during assembly. operation device prior application, elevated temperature and/or voltage specific period time. purpose stabilize device characteristics, identify early failures, eliminate devices subject infant mortality excessive parametric drift. Boron doped Phosphosilicate Glass.
Acceleration Factor:
Activation Energy (Ae): AES: Align: APCVD: ASSP: AQL: Bonding: Bond Pads: Burn-In:
BPSG:
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CHAPTER Quality Reliability Glossary
TERM CFA: CMOS: Confidence: Check: Chip:
DEFINITION Critical Dimension. Customer Failure Analysis/Correlation Request. Certificate Conformance. Complementary technology combining transistors same product. Advantages include power dissipation. specialized statistical term which refers probability statement being true. visual check done conclusion (dry wet) masking step. square wafer containing single integrated circuit. substrate which active passive components circuit fabricated; also called die. room chip fabrication plant which wafers processed. This area features controlled environment with filtered that eliminates essentially dust dirt. connection between conductive layers, e.g., metal-to-silicon contact. statistically defined limit which determines whether process changed significantly compared past history. measure statistical process control. C-Mode Scanning Acoustic Microscope which examines packaged units produces high resolution, ultrasonic images. Chemical Vapor Deposition thin films. Gaseous reactants brought together over silicon wafer, depositing required layers typically used interlayer dielectrics passivation films. Document Control. Defense Electronic Supply Center. Deionized water. Dual-in-Line Package. Design Rule Check. Device Under Test. MOSFET with permanently "on" channel; requires negative applied gate voltage turn (see "enhancement transistor").
Clean Room:
Contact: Control limit:
C-SAM: CVD:
DESC: DIP: DRC: DUT: Depletion transistor:
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CHAPTER Quality Reliability Glossary
TERM Develop:
DEFINITION chemical process that solidifies photoresist where been exposed removes elsewhere (for negative resist) vice versa (for positive resist). visual check following masking verify proper resist patterning before etch, e.g., alignment thickness checked. single integrated circuit separated from wafer which made; also called chip. process doping silicon diffusing impurities from surface into wafer high temperature. region silicon substrate doped diffusion implant (e.g., source drain diffusions). impurity intentionally introduced into silicon control electronic behavior (e.g., Boron, Arsenic, Phosphorus). implant, measure amount dopant implanted; usually expressed ions square centimeter. highly doped region adjacent transistor currently carrying channel. carries electrons transistor next circuit element conductor. process segment where photoresist spun onto wafer, soft baked, exposed, developed obtain desired pattern ready etch implant (see "wet masking"). Energy Dispersive X-ray analysis. Normally uses electron beam excitation scanning electron microscope. Electrical overstress, common application failure mechanism. Electrostatic discharge, common handling failure mechanism. MOSFET with normally "off" channel; requires positive applied gate voltage turn (see "depletion transistor"). rate which given layer etched given standard acid solution, expressed Deposition technique Aluminum, Gold, Chromium thin films. Expose photoresist-coated wafer light through mask. Field Application Engineer. Measurement assembled device performance. Products categorized speed/power/performance criteria.
Develop inspect: Die: Diffusion:
Dopant: Dose: Drain:
Masking:
EDX: EOS: ESD: Enhancement transistor: Etch rate: Evaporation: Expose: FAE: Final Test:
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CHAPTER Quality Reliability Glossary
TERM FIT: FPO: FQE: Gate: Gate oxide: Generic:
DEFINITION "Failure units" "Failure Time," measure failure rate defined failure 109, billion device hours. Finish Process Order. traveler that accompanies each through finish (Mark Pack FQA) areas. Field Quality Engineer. gate transistor. Dielectric oxide between gate channel region transistor. Devices similar process function. ZiLOG uses generic approach Reliability Program. Devices built same wafer process having similar complexity function grouped into "generic" product family. Data device within family considered indicative performance other devices that group process line. Trapping contamination atoms (especially alkali ions) prevent their drift into device regions where they affect electrical performance. amorphous form SiO2, used various insulating layers wafer. step following masking, where resist heated prepare etch. Highly Accelerated Stress Test. High Temperature Operating Life. Integrated Circuit. Initial failure rate life studies. followed early failure period then final wear period failure (bathtub curve). Incoming Quality Control. Kilo, thousand, 103. magnified, physical representation electronic circuit transistor level. Leadless Chip Carrier. external connection packaged integrated circuit. test purpose estimating some characteristic(s) device's useful lifetime. Large Scale Integration
Gettering:
Glass: Hard Bake: HAST: HTOL: Infant Mortality: IQC: Layout: LCC: Lead: Life Test: LSI:
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CHAPTER Quality Reliability Glossary
TERM LPCVD: glass:
DEFINITION Pressure Chemical Vapor Deposition. Typical method deposition glass used interlayer passivation dielectric. Temperature Oxide glass used interlayer passivation dielectric. Typically deposited same temperature APCVD deposited glasses used passivation, pressure. Tolerance Percent Defective. sample plan that will reject percent lots equal worse than stated LTPD value. pattern usually "printed" glass, used define areas chip wafer production purposes. lithography portion process physical area where lithography occurs. Million electron Volts. Milli electron Volts. Manufacturing. 0.001 inch. Military. Nampa Fabrication Module. Metal Oxide Semiconductor integrated circuit technology. Material Review Board. Mean Time Between Failures. Mean Time Fail. Time percent Cumulative Fail. 10-9. resist material which unexposed areas developed away. National Institute Standards Technology. Silicon Nitride, Si3N4. channel technology. Nanometer (1nm 10-9 meters). Nanoseconds (10-9 seconds). Original Equipment Manufacturer. Time Programmable Product sold plastic packaging. window provided erasure. process whereby thick oxide islands grown between active device regions better isolation performance.
LTPD: Mask: Masking: MeV: meV: MFG: Mil: MIL: Mod: MOS: MRB: MTBF: MTTF: Nano: Negative photoresist: NIST: Nitride: NMOS: OEM: OTP: "Oxi":
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CHAPTER Quality Reliability Glossary
TERM Oxynitride: PDIP: PECVD: PGA: PLCC: POA: PPM: PPOT: PROM: PSG: Package: Photolithography: Photomask:
DEFINITION plasma deposited passivation interlayer dielectric film consisting silicon, oxygen, nitrogen. Phosphorous. Plastic Dual In-Line Package. Product Engineer. Plasma Enhanced Chemical Vapor Deposition. Grid Array (package). Plastic Leaded Chip Carriers. Procedural Manual that contains ZiLOG's policies procedures. Point Acceptance. Quality Data, Parts Million defective; 1000 percent defective. Pressure Pot. Programmable Read Only Memory. Phosphosilicate Glass. glass containing phosphorus form P205). LTO, Pyrox Pyroglass types PSG. container used hold active semiconductor device. portion process involving light sensitive photoresist material layer definition. patterned chrome glass photographic plate used transfer pattern photo-resist masking. process segment involving patterning given layer photomask. light sensitive polymer material that used mask etching implant steps. also Negative Positive Photoresist. process using transformed field into reactive plasma. Deposition thin films using gaseous reactants presence plasma lower temperatures. etching process using transformed field into reactive plasma. Polycrystalline silicon made many tiny crystals opposed single crystal silicon.
Photoresist: Plasma ash: Plasma deposition: Plasma etch: Poly:
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CHAPTER Quality Reliability Glossary
TERM Poly Re-ox: Positive photoresist: Prebake: Probe: Process Templating:
DEFINITION Oxidation poly after been defined. re-ox provides interpoly di-electric double (two layer) poly process. photosensitive organic polymer material which exposed areas developed away. First step masking, which wafers dried oven prior resist application. first electrical test processed wafers. profile displayed process evaluation parameters, which automatically recorded from test patterns wafers they proceed through production line. machine that projects photomask onto resist-coated wafer. mask same size wafer imaged wafer. type phosphosilicate glass containing approximately Phosphorous. Quality Assurance. Quality Engineer. Product Process Qualification Report (XXXX report number). Rutherford Back Scattering. method non-destructive depth profile analysis thin films back scattering high-energy helium ions. Reliability Engineer. Residual Analysis. Quad Flat Package. Quality Improvement Process. Quality Reliability. Relative Humidity. Reactive Etch. Return Material Authorization. Read Only Memory. basic physical property which determines extent light bending (refraction) upon entering surface. Used thin film process control indirect measure chemistry. Photoresist.
Projection Aligner:
Pyrox: QR-XXXX: RBS:
RGA: QFP: QIP: Q&R: RIE: RMA: ROM: Refractive Index:
Resist:
DC04-0001 Page Revision
CHAPTER Quality Reliability Glossary
TERM SDE: SEM:
DEFINITION Statistical Design Experiments. Scanning Electron Microscope. microscope which makes scanning beam electrons image detail less than 100A size (surface only). Secondary Mass Spectroscopy. Special Lot. ZiLOG identification used identify products designed unique customer requirements. Statistical Process Control. Ship-to-Stock. Eliminates need customer IQC. Metallic element which forms substrate most semiconductor devices. step preparing freshly spun photoresist exposure baking oven remove excess solvent). Small Outline Integrated Circuit package. Equivalent drain transistor with exception that electrons leave source into channel active device. Absolute acceptable limit process parameter. process step which coats spinning wafer with liquid photoresist dispensing liquid onto center. Deposition metal layer bombarding metal target with heavy ions from gaseous (e.g., argon) plasma. Metal atoms removed from target deposited onto wafer during this process. Technology Development. Time Dependent Dielectric Breakdown. Transmission Electron Microscope. microscope used obtain high-resolution images with transmitted electron beam electron lens imaging rather than scanning. Temperature Humidity Bias (85°C/85% RH). Thin small outline package. Special electrical test structures included production device wafers monitoring critical parameters. high quality SiO2 layer grown oxidizing silicon furnace opposed externally deposited glass). Underwriters Laboratory.
SIMS: SL-Lot: SPC: STS: Silicon: Soft bake: SOIC: Source: Spec. Limit: Spin: Sputtering:
TDDB: TEM:
THB: TSOP: Test patterns: Thermal oxide:
DC04-0001 Page Revision
CHAPTER Quality Reliability Glossary
TERM V/I: Visual: VLSI: VQFP: Wafer:
DEFINITION Ultra Violet. monitor measuring voltage current between probes applied semiconductor layer. Measures layer resistivity. check process quality examination wafers under light microscope. Very Large Scale Integration. Very small Quad Flat Pack package. Transistor threshold voltage. Voltage which transistor turns thin piece silicon sliced from cylinder shaped crystal. polished that surface like mirror. most commonly found 6-inch diameters. wafer base material most world's integrated circuits. flat area ground onto original silicon ingot from which wafers sliced. Gives crystallographic orientation.
Wafer flat:
Waterfall Guardbanding: technique testing circuit different levels manufacturing process, insure above marginal product performance compliance. masking: Process segment following "dry masking" which wafer, covered with resist pattern, etched transfer resist pattern wafer. resist then removed (includes and/or plasma etching). Etching liquid acid solution. process connecting thin wires from chip's bond pads package lead. (This done assembly.) Zero Defects. ZiLOG Electronics Philippines, Inc. ZiLOG Corporate Headquarters, Jose, California.
etch: Wire bonding:
ZEPI: ZUS:
DC04-0001 Page Revision
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