POST OFFICE 655303 DALLAS, TEXAS 75265 SN5438, SN54LS38, SN5

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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5438, SN54LS38, SN5

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SN5438, SN54LS38, SN54S38 SN7438, SN74LS38, SN74S38 QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5438, SN54LS38, SN54S38 SN7438, SN74LS38, SN74S38 QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5438, SN54LS38, SN54S38 SN7438, SN74LS38, SN74S38 QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5438, SN54LS38, SN54S38 SN7438, SN74LS38, SN74S38 QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5438, SN54LS38, SN54S38 SN7438, SN74LS38, SN74S38 QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS
POST OFFICE 655303
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device JM38510/00303BCA JM38510/30203B2A JM38510/30203B2A JM38510/30203BCA JM38510/30203BCA JM38510/30203BDA JM38510/30203BDA SN5438J SN5438J SN54LS38J SN54LS38J SN54S38J SN54S38J SN7438D SN7438D SN7438DE4 SN7438DE4 SN7438DR SN7438DR SN7438DRE4 SN7438DRE4 SN7438J SN7438J SN7438N SN7438N SN7438N3 SN7438N3 SN7438NE4 SN7438NE4 SN7438NSR SN7438NSR SN7438NSRE4 Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP LCCC LCCC CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC CDIP CDIP PDIP PDIP PDIP PDIP PDIP PDIP Package Drawing Pins Package Plan Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Lead/Ball Finish Call Call Call Call Call Call Call Call Call Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Peak Temp Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Call Level-NC-NC-NC Level-NC-NC-NC Call Call Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device
Status
Package Type SOIC SOIC SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC
Package Drawing
Pins Package Plan Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish
Peak Temp
SN7438NSRE4 SN74LS38D SN74LS38D SN74LS38DBRG4 SN74LS38DBRG4 SN74LS38DE4 SN74LS38DE4 SN74LS38DR SN74LS38DR SN74LS38DRE4 SN74LS38DRE4 SN74LS38N SN74LS38N SN74LS38N3 SN74LS38N3 SN74LS38NE4 SN74LS38NE4 SN74LS38NSR SN74LS38NSR SN74LS38NSRG4 SN74LS38NSRG4 SN74S38D SN74S38D SN74S38DE4 SN74S38DE4 SN74S38DR
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1YEAR Level-2-260C-1YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Call Call Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
2500 Green (RoHS Sb/Br)
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device SN74S38DR SN74S38DRE4 SN74S38DRE4 SN74S38N SN74S38N SN74S38N3 SN74S38N3 SN74S38NE4 SN74S38NE4 SN74S38NSR SN74S38NSR SN74S38NSRE4 SN74S38NSRE4 SNJ5438J SNJ5438J SNJ5438W SNJ5438W SNJ54LS38FK SNJ54LS38FK SNJ54LS38J SNJ54LS38J SNJ54LS38W SNJ54LS38W SNJ54S38FK SNJ54S38FK SNJ54S38J SNJ54S38J SNJ54S38W SNJ54S38W
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOIC SOIC SOIC PDIP PDIP PDIP PDIP PDIP PDIP CDIP CDIP LCCC LCCC CDIP CDIP LCCC LCCC CDIP CDIP
Package Drawing
Pins Package Plan 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Call Call Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Plan planned eco-friendly classification: Pb-Free (RoHS) Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
POST OFFICE 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
POST OFFICE 655303
DALLAS, TEXAS 75265
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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5438, SN54LS38, SN5

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