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Series/Type: Date: B58100 March 2006 EPCOS 2006. Reproductio


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Probe assemblies, surface mounted sensors
Series/Type: Date:
B58100 March 2006
EPCOS 2006. Reproduction, publication dissemination this publication, enclosures hereto information contained therein without EPCOS' prior express consent prohibited.
Temperature measurement Probe assemblies
B58100 F120
Applications Surface mounted sensor measurement boiler temperature Features Short response time through glass-encapsulated thermistor Fast easy mounting Precise fixation screw attachment Options Alternative resistance ratings available request Alternative fast-on plug terminals available Delivery mode Bulk (standard) General technical data Climatic category Maximum power Resistance tolerance Rated temperature Thermal time constant Insulation resistance Dissipation factor Test voltage (IEC 60068-1)
Dimensional drawing
Dimensions
RR/RR
(measured surface) VDC, Rins air) min) Vtest
5/100/21 ±3.6 approx.
mW/K
Electrical specification ordering codes 8417 8417 characteristic B25/100 4006 4006 Contact dimensions Ordering code
B58100A0461A000 B58100A0463A000
Please read Important notes Cautions warnings this document.
Page
Temperature measurement Probe assemblies
B58100 F120
Reliability data Test Storage heat Standard 60068-2-2 Test conditions R100/R100 (typical) Remarks visible damage
Storage damp heat, steady state Rapid temperature cycling Thermal overload
Storage upper category temperature Temperature air: 60068-2-78 Relative humidity air: Duration: days Lower test temperature: 60068-2-14 Upper test temperature: Number cycles: 1000 Short time overload:
visible damage visible damage visible damage
Please read Important notes Cautions warnings this document.
Page
Temperature measurement Probe assemblies
B58100 F120
characteristics B58100A0461A000 (°C) 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 8417 B25/100 4006 10000 RR/RR 3.6% Rnom[] Rmin[] Rmax[] RR/RR[±%] T[±°C] 103610 80990 63800 50630 40461 32551 26356 21470 17593 14496 12009 10000 8368 7036 5942 5041 4294 3673 3154 2718 2351 2041 1778 1553 94649 74434 58974 47057 37804 30567 24869 20353 16751 13862 11531 9640 8036 6731 5664 4788 4064 3464 2965 2547 2196 1900 1650 1437 112560 87545 68627 54202 43117 34535 27842 22587 18434 15130 12487 10360 8700 7340 6221 5294 4524 3882 3343 2890 2507 2182 1905 1669
(%/K)
B58100A0463A000 (°C) 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 8417 B25/100 4006 10000 RR/RR 3.6% Rnom[] Rmin[] Rmax[] RR/RR[±%] T[±°C] 103610 80990 63800 50630 40461 32551 26356 21470 17593 94649 74434 58974 47057 37804 30567 24869 20353 16751 112560 87545 68627 54202 43117 34535 27842 22587 18434
(%/K)
Please read Important notes Cautions warnings this document.
Page
Temperature measurement Probe assemblies
B58100 F120
B58100A0463A000 (°C) 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 8417 B25/100 4006 10000 RR/RR 3.6% Rnom[] Rmin[] Rmax[] RR/RR[±%] T[±°C] 15130 14496 13862 12009 10000 8368 7036 5942 5041 4294 3673 3154 2718 2351 2041 1778 1553 11531 9640 8036 6731 5664 4788 4064 3464 2965 2547 2196 1900 1650 1437 12487 10360 8700 7340 6221 5294 4524 3882 3343 2890 2507 2182 1905 1669
(%/K)
Please read Important notes Cautions warnings this document.
Page
Temperature measurement Probe assemblies
B58100 F120
Cautions warnings General "Important notes" this document. Storage Store thermistors only original packaging. open package before storage. Storage conditions original packaging: storage temperature relative humidity annual mean, maximum 95%, precipitation inadmissible. store SMDs where they exposed heat direct sunlight. Otherwise, packing material deformed SMDs stick together, causing problems during mounting. Avoid contamination thermistors surface during storage, handling processing. Avoid storage thermistor harmful environments like corrosive gases (SOx, etc). After opening factory seals, such polyvinyl-sealed packages, SMDs soon possible. Solder thermistors after shipment from EPCOS within time specified: SMDs: months Leaded components: months Handling thermistors must dropped. Chip-offs must caused during handling NTCs. Components must touched with bare hands. Gloves recommended. Avoid contamination thermistor surface during handling. Soldering resin-type flux non-activated flux. Insufficient preheating cause ceramic cracks. Rapid cooling dipping solvent recommended. Complete removal flux recommended. Mounting When thermistors encapsulated with sealing material overmolded with plastic material, precautions given chapter "Mounting instructions", "Sealing, potting overmolding" must observed. Electrode must scratched before/during/after mounting process. Contacts housings used assembly with thermistor have clean before mounting. During operation, thermistor's surface temperature very high (ICL). Ensure that adjacent components placed sufficient distance from thermistor allow proper cooling thermistors. Ensure that adjacent materials designed operation temperatures comparable surface temperature thermistor. sure that surrounding parts materials withstand this temperature. Make sure that thermistors (ICLs) adequately ventilated avoid overheating. Avoid contamination thermistor surface during processing.
Please read Important notes Cautions warnings this document. Page
Temperature measurement Probe assemblies
B58100 F120
Operation thermistors only within specified operating temperature range. thermistors only within specified voltage current ranges (ICLs). Environmental conditions must harm thermistors. thermistors only normal atmospheric conditions. Contact thermistors with liquids solvents should prevented. must ensured that water enters thermistor (e.g. through plug terminals). measurement purposes (checking specified resistance temperature), component must immersed water suitable liquids (e.g. Galden). Avoid dewing condensation. sure provide appropriate fail-safe function prevent secondary product damage caused malfunction (e.g. limitation overvoltage condition).
Please read Important notes Cautions warnings this document.
Page
Important notes
following applies products named this publication: Some parts this publication contain statements about suitability products certain areas application. These statements based knowledge typical requirements that often placed products areas application concerned. nevertheless expressly point that such statements cannot regarded binding statements about suitability products particular customer application. rule, EPCOS either unfamiliar with individual customer applications less familiar with them than customers themselves. these reasons, always ultimately incumbent customer check decide whether EPCOS product with properties described product specification suitable particular customer application. also point that individual cases, malfunction passive electronic components failure before their usual service life cannot completely ruled current state art, even they operated specified. customer applications requiring very high level operational safety especially customer applications which malfunction failure passive electronic component could endanger human life health (e.g. accident prevention life-saving systems), must therefore ensured means suitable design customer application other action taken customer (e.g. installation protective circuitry redundancy) that injury damage sustained third parties event malfunction failure passive electronic component. warnings, cautions product-specific notes must observed. order satisfy certain technical requirements, some products described this publication contain substances subject restrictions certain jurisdictions (e.g. because they classed "hazardous"). Useful information this will found Material Data Sheets Internet (www.epcos.com/material). Should have more detailed questions, please contact sales offices. constantly strive improve products. Consequently, products described this publication change from time time. same true corresponding product specifications. Please check therefore what extent product descriptions specifications contained this publication still applicable before when place order. also reserve right discontinue production delivery products. Consequently, cannot guarantee that products named this publication will always available. Unless otherwise agreed individual contracts, orders subject current version "General Terms Delivery Products Services Electrical Industry" published German Electrical Electronics Industry Association (ZVEI). trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap, PhaseMod, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap, WindCap trademarks registered pending Europe other countries. Further information will found Internet www.epcos.com/trademarks.
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