| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
N-channel 0.018 DPAK STripFETII Power MOSFET Type STD45NF75 VDSS
Top Searches for this datasheetSTD45NF75 N-channel 0.018 DPAK STripFETII Power MOSFET Type STD45NF75 VDSS RDS(on) <0.024 40A(1) Current limited package 100% avalanche tested Gate charge minimized DPAK Description This Power MOSFET latest development STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows extremely high packing density on-resistance, rugged avalanche characteristics less critical alignment steps therefore remarkable manufacturing reproducibility. Internal schematic diagram Applications Switching application Order codes Part number STD45NF75T4 Marking D45NF75 Package DPAK Packaging Tape reel February 2007 1/16 www.st.com Contents STD45NF75 Contents Electrical ratings Electrical characteristics Electrical characteristics (curves) Spice thermal model Test circuit Package mechanical data Packing mechanical data Revision history 2/16 STD45NF75 Electrical ratings Electrical ratings Table Symbol VDGR ID(1) Absolute maximum ratings Parameter Drain-source voltage (VGS Drain-gate voltage (RGS Gate- source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Derating Factor Value 0.67 Max. operating junction temperature Unit W/°C V/ns Ptot dv/dt Peak diode recovery voltage slope Single pulse avalanche energy Storage temperature Tstg Current limited package Pulse width limited safe operating area. 40A, di/dt 800A/µs, V(BR)DSS, TJMAX Starting 20A, Table Rthj-case Rthj-pcb Thermal data Thermal resistance junction-case Thermal resistance junction-pcb Maximum lead temperature soldering purpose(1) Figure Figure °C/W °C/W sec. from case 3/16 Electrical characteristics STD45NF75 Electrical characteristics (TCASE=25°C unless otherwise specified) Table Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS Gate-body leakage current (VDS Gate threshold voltage Static drain-source resistance Test conditions 250µA, rating rating, 125°C ±20V VGS, 250µA 10V, 0.018 Min. ±100 0.024 Typ. Max. Unit IDSS IGSS VGS(th) RDS(on) Table Symbol Ciss Coss Crss td(on) td(off) Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Test conditions 25V, Min. Typ. 1760 Max. Unit 25V, 1MHz, 37V, (see Figure 60V, 40A, 10V, (see Figure Pulsed: Pulse duration duty cycle 1.5%. 4/16 STD45NF75 Electrical characteristics Table Symbol ISDM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage 40A, Test conditions Min. Typ. Max. Unit Reverse recovery time 40A, di/dt 100A/µs, Reverse recovery charge 30V, 150°C Reverse recovery current (see Figure Pulse width limited safe operating area. Pulsed: Pulse duration duty cycle 1.5% 5/16 Electrical characteristics STD45NF75 Figure Electrical characteristics (curves) Safe operating area Figure Thermal impedance Figure Output characteristics Figure Transfer characteristics Figure Transconductance Figure Static drain-source resistance 6/16 STD45NF75 Figure Gate charge gate-source voltage Figure Electrical characteristics Capacitance variations Figure Normalized gate threshold voltage temperature Figure Normalized resistance temperature Figure Source-drain diode forward characteristics Figure Normalized breakdown voltage temperature 7/16 Electrical characteristics Figure Power derating Figure current STD45NF75 Figure Thermal resistance Rthj-a copper area Figure power dissipation copper area 8/16 STD45NF75 Electrical characteristics Figure Allowable time avalanche previous curve gives safe operating area unclamped inductive loads, single pulse repetitive, under following conditions: PD(AVE) (1.3 BVDSS IAV) EAS(AR) PD(AVE) Where: allowable current avalanche PD(AVE) average power dissipation avalanche (single pulse) time avalanche rate above fixed IAV, following equation must applied: (Tjmax TCASE)/ (1.3 BVDSS Zth) Where: value coming from normalized thermal response fixed pulse width equal TAV. 9/16 Spice thermal model STD45NF75 Spice thermal model Table Spice parameter Parameter CTHERM1 CTHERM2 CTHERM3 CTHERM4 CTHERM5 CTHERM6 Node Value 10-4 10-3 10-2 10-2 9.65 10-2 10-1 RTHERM1 RTHERM2 RTHERM3 RTHERM4 RTHERM5 RTHERM6 0.045 0.105 0.150 0.225 0.375 0.600 Figure 10/16 STD45NF75 Test circuit Test circuit Figure Gate charge test circuit Figure Switching times test circuit resistive load Figure Test circuit inductive load Figure Unclamped Inductive load test switching diode recovery times circuit Figure Unclamped inductive waveform Figure Switching time waveform 11/16 Package mechanical data STD45NF75 Package mechanical data order meet environmental requirements, offers these devices ECOPACK® packages. These packages have Lead-free second level interconnect. category second level interconnect marked package inner label, compliance with JEDEC Standard JESD97. maximum ratings related soldering conditions also marked inner label. ECOPACK trademark. ECOPACK specifications available www.st.com 12/16 STD45NF75 Package mechanical data DPAK MECHANICAL DATA DIM. MIN. (L1) 0.03 0.64 0.45 0.48 2.28 9.35 0.023 0.008 10.1 0.173 0.368 0.039 0.110 0.031 0.039 0.252 0.185 0.090 0.181 0.397 MAX. 0.23 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.200 0.260 TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 inch 0068772-F 13/16 Packing mechanical data STD45NF75 Packing mechanical data DPAK FOOTPRINT dimensions millimeters TAPE REEL SHIPMENT REEL MECHANICAL DATA DIM. 12.8 20.2 16.4 22.4 18.4 13.2 MIN. MAX. 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. BASE 2500 MIN. 10.4 1.65 2.55 15.7 16.3 inch MIN. MAX. 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.85 2.75 14/16 STD45NF75 Revision history Revision history Table Date 22-Jun-2004 09-Sep-2004 11-Jul-2006 20-Feb-2007 Revision history Revision Preliminary version Complete version template, content change Typo mistake page Changes 15/16 STD45NF75 Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. Purchasers solely responsible choice, selection products services described herein, assumes liability whatsoever relating choice, selection products services described herein. license, express implied, estoppel otherwise, intellectual property rights granted under this document. part this document refers third party products services shall deemed license grant such third party products services, intellectual property contained therein considered warranty covering manner whatsoever such third party products services intellectual property contained therein. UNLESS OTHERWISE FORTH ST'S TERMS CONDITIONS SALE DISCLAIMS EXPRESS IMPLIED WARRANTY WITH RESPECT AND/OR SALE PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES MERCHANTABILITY, FITNESS PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER LAWS JURISDICTION), INFRINGEMENT PATENT, COPYRIGHT OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED WRITING AUTHORIZED REPRESENTATIVE, PRODUCTS RECOMMENDED, AUTHORIZED WARRANTED MILITARY, CRAFT, SPACE, LIFE SAVING, LIFE SUSTAINING APPLICATIONS, PRODUCTS SYSTEMS WHERE FAILURE MALFUNCTION RESULT PERSONAL INJURY, DEATH, SEVERE PROPERTY ENVIRONMENTAL DAMAGE. PRODUCTS WHICH SPECIFIED "AUTOMOTIVE GRADE" ONLY USED AUTOMOTIVE APPLICATIONS USER'S RISK. Resale products with provisions different from statements and/or technical features forth this document shall immediately void warranty granted product service described herein shall create extend manner whatsoever, liability logo trademarks registered trademarks various countries. Information this document supersedes replaces information previously supplied. logo registered trademark STMicroelectronics. other names property their respective owners. 2007 STMicroelectronics rights reserved STMicroelectronics group companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom United States America www.st.com 16/16 Other recent searchesXC6401Dual - XC6401Dual XC6401Dual Datasheet TRC105 - TRC105 TRC105 Datasheet SCDS181 - SCDS181 SCDS181 Datasheet M54685L - M54685L M54685L Datasheet M36N-2 - M36N-2 M36N-2 Datasheet FK10VS-9 - FK10VS-9 FK10VS-9 Datasheet Am7920 - Am7920 Am7920 Datasheet
Privacy Policy | Disclaimer |