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Solderability

Back Up Block 3 Solderability

Solderability
06-June-03
Back Up Block 3 Solderability
Solderability
Source: STMicroelectronics
06-June-03
No forced ageing
Good solderability of Sn coated components in SnPb
Wetting force mN / mm
Ageing : 16H150°C
Wetting balance test
Ageing : 8H Steam
Immersion 10seconds
Solderability
Source: STMicroelectronics
06-June-03
No forced ageing
Good solderability of Sn coated components in SnAgCu
Wetting force mN / mm
Ageing : 16H150°C
Wetting balance test
Ageing : 8H Steam
Immersion 10seconds
Solderability
Source: STMicroelectronics
06-June-03
No forced Ageing
Good solderability of NiPdAu coated components in SnPb
Ageing : 8H150°C Wetting force mN / mm
Wetting balance test
Immersion 10seconds
Solderability
Source: STMicroelectronics
06-June-03
No forced ageing
Good solderability of NiPdAu coated components in SnAgCu
Wetting force mN / mm
8H150°C Storage
Wetting balance test
Immersion 10seconds
Solderability
Source: Infineon
06-June-03
Teststrip: Geometry: Material: 5 mm x 70 mm x 0, 2 mm FeNi42 Cu K75 (CuCrSiTi)
Solderability
Source: Infineon
06-June-03
Solderability
Source: Infineon
06-June-03
Solderability
06-June-03
Summary
· SnPb(Ag) is a more discriminating test solder than SnAgCu · Lead-free platings meet solderability test in wetting balance
·referring to 0-cross time and wetting force
· Leadframe material has some effect on wetting behaviour due to thermal conductivity, but still inside the spec
· Solderabilty results confirm the compatibility of lead-free solutions with SnPb and Pb-free soldering