Back Block Solderability Solderability Source: STMicroelectr
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Solderability
Back Block Solderability
Solderability
Source: STMicroelectronics
forced ageing
Good solderability coated components SnPb
Wetting force mN/mm
Ageing 16H150°C
Wetting balance test
235°C Zero cross time seconds Wetting force 0.10mN/mm
Ageing Steam
Immersion 10seconds
Solderability
Source: STMicroelectronics
forced ageing
Good solderability coated components SnAgCu
Wetting force mN/mm
Ageing 16H150°C
Wetting balance test
245°C Zero cross time seconds Wetting force 0.10mN/mm
Ageing Steam
Immersion 10seconds
Solderability
Source: STMicroelectronics
forced Ageing
Good solderability NiPdAu coated components SnPb
Ageing 8H150°C Wetting force mN/mm
Wetting balance test
235°C Zero cross time seconds Wetting force 0.10mN/mm
Ageing 85°C-85%rH
Immersion 10seconds
Solderability
Source: STMicroelectronics
forced ageing
Good solderability NiPdAu coated components SnAgCu
Wetting force mN/mm
8H150°C Storage
Wetting balance test
245°C Zero cross time seconds Wetting force 0.10mN/mm
85°C-85%rH Storage
Immersion 10seconds
Solderability
Source: Infineon
Teststrip: Geometry: Material: FeNi42 (CuCrSiTi)
Surface Finishing: SnPb (9,0 0,52) (Reference) (8,0 0,20) Pretreatment initial (ambient atmosphere, months) steam aging
Solderability
Source: Infineon
Wetting properties lead-free coatings meet 0-cross time
Solderability
Source: Infineon
Wetting properties lead-free coatings meet 0-cross time
Solderability
Summary
SnPb(Ag) more discriminating test solder than SnAgCu Lead-free platings meet solderability test wetting balance
0-cross time wetting force
Leadframe material some effect wetting behaviour thermal conductivity, still inside spec
Solderabilty results confirm compatibility lead-free solutions with SnPb Pb-free soldering
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