Contents Advantages IPAD Available packages IPAD discretes applic

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Contents Advantages IPAD Available packages IPAD discretes applic

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IPAD protection rectifiers mobile communication
Contents
Advantages IPAD Available packages IPAD discretes application mapping camera Bottom conector interface Memory card card interface Audio lines Keypad block Power management Part numbers list 21/22
Requirements mobile devices
Mobile devices featuring multimedia capability, incorporate richer, thinner lighter designs. Such trends need ever-increasing memory size, display quality data transmission rate, which turn bring highly-integrated compact environment mobile device. interference, destruction space constraint also issues which designers must take into consideration when developing mobile devices. leading semiconductor vendor, STMicroelectronics provides best-in-class discrete integrated solution (IPADTM) improve performance integration level system.
ST's IPAD: right choice
supplier IPAD protection devices world most complete portfolio cover function blocks mobile device Front-end back-end factory worldwide presence Powerful manufacturing operation guarantee large volume high standard delivery Over billion units shipped portable market wide range packages, from SOT666 Flip-Chip, micro
Mobile phone mapping
Memory card port card
filtering protection Bias circuit Impedance matching
Power amplifier Antenna switch
detection Directive coupler
Camera Harmonic filter transceiver chipset Baseband processor Display Keyboard Bottom connector
filtering protection
protection diode
Balun
Varicap
Charge jack
Battery charger
Over-voltage protection Reverse battery protection Reverse polarity protection Boost diode
Earphone jack Power management audio Microphone Speaker/ receiver
filtering protection Bias circuit
Advantages IPAD
What's IPAD?
IPAD (integrated passive active devices) highly integrated technology developed STMicroelectronics, which combines different types passive active elements monolithic circuit. represents further stage concept integration, replacing various discrete components functions required applications, such protection diodes, filters, line terminations, pull-up pull-down resistors, signal switches components, etc.
1.dB Improved filtering performance 0.00 With integrated pass filters, IPAD technology
rejects high-frequency spectrum that prevent equipment from passing (electromagnetic -10.00 compatibility) standards. figure right shows IPAD filter attenuation performance obtained with EMIF -20.00 products comparison with typical discrete passive components. dual, triple quad band environments, -30.00 level rejection provided IPAD solutions greatly enhanced comparison passive solutions.
0.00 -10.00 -20.00
15dB
15dB -30.00
-40.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G (Hz) 3.0G
Discretes
IPAD
-40.00 Improved protection capability 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G
IPAD technology also provides protection Discretes compliance with IEC61000-4-2 specifications. IPADto integrated double clamping structure, voltage
(Hz) 3.0G
device output reduced down when 15kV surge applied. diagram below shows measurement results pass filter 15kV discharge applied EMIFProtected product.
Input voltage: Output voltage:
filter using 0201 ceramic capacitors
15kV electrostatic discharge
15dB
pass filter Protected
(Hz) 3.0G
IEC61000-4-2
(150pF/330) diode array filter using 0201 (x10) 15kV ceramic capacitors SOT323-6L (x2)
10-li
1.0G
discharge
Input voltage: Low-pass filter
Output voltage:
Protected
space saving
Input Input Output Output
Input voltage: Output voltage: filter using 0201 ceramic capacitors (x10)
cted
diode array SOT323-6L (x2)
10-line ESD/EMI filter 2.6mm
Minimized board space
IPAD products take advantage integrated passive arrays networks that were previously used instead discrete components. fact space saving estimated between when compared standard discretes. this technology becomes very attractive when taking into consideration combined electrical dimensional performance. comparison space required line filter plus protection, between IPAD discrete solution, results approximately 19mm2 space board used complete discrete solution only 6.8mm2 using EMIF10-1K010F2 Flip-Chip package.
Integration capability
Passive elements Resistors From
tolerance Matching
Active elements
diodes (IEC61000-4-2 level bidirectional capacitance structure Schottky diodes signals Small signal integrated functions Short circuit protection Temperature over-current detection Over-voltage limitation Data conditioning
Capacitors 0.6nF/mm2, tolerance
High density capacitance, tolerance (1~30nF)
Inductors ~140nH
factor (<10)
Summary
main benefits IPAD technology are:
Superior electrical performance compared discretes Minimized board space Reduced component number increased reliability through monolithic solution Added value multiple integrated functions Cost-effectiveness
Available packages
Package size Integration level STmite SOT23-6L
Package innovation
SOT323-3L
SOT666
QFN2x2
QFN3x3
SOD323
SOT89-3L
µQFN-6L
µQFN-8L
µQFN-12L
µQFN-16L
QFN4x4
SOD882
SOT883
Flip-Chip*
Flip-Chip*
Flip-Chip*
Flip-Chip*
Flip-Chip*
Packages pins
400µm 500µm pitch Flip-Chip package available
IPAD discretes applications mapping
Keypad/MCU
filter EMIF10-1K010F2 Protection ESDALC6V1M3 ESDALC6V1-xxM2
diodes
diode BAR63J Detection diode STDD15 Varicap STVD901J
Power management
Transil SM2T series SMTY18AM Power schottky STPS120M STPS140M STPS060Z STPS0540Z STPS1L20M STPS1L40M
Bottom connector
Filter EMIFxx-1005Mxx EMIF04-10006F2 EMIF06-10006F2 EMIF11-10002C4 EMIF10-1K010F2 Protection ESDA6V1P6 ESDA6V1-4BF2 ESDA6V1-4F2 ESDA6V1M6 ESDA6V1-5M6
screen
Filter EMIF10-LCD series EMIF10-COM01F2 EMIF04-2005QCF EMIF08-2005QEJ EMIFxx-VID01 series EMIFxx-1502Mxx
card interface
Filter EMIF03-SIM series Protection ESDALC6V1P6 ESDALC6V1W5 ESDALC6V1M6
Microphone, speakers audio lines
Filter EMIF01-10005W5 EMIF02-MIC series EMIF02-SPK01F2
interface
Filter EMIF04-MMC02F2 EMIF06-HMC01F2
interface
Filter EMIF02-USB series Protection USBUF01P6 USBUF01W6 USBUF02W6
Power amplifier control
Filter STPAC02F2
Application needs
suppression protection total line capacitance High attenuation GSM/DCS/CDMA frequency
Benefits
Widest product range: lines Complete package portfolio: Flip-Chip, micro Different line capacitances available meet specific requirements products provide attenuation across wide frequency band products compliant with immunity according IEC61000-4-2 level
EMIF04/06/08-VID01F2
attenuation curve EMIF08-VID01
line filtering protection High attenuation filter (-40dB) Very line capacitance (17pF 2.5V)
Input Flip-Chip
package
Output
Basic cell configuration
Input Output
(Hz) -45-25
CLINE (pF)
100k
100M
(Hz)
CLINE (pF)
100k
100M
LINE
camera
2.8V
Image processing Sensor controller CMOS image sensor Frontend JPEG encoder View finder
interface
DCLCK Baseband Video inputs filtering protection
Input
Horizontal synchro Vertical synchro
Output
EMIF04-1502M8, EMIF06-1502M12 EMIF08-1502M16
Total line capacitance curve EMIF04-1502M8
CLINE (pF)
line filtering protection Ultra line capacitance: 14pF 2.5V package (0.4mm pitch)
EMIF10-LCD01F2 EMIF10-COM01F2
line filtering protection high capacitance choice) Flip-Chip package
LINE
EMIF10-LCD02F3
line filtering protection line capacitance 30pF Flip-Chip package, 400µm pitch (3.9mm2)
Application needs
protection filtering High attenuation GSM/DCS/CDMA frequency
Benefits
Smallest µQFN package available Reduced component count Wide frequency range rejection: -30dB from 800MHz 3GHz capacitance versions available
ESDA6V1M6 ESDA6V1-5M6
line protection 100W Peak pulse power (8/20µs)
Connector
ESDA6V1xx
protected
Micro QFN-6L package (1.45mm2)
ESDA6V1P6 ESDA6V1-5P6
line protection 150W peak pulse power (8/20µs) SOT-666 package (2.6mm2)
ESDA6V1-4BF2 ESDA6V1-4F2
line bidirectional protection 150W peak pulse power (8/20µs) Flip-Chip (1.68mm2)
Bottom connector
EMIF041005M8
-12.5
EMIF061005M12
-37.5
Bottom connector
Baseband filtering protection filtering protection
ESDA6V1xx
ESDA6V1xx
Connector
Connector
protected
EMIF0x-1005Mxx
line filter protection
protected
EMIF0x-10006F2
line filter protection High attenuation level mobile phone frequencies Flip-Chip package
High attenuation level mobile phone frequencies Micro QFN: leads (2.6mm2), leads (3.8mm2), leads (5.0mm
attenuation curve EMIF06-1006
Bottom connector
Bottom connector
EMIF04O2 EMIF04O3 1005M8 1005M8 EMIF06O3 EMIF06O4 1005M12 1005M12
-12.5
-12.5
-37.5 -37.5
i3-o3-load i3-o3-load Simulation Simulation
(Hz) (Hz)
100M 100M 300M
Bottom connector
300M
Application needs
Impedance matching Pull-up pull-down resistor
line capacitance suppression protection
Benefits
Complete portfolio USB1.1, USB-OTG USB2.0 standard Space saving micro packages: Flip-Chip, SOT666 products compliant with immunity according IEC61000-4-2 level
EMIF02-USB03F2
EMIF02-USB05F2
1.1/OTG low-speed full-speed compatible
USB-OTG compatible data line filter protection line protection power control lines Integrated pull-up pull-down resistors Cline 20pF Flip-Chip package
Regulator
data line filter protection Cable line protection power control lines DIntegrated pull-up resistor Cline 30pF Flip-Chip package
Pull resistors Impedance matching protection
connector
Vbus
D+in D+in
Xceiver
connector
Vbus 3.3V
EMIF05-USB03F2
Vbus
DGND
D+out D-out
DGND
transciever
DGND
DGND
USBUF01P6
RPU-SW Vbus
3.3V Vbus
cable
Vbus DGND DGND
capabale device (upstream)
Vbus
Connector
Vbus
EMIF05-USB05
Vbus
interface
Vbus
connector
Regulator
Vbus
Cable
Pull resistors Impedance matching protection
controller
Switch
USBUSB Xceiver Xceiver
protected integrated diode D-out Integrated pull-up resistors Cline 47pF Flip-Chip package
Connector
D-out data lines filter protection D+out
Vbus
D+in data line protection D+in D+in Vbus protected integrated diode
D+in 2.0/OTG high-speed (480MHz) compatible
Cline 2.5pF (typical value) SOT666 package
connector
Vbus
Vbus USBUF01P6 USB1.1 speed full-speed compatible D+out
EMIF05-USB05
Vbus 3.3V
EMIF05-USB03F2
Vbus
Vbus
USBLC6-2P6
DGND
Peripheral transeiver
Peripheral transeiver
Vbus
capabale device (upstream)
Vbus
capabale device (upstream)
GNDGND
DCline 47pF
USBUF01P6 USBUF01P6
cable
3.3V Vbus 3.3V
RPU-SW Vbus
RPU-SW
Vbus
cable
Vbus DGND
Vbus DGND
USBLC6-2P6
DGND
DGND
DCline 47pF
USBLC6-2P6
LS/FS LS/FS
LS/FS LS/FS
connector
Vbus 3.3V
EMIF05-USB03F2
Vbus
Memory card
Application needs
Impedance matching Pull-up pull-down resistor
line capacitance suppression protection
Benefits
High-integration Flip-Chip package immunity IEC61000-4-2 level Wide frequency range rejection capacitance suitable high data rate interface
Connector
host
Baseband
SDACDO SDACD1 SDACD2 SDACD3 SDAMD SDACLK SDAWP SDACD SDAPWR
Pull resistorsors Impedance matching +ESD protection
Power switch
Vmmc MMCclk MMCcmd MMCdat0 MMCdat1 MMCdat2 MMCdat3
EMIF06-HMC01F2
EMIF04-MMC02F2/F3
line filter protection Integrated pull-up resistors protection Flip-Chip package bumps, 3.7mm2)
line filter protection
protected integrated clamping diode Flip-Chip package (500µm/400µm pitch)
Vmmc MMCclk MMCcmd MMCdat0 MMCdat1 MMCdat2 MMCdat3
EMIF06-HMC01
MMCDATA MMCclk MMCCMD
EMIF04- OUT1 MMC02 OUT2 OUT3
Baseband
card
Baseband
Vmmc
dat0 dat1 dat2 dat3
EMIF04- OUT1 MMC02 OUT2 OUT3
MMCDATA MMCclk MMCCMD
card
card interface
Application needs
line capacitance protection
Impedance matching suppression protection
Benefits
area with SOT666, µQFN Flip-Chip packages immunity according IEC61000-4-2 level line capacitance Wide frequency range rejection: -35dB from 800MHz 3GHz
Baseband
SIMDATA SIMclk SIMRST filtering protection
Connector
card
ESDALC6V1M6 ESDALC6V1-5M6 SIMclk
SIMclk line protection SIMRST SIMDATA card
Baseband
SIMDATA
SIMVDATA SIMDATAclk
SIMclk
Connector
filtering EMIF03-SIM02Fx
EMIF03-SIM02
Connector
line filter andR1 protection
filtering capacitance: 20pF
protection card
protection
capacitance: 12pF
ESDALC6V1xx
Baseband
SIMRST
card
Micro QFN-6L package (1.45mm2)
SIMRST
SIMRST
protected integrated TRANSILI Flip-Chip package 500µm pitch (2.0mm2)
ESDALC6V1P6 ESDALC6V1-5P6
Flip-Chip package 400µm pitch (1.4mm2)
EMIF03-SIM02
line protection capacitance: 12pF SOT666 package (2.6mm2)
SIMDATA SIMclk SIMRST card
SIMDATA SIMclk SIMRST
EMIF03-SIM02 card
SIMDATA SIMclk SIMRST
ESDALC6V1xx
SIMDATA
card
SIMclk SIMRST
ESDALC6V1xx
Audio lines (microphone, speaker, receiver, headset)
Application needs
High level suppression Bi-directional protection insertion loss speaker/receiver application
Benefits
High-density capacitance integration capability immunity IEC61000-4-2 level High attenuation level mobile phone frequencies
Power management audio filtering protection Microphone
Power management audio
filter prote
Audio amplifier filtering protection Speaker Audio amplifier
filteri prote
Microphone
Vbias
management audio line
EMIF02-MIC02F2
EMIF02-MIC02
Low-pass filter with protectionfilter Greater than 30dB attenuation 900MHz (470 /16pF) Microphone Flip-Chip package bumps, 1.7mm Audio amplifier
filtering protection Audio processing conversation
EMIF02-SPK01
Vbias EMIF02-MIC02 Low-pass filter
Low-pass filter Audio processing conversation
Microphone
Speaker
EMIF02-MIC03F2+
Vbias
filtering protection
Audio amplifier
line filter with protection Greater than 40dB attenuation 900MHz /100pF) Flip-Chip package bumps, 1.6mm2)
EMIF01-10005W5 Low-pass filter
EMIF02-MIC02
Audio processing conversation
EMIF02-SPK01 Low-pass filter
Audio amplifier
EMIF02-SPK01F2
line filter with protection serial impedance Flip-Chip package (500µm pitch)
EMIF02-MIC01F2
EMIF02-MIC04F2 EMIF02-MIC05F2
line filter with protection serial impedance High density capacitor technology Flip-Chip package (500 pitch)
line filter with protection Integrated high density capacitor serial resistance Flip-Chip package (500µm pitch)
Speaker
line filter with ESDAprotection SOT323-5L package
Keypad
Application needs
protection filtering High attenuation GSM/DCS/CDMA frequency
Benefits
Market smallest package SOT883 available Reduced component count Wide frequency range rejection: -30dB from 800MHz 3GHz
Baseband
Baseband
Keypad interface module
Col0 Col1 Col2 Keypad Col3 interface Col4 module Row0 Row1 Row2 Row3 Row4
Col0 Col1 Col2 Col3 Col4 Row0 Row1 Row2 Row3 Row4 filtering protection
filtering protection
ESDALC6V1M3
Baseband
Connector
EMIF10-1K010
Connector
Line line filter protection
Line 2(500µm pitch) Flip-Chip packageLine protected I/O2
Line
protected
Col0 Col1 Col2 Col3 Col4
I/O2 I/O1 Replaces discrete devices Line I/O1
I/O2
I/O1
I/O1
I/O2
Row0 Row1 Row2 Row3 Row4
Row0 Keyboard Row1 Row2 Row3 Row4
EMIF10-1K010
ESDALC6V1M3 EMIF10-1K010F2
Line
Col0 Col1 Col2 Keypad Col3 Col4 interface CPUl4 module Row0 Row1 Row2 Row3 Row4
Col0 Col1 Col2 Col3 Col4
Keyboard
filtering protection
ESDALC6V1M3
line protection capacitance: 11pF SOT883 package (0.6mm2)
Connector
ESDALC6V1M3 Line Line Line I/O1
ESDALC6V1-1BM2 ESDALC6V1-1M2
protected I/O2
line protection directional protection SOD882 package (0.6mm2)
I/O2
I/O1
Application needs
peak power detection harmonic filtering pass filtering directive coupler diode antenna switch module
Varicap diode application protection antenna Balun
Benefits
1800/1900
STBGH181
Designed specific wireless requirements Design capability functions Improved performance with discretes replacement module Space saving with integrated solution
RX1800 Quad band transceiver RX900 580/900
STBGH91
TX900
Power amplifier Control circuit TX1800
Balun
Antenna switch module filter
Batt Li+battery STPAC02+coupler Vdet Detector Antenna switch module
Transmit output filter STBGH91 STBGH181 (under development)
Vdet
Power amplifier module STPAC02F2
transmit section
LPF+Coupler Matching+coupler
Band pass filter harmonics generated transceiver Pass band STBGH91: 915MHz Pass band STBGH181: 1710 1910MHz Integrated balun balanced single-ended conversion Baseband (integrated passive device) technology nonconductive glass substrate Micro package: 2.3mm2
detector control
Integrated temperature compensation
receive section Compatible
with GSM, CDMA TDMA
Power amplifier
Flip-Chip ransceiver
package (500µm pitch)
LPF/directive coupler
Power amplifier output pass filter Integrated standalone directive coupler Fewer interconnection losses (die bonding) Smaller size
Balun
Outstanding performance (phase amplitude imbalance) Wide frequency band baluns Spiral stacked balun structure S-parameter file available stacking baluns Ultra small size (0.4 0.8mm2)
bock
diode BAR63JFILM
Antenna 150pF 15nF 20pF BAR63J BAR63J 150pF
diode high-speed switching signal forward voltage inductance capacitance Miniature package SOD-323
DetectionAntenna diode BAR63J STDD15 series50W 150pF
Intput
Antenna
Bias
150pF
compensated
Detection and150pF temperature
BAR63J
15nF Three configurations available 20pF
BAR63J
diodes 150pF
Intput
15nF inductance capacitance (1pF BAR63J
Output
D2C1
Output
Bias STDD15-04W3 STDD15-07S STDD15-05W STDD15-04W STDD15-07S STDD15-05W
20pF Miniature packages SOT-323 SOT666
Ambient temp. Ambient temp.
Varicap STVD901JFILM
Vtune
10pF 22nH 22nH 22nH
56nH
Frequency tuning diode High capacitance ratio inductance 1.5nH capacitance (4pF Miniature package SOD-323
Vtune 56nH 1800/1900
10pF
22nH
120pF
STVD901J
10pF 2.2pF 2.2pF
10pF
100pF 2.2K
100pF
47pF
GND3.3pF STBGH181
Vtune
56nH
120pF
STVD901J 580/900
3.3pF
STVD901J 120pF Quad band
transceiver RX900
4.7pF STBGH91
56pF 3.3nH
56pF
3.3nH
Power amplifier +C15 Control 1.2pF circuit +C15
2.2K
2.2K
1.2pF
47pF
4.7pF
Balun
TX900
+C21 TX1800 3.3pF
2.2K
3.3pF Antenna switch module
filter
+C21
RX1800
LPF/directive coupler
Batt Li+battery
STPAC02+coupler Vdet Detector Antenna switch module
Vdet transmit section
LPF+Coupler
receive section Baseband ransceiver
Matching+coupler
Power amplifier
Power management
Application needs
Overvoltage reverse polarity protection Reverse battery protection Boost buck diode
Reverse battery
Benefits
Battery charging 1000mA channel
Converter power losses minimized Power supply yield increased Optimized thermal performances Ultra profile packages minimum space
Battery 1.8V/3.6V
Input protection
Over-voltage protection 5.4V output
Boost diode
Overvoltage reverse polarity protection SMTY18M (TranskyDiode)
Reverse battery STPS120M STPS140M
Integrated overvoltage reverse polarity protection High peak pulse power: 400W (8/20µs) forward voltage: 0.48V 0.85A STmite package (7.1mm2)
average forward current Peak reverse voltage STmite package (7.1mm2)
STPS0530Z STPS0540Z SM2Txxx
0.5A average forward current Peak reverse voltage SOD-123 (5.8mm2)
Transient overvoltage protection diode High peak pulse power: 200W 10/1000µs Wide range stand voltage from STmite package (7.1mm2)
Boost diode STPS1L20M STPS1L40M
forward voltage: 0.37V Peak reverse voltage STmite package (7.1mm2)
Product table
Part number Main features LCD, camera keypad EMIF04-VID01xx EMIF06-VID01xx EMIF08-VID01xx EMIF04-1502QCF EMIF04-1502M8 EMIF08-1502M12 EMIF10-1K010F2 EMIF10-COM01F2 EMIF10-LCD01xx EMIF04-2005QCF EMIF08-2005QEJ line filters level C=16pF; R=100 line filters level C=16pF; R=100 line filters level C=16pF; R=100 line filters level C=13pF; R=160 line filters level C=14pF; R=170 line filters level C=14pF; R=170 line filters level C=100pF; line filters level C=45pF, R=200 line filters level C=28pF; R=100 line filters level C=45pF; R=200 line filters level C=45pF; R=200 card ESDALC6V1M6 ESDALC6V1W5 ESDALC6V1P6 EMIF03-SIM01xx EMIF03-SIM02xx lines level C=12pF; lines level C=12pF; 6.1V lines level C=12pF; 6.1V line filters level C=35pF; R1=R3=100 line filters level C=20pF; R1=R3=100 Bottom connector ESDA6V1M6 ESDA6V1-5M6 ESDA6V1W5 ESDA6V1-P6 ESDA6V1-5P6 ESDA6V1-4F2 ESDA6V1-4BF2 EMIF04-10006F2 EMIF06-10006F2 EMIF04/06/081005M8/M12/M16 lines level C=70pF; 6.1V lines level 70pF; 6.1V lines level C=90pF; 6.1V lines level C=70pF; 6.1V lines level C=70pF; 6.1V lines level C=250pF; 6.1V lines level C=30pF, 6.1V line filters level C=45pF; R=100 line filters level C=45pF; R=100 line filters level C=50pF, R=100 USBUF01W6 USBUF01P6 USBLC6-2P6 EMIF02-USB01xx EMIF02-USB03xx EMIF02-USB04xx EMIF02-USB05xx line filters level C=47pF; Rs=33 line filters level C=47pF; Rs=33 line filters level 2.0; C=3.5pF; VBR= line filters level C=50pF; line filters level OTG; C=20pF Rs=33 Rp=1.3K line filters level C=40pF; Rs1=Rs; 2=20 =1.5k line filters level C=30pF; Rs=33 Rp=1.5K Memory card EMIF04-MMC02F2 EMIF06-HMC01F2 line filters level C=20pF; Rs=47 line filters level C=20pF; Rs=50 Flip-Chip Flip-Chip SOT323-6L SOT666 SOT666 Flip-Chip Flip-Chip Flip-Chip Flip-Chip QFN-6L QFN-6L SOT323-5L SOT666-6L SOT666-6L Flip-Chip Flip-Chip Flip-Chip Flip-Chip QFN-8L, QFN-12L, QFN-16L QFN-6L SOT323-5L SOT-666 Flip-Chip Flip-Chip Flip-Chip Flip-Chip Flip-Chip QFN-8L QFN-12L Flip-Chip Flip-Chip Flip-Chip Package
Continued
Product table (cont'd)
Part number Main features Audio EMIF01-10005W5 EMIF02-MIC02F2 EMIF02-MIC03F2 EMIF02-SPK01F2 line filters level C=50pF; R=100 line filters level C=16pF; VBR=14V; Rs=470 line filters level C=100pF; VBR=6V; Rs=68 line filters level C=200pF; VBR=6V; Rs=10 device BAR63J BAS70-07S STTD15-xxx STVD901J STPAC02F2 diode; single; 0.3pF@0V Detection diode; dual triple; C=2pF@0V Detection diode;dual; C=1pF@0V Varicap single; 4pF@0V; capacitance ratio=2 Compensated temperature power amplifier control Power management STPS0520Z STPS0540Z STPS120M STPS1L20M STPS1L30M STPS1L40M SMTY18AM SM2T series Power Schottky; 0.5A, 20V; VF=0.32Vmax@0.5A Power Schottky; 0.5A, 20V; VF=0.40Vmax@0.5 Power Schottky; 20V; VF=0.41Vmax@1A Power Schottky; VF=0.37Vmax@1A Power Schottky; VF=0.34Vmax@1A Power Schottky; VF=0.40Vmax@1A Transky; VRM=16V; VF=0.48Vmax@0.85A Transil unidirectional; VRM=5 24V; Ppp=200W 10/1000µ SOD-123 SOD-123 STmite STmite STmite STmite STmite STmite SOD-323/SOD-523 SOT323-6L SOT323-6L/SOT-666 SOD-323/SOD523 Flip-Chip Flip-Chip Flip-Chip Flip-Chip Flip-Chip Package
STMicroelectronics February 2006 Printed Italy rights reserved
STMicroelectronics corporate logo registered trademark STMicroelectronics group companies. IPAD Eco-Pack registered trademarks STMicroelectronics. other names property their respective owners.
selected STMicroelectronics sales offices fax:
China 52574820; France 55489569; Germany 4605454; Italy 8250449; Japan 57838216; Singapore 6481 5124; Sweden 58774411; Switzerland 9292900; United Kingdom Eire 1628 890391; 2678
Full product information
Order code: BRMLDMOB0206
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Contents Advantages IPAD Available packages IPAD discretes applic

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