"Discrete Standard Group":Products Through-Hole packages:Lead Free com

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DSG/03/368
"Discrete Standard Group":Products Through-Hole packages:Lead Free component connections
2003/11/27
DSG/03/368 Product Family /Commercial Product Type Change Reason Change product Through Hole packages Package assembly material change Lead Free market requirements ROHS directive Description change ECOPACK specification Lead Free connections. Forecasted date change Forecasted date samples customer Forecasted date STMicroelectronics change qualification report availability Marking identify changed product Description qualification program Product Line(s) and/or Part Number(s) Manufacturing Location(s) Estimated Date first shipment Division Product Manager Division Q.A. Manager 17-Feb-2004 Product MGRs MGRs Date: Nov.27 Date: Nov.27 10-Feb-2004 27-Nov-2003 27-Nov-2003
Letter"E" package body Attached Qualification Plan Attached List
Customer Acknowledgement Receipt Please sign return STMicroelectronics Sales Office Qualification Plan Denied Qualification Plan Approved Name: Title: Company: Change Denied Change Approved Remark Date: Signature:
DSG/03/368
2003/11/27
PRODUCT/PROCESS CHANGE NOTIFICATION DSG/03/368
Discretes Standard Group Products Through-Hole packages: Lead-Free Component Connections
THIS CHANGE? purpose this change meet LEAD-FREE requirements market RoHS (Restriction Harmful Substances) directive. While wide variety electronic parts used electronic equipment contain lead, worldwide directives stipulate that lead contained packaging must reduced. Lead classified harmful substance cause health problems ingested. Because these considerations, conversion making lead-free products underway global scale. LEAD-FREE components defined STMicroelectronics ECOPACK® components implementation ECOPACK specification includes suppression Lead metal alloys used components lead finish.
WHAT CHANGE? Nature Change: Lead-free connections coating Affected process: plating dipping processes related through-hole devices Affected products: Power Signal Mosfet, Vipower, ICs, linear, Thyristors, Rectifiers Protection devices Detailed description change: Component Material attach material Current Process Process Involved Assembly sites China India Korea Malaysia Morocco Philippines Singapore
Pb/Sn/Ag soft solder (eutectic) Glue plating (SnPb85/15) dipping (SnPb60/40) Matte plating(*) Matte dipping SnAgCu)
Lead finishing With bake
ECOPACK components assembled with both current SnPb SnAgCu lead-free assembly processes. Besides change lead finish, change materials will made these components meet ECOPACK specification (see roadmap table). negative impact mechanical, thermal electrical parameters products, with reference product datasheet, been detected. identification ECOPACK products will achieved through specific labelling component boxes. There will change product code, packing modes standard delivery quantities.
WHEN? Qualification test results: reliability tests plan supporting qualification programme announced change provided appendix attached this document. reliability test report this qualification program available request.
Sampling: Samples devices used test vehicle dummy samples will available request according schedule provided roadmap table below.
Change implementation schedule: production changes first shipments will implemented indicated roadmap table below, depending work progress materials availability. given dates subject variation depending quality results test assembly capabilities.
Marking traceability: Whenever possible, letter will added marking pattern beside logo package body. traceability ECOPACK devices will ensured date code, "ECOPACK" indication boxes labelling Q.A. number.
Roadmap table:
Package
DIP-14 DIP-14 DIP-16 DIP-20 DIP-8 MiniDIP DIP-8 MiniDIP DOP3/TOP3 Heptawatt IPAK IPAK IPPAK ISOWATT218 ISOWATT218 ISOWATT220 Max220 Max247 Multiwatt Pentawatt Pentawatt Pentawatt PPAK SOD/SOT-93 SOD/SOT-93 SOT-32 SOT-32 SOT-82 TO18 TO202-1 TO202-3 TO-220 TO-220 TO-220 TO-220 TO-220 triacs TO-220 TO-220FP TO-220FP TO-220FP TO-247 TO-247 TO-247 TO39 TO-92 TO-92 TO-92 TO-92 TO-92
Assembly location
China Malaysia Malaysia Philippines China Philippines Philippines Morocco China Morocco China Morocco China Korea Morocco Morocco Morocco Morocco Singapore Morocco Morocco Philippines China Morocco Philippines India Morocco Morocco Malaysia Philippines Philippines China Korea Malaysia Morocco Morocco Philippines China Morocco Philippines Malaysia Morocco Philippines Malaysia Malaysia Malaysia China India Korea Malaysia Philippines
Pb-free material
SnAgCu
Samples Available
Production Start
Shipments
appendix
07-04
08-04
Delivery current product versions will continue while stocks last.
Appendix Reliability tests qualification program Appendix List available sample parts package.
Discretes Standard Group DSG/03/368 APPENDIX -Products Through-Hole packages: Lead-Free Component Connections Reliability Lead-free compatibility tests plan QUALIFICATION PROGRAM
LEAD-FREE COMPATIBILITY TESTS TEST
SOLDERABILITY SnPb BATH SOLDERABILITY SnAgCu BATH WETTING BALANCE TEST Whiskers inspection reject criteria: whisker with length 50µm Only plating
CONDITIONS
Aging 100°C Dipping 245°C Aging 100°C Dipping 245°C SnPb bath 235°C SnAgCu bath 245°C After (85°C 85%RH) After months 55°C After thermal cycling (-35 +125°C cycles)
DURATION
8Hrs 8Hrs
LOTS
package line package line package line package line
SAMPLE SIZE
Discretes Standard Group DSG/03/368 APPENDIX -Products Through-Hole packages: Lead-Free Component Connections List available samples
Samples available
LM393N M74HC14B1R, LM324N BTA26-600B BULB128-1 BULD118D-1 ST2001HI, ST1803DHI, ST2009DHI, ST2310DHI STTA512F STIL04-P5 TIP36C BD135, BD438, BD678, BD680, BULT118 BULK128 2N2222A BDX53B, BTA12-800CW,BTB24-800B, BTB24-600BRG, BUL742C, L7805CV, LD1085V36, LF50CDT-TR, TIP122, STPS20H100CT, TYN410 BD242BFP, BUL312FP, L78M05CP, STP14NF12FP, STP6NC60, STTH12R06FP, STTH15R06FP BUW1215, STPS3045CW, STW20NB50 2N3055 2N3440 2N4033 ACS108-5SA, L78L05ACZ-AP, PN2222A, STQ1NC454R-AP, STQ1NK60ZR-AP, STX13003, STX790A, STX715,STX817, TL431CZ, X00602MA 1AA2
Package
DIP-8 DIP-14 DIP-16 DIP-20 DOP3/TOP3 Heptawatt IPAK IPPAK ISOWATT218 ISOWATT220 Max220 Max247 MiniDIP Multiwatt Pentawatt Pentawatt PPAK SOD/SOT-93 SOT-32 SOT-82 TO18 TO202-1 TO202-3 TO-220 TO-220FP TO-247 TO39 TO-92
Information furnished believed accurate reliable However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties, which result from it's use. license granted implication otherwise under patent patent rights STMicroelectronics. Specifications mentioned this publication subject change without notice.This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics.
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2003/11/27

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