High breakdown voltage VCEO Complementary 2STA1962 Fast-switching spee

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High breakdown voltage VCEO Complementary 2STA1962 Fast-switching spee

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2STC5242
High breakdown voltage VCEO Complementary 2STA1962 Fast-switching speed Typical
Application
Audio power amplifier
TO-3P
Description
This device transistor manufactured using BiT-LA (Bipolar Transistor linear amplifier) technology. resulting transistor shows good gain linearity behaviour.
Figure
Internal schematic diagram
Table
Device summary
Order code 2STC5242 Marking 2STC5242 Package TO-3P Packaging Tube
July 2008
www.st.com
Electrical ratings
2STC5242
Electrical ratings
Table
Symbol VCBO VCEO VEBO Ptot Tstg
Absolute maximum ratings
Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Collector peak current Total dissipation 25°C Storage temperature Operating junction temperature Value Unit
Table
Symbol RthJ-case
Thermal data
Parameter Thermal resistance junction-case Value 0.83 Unit °C/W
2STC5242
Electrical characteristics
Electrical characteristics
(Tcase unless otherwise specified) Table
Symbol ICBO IEBO
Electrical characteristics
Parameter Collector cut-off current Emitter cut-off current Test conditions Min. Typ. Max. Unit
Collector-emitter breakdown V(BR)CEO(1) voltage V(BR)CBO Collector-base breakdown voltage
Emitter-base breakdown V(BR)EBO(1) voltage VCE(sat)(1) Collector-emitter saturation voltage Base-emitter voltage current gain Resistive load Turn-on time Storage time Fall time Transition frequency Collector-base capacitance
CCBO
IB1= -IB2
0.24
Pulsed: pulse duration duty cycle 1.5%
Electrical characteristics
2STC5242
Figure
Electrical characteristics (curves)
Safe operating area Figure Derating curve
Figure
Output characteristics
Figure
current gain
Figure
Collector-emitter saturation voltage Figure
Collector current base-emitter voltage
2STC5242
Electrical characteristics
Test circuit
Figure Resistive load switching test circuit
Fast electronic switch Non-inductive resistor
Package mechanical data
2STC5242
Package mechanical data
order meet environmental requirements, offers these devices ECOPACK® packages. These packages have Lead-free second level interconnect category second level interconnect marked package inner label, compliance with JEDEC Standard JESD97. maximum ratings related soldering conditions also marked inner label. ECOPACK trademark. ECOPACK specifications available www.st.com
2STC5242
Package mechanical data
TO-3P Mechanical data
DIM. MIN. 1.45 1.20 0.80 1.80 2.80 0.55 19.70 15.40 13.60 9.60 5.45 3.50 18.40 3.80 1.50 1.40 MAX. 1.65 1.60 1.20 2.20 3.20 0.75 20.10 15.80
0.60 19.90 13.90
5.15 19.50 18.20 3.10
5.75 20.50 18.60 3.30
Revision history
2STC5242
Revision history
Table
Date 28-Sep-2007 11-Dec-2007 14-Jul-2008
Document revision history
Revision Initial release. Document promoted from preliminary data datasheet. Updated total power dissipation relevant thermal resistance junction-case value. Changes
2STC5242
Revision history
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