Processed MIL-PRF-38535 Fast Instruction Cycle Time Source-Code Compat

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Processed MIL-PRF-38535 Fast Instruction Cycle Time Source-Code Compat

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SMJ320C50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Processed MIL-PRF-38535 Fast Instruction Cycle Time Source-Code Compatible With 'C1x 'C2x Devices RAM-Based Operation 9K-Words 16-Bit Dual-Access On-Chip Program/ Data 056-Word 16-Bit Dual-Access On-Chip Data 2K-Words 16-Bit On-Chip Boot 224K-Words 16-Bit Maximum Addressable External Memory Space (64K-Words Program, 64K-Words Data, 64K-Words 32K-Words Global) 32-Bit Arithmetic Logic Unit (ALU) 32-Bit Accumulator (ACC) 32-Bit Accumulator Buffer (ACCB)
16-Bit Parallel Logic Unit (PLU) 16-Bit Multiplier, 32-Bit Product Eleven Context Switch Registers Buffers Circular Addressing Full-Duplex Synchronous Serial Port Time-Division Multiplexed (TDM) Serial Port Timer With Control Counter Registers Software-Programmable Wait-State Generators Divide-By-1 Clock Option IEEE Standard 1149.1 (JTAG) Test-Access Port Operations Fully Static Fabricated Using Texas Instruments (TITM) Enhanced Performance Implanted CMOS (EPICTM) 0.72-µm Technology Military Operating Temperature Range 55°C 125°C
description
SMJ320C50KGD digital signal processor (DSP) high-performance, 16-bit, fixed-point processor manufactured 0.72-µm double-level metal CMOS technology. TI's military products currently employ three primary processes development known good dies (KGDs), which applied SMJ320C50 device. This process called DieMatesystem, developed MicroModule Systems (MMS) TI's Materials Controls Group. This system uses membrane probe technique make electrical contact individual within special carriers. Contact made without disturbances bond pads other than typical probe markings. Following burn-in test, dies simply removed from carrier, inspected, packed shipment. Future implementation SMJ320C50 employ hot-chuck-probe process. This process uses standard probed product that tested again, this time full data sheet specifications, wafer form speed elevated temperature (125°C). Each individual then sawed, inspected, packaged shipment. number enhancements basic 'C2x architecture give 'C50 minimum performance over previous generation. four-deep instruction pipeline, which incorporates delayed branching, delayed call subroutine, delayed return from subroutine, allows 'C50 perform instructions fewer cycles. addition gives 'C50 method manipulating bits data memory without using ALU. 'C50 additional shifting scaling capabilities proper alignment multiplicands storage values data memory.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. IEEE Standard 1149.1-1990, IEEE Standard Test-Access Port Boundary-Scan Architecture EPIC, DieMate trademarks Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 1997, Texas Instruments Incorporated
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SMJ320C50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD
description (continued)
With addition IDLE2 instruction, 'C50 achieves low-power consumption. IDLE2 removes functional clock from internal hardware 'C50 that puts into total-sleep mode using only low-logic level external interrupt with chip duration least five clock cycles ends IDLE2 mode.
Mil-Temp Product Flow Multiprobe Visual Test conditions test test Warranty Certificate Compliance Change notification 25°C chuck probe 125°C 100x military data sheet Tested data sheet -55°C 125°C Tested data sheet -55°C 125°C Speed Data sheet upon shipment, year
electrical timing specifications, SMJ320C50x Digital Signal Processor data sheet, (literature number SGUS020).
SPECIFIC DIE-RELATED INFORMATION Size (approx.) Thickness Backside Surface Finish Backside Potential Allowable Junction Operating Temperature Glassivation Material Thickness Recommended Packing Attach Information Suggested Bond Wire Size Suggested Bonding Method Sensitivity Allowable Process Temperature Attach mils mils 15.5 mils SIO2 Floating 175°C 3KAOX 9KACN PACK SILVER GLASS 1.25 WEDGE Class 450°C
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SMJ320C50 Information
LEFT XCENTER 5347.4 5161.8 4908.6 4773.6 4573.4 4139.3 3851.3 3515.3 3272.3 3024.8 2777.3 2421.0 2121.1 1702.6 1567.6 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 YCENTER 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 8552.8 8417.8 7859.8 7616.8 7321.3 7096.3 6871.3 6646.3 6323.9 6098.9 5818.7 5498.0 5363.0 4942.2 4764.3 4601.2 4466.2 4041.0 3789.2 3537.4 3201.4 2949.6 2697.8 2445.9 2035.1 NAME TRST VSS1 VSS2 MP/MC VDD1 VDD2 VSS3 VSS4 VDD3 VDD4 VSS5 VSS6 INT1 INT2 INT3 INT4 RIGHT BOTTOM XCENTER 106.3 106.3 106.3 1513.4 1648.4 2128.3 2403.3 2637.3 2912.2 3132.7 3407.7 3628.2 3903.1 4123.6 4398.6 4569.6 4704.6 4896.7 5319.6 5454.8 5646.0 5886.6 6161.6 6527.3 6802.3 7036.3 7311.2 8202.2 8337.2 8649.0 9195.5 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 YCENTER 1783.3 1353.6 1218.6 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 106.3 1253.8 1388.8 1902.0 2236.6 2524.8 2882.6 3168.8 3365.0 3625.7 NAME VDD5 VDD6 VSS7 VSS8 VDD7 VDD8 VSS9 VSS10 CLKMD1 VDD9 VDD10 VSS11 VSS12 STRB
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SMJ320C50 Information (Continued)
TOP-R XCENTER 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 10274.3 9201.4 8796.6 8540.1 8405.1 7927.9 7690.0 7456.5 7133.8 6956.1 6771.8 6587.5 6403.1 6016.9 5780.7 5645.7 YCENTER 3795.5 3950.6 4126.6 4296.2 4459.4 4594.4 4766.7 5085.1 5220.1 5375.3 5579.4 5866.1 6086.8 6379.1 6599.8 6820.5 7180.3 7558.5 8089.5 8224.5 8724.3 8859.3 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 9670.8 NAME CLKIN2 X2/CLKIN VDD11 VDD12 VSS13 VSS14 CLKMD2 TFSX/TFRM HOLDA CLKOUT1 IACK VDD13 VDD14 EMU0 EMU1/OFF VSS15 VSS16 TOUT TCLKX CLKX TFSR/TADD TCLKR READY HOLD VDD15 VDD16
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MECHANICAL DATA
MOUNT BOND
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TMS320C50BS
SMJ320C50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD
IMPORTANT NOTICE Texas Instruments (TI) reserves right make changes products discontinue semiconductor product service without notice, advises customers obtain latest version relevant information verify, before placing orders, that information being relied current. warrants performance semiconductor products related software specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques utilized extent deems necessary support this warranty. Specific testing parameters each device necessarily performed, except those mandated government requirements. Certain applications using semiconductor products involve potential risks death, personal injury, severe property environmental damage ("Critical Applications"). SEMICONDUCTOR PRODUCTS DESIGNED, INTENDED, AUTHORIZED, WARRANTED SUITABLE LIFE-SUPPORT APPLICATIONS, DEVICES SYSTEMS OTHER CRITICAL APPLICATIONS. Inclusion products such applications understood fully risk customer. products such applications requires written approval appropriate officer. Questions concerning potential risk applications should directed through local sales office. order minimize risks associated with customer's applications, adequate design operating safeguards should provided customer minimize inherent procedural hazards. assumes liability applications assistance, customer product design, software performance, infringement patents services described herein. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right covering relating combination, machine, process which such semiconductor products services might used.
Copyright 1996, Texas Instruments Incorporated

Processed MIL-PRF-38535 Fast Instruction Cycle Time Source-Code Compat

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