Military Operating Temperature Range -55°C 125°C, Processing Fast Inst
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SMJ320C30KGD FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Military Operating Temperature Range -55°C 125°C, Processing Fast Instruction Cycle Time 1K-Word 32-Bit Single-Cycle Dual-Access On-Chip Blocks 32-Bit Instruction Data Words, 24-Bit Addresses Integer, Floating-Point, Logical Operations 32-Bit Floating-Point Integer Multiplier Arithmetic Logic Unit (ALU) 24-Bit Integer Multiplier, 32-Bit Product 32-Bit Floating-Point Multiplier, 40-Bit Product Parallel Multiplier Execution Single Cycle 32-Bit Barrel Shifter Eight Extended-Precision Registers (Accumulators) Circular Bit-Reversed Addressing Capabilities Independent Bidirectional Serial Ports With Support 16-, 32-Bit Transfers
32-Bit Timers With Control Counter Registers Validated Compiler 64-Word 32-Bit Instruction Cache On-Chip Direct Memory Access (DMA) Controller Concurrent Operation 32-Bit Single-Cycle Dual-Access On-Chip Block 32-Bit External Ports (24- 13-Bit Addresses) Address Generators With Eight Auxiliary Registers Auxiliary Register Arithmetic Units (ARAUs) Zero-Overhead Loops With Single-Cycle Branches Interlocked Instructions Multiprocessing Support Two- Three-Operand Instructions Conditional Calls Returns Block-Repeat Capability Fabricated Using 0.8-µm Enhanced Performance Implanted CMOS (EPICTM) Technology Texas Instruments
description
SMJ320C30KGD digital signal processor (DSP) high-performance, 32-bit floating-point processor manufactured 0.8-µm, double-level metal CMOS technology. SMJ320C30KGD internal busing special digital-signal-processing instruction have speed flexibility execute million floating-point operations second (MFLOPS). SMJ320C30KGD optimizes speed implementing functions hardware that other processors implement through software microcode. This hardware-intensive approach provides performance previously unavailable single chip. SMJ320C30KGD perform parallel multiply operations integer floating-point data single cycle. Each processor also possesses general-purpose register file, program cache, dedicated ARAUs, internal dual-access memories, channel supporting concurrent short machine-cycle time. High performance ease results these features. large address space, multiprocessor interface, internally externally generated wait states, external interface ports, timers, serial ports, multiple interrupt structure enhanced general-purpose applications. SMJ320C30KGD supports wide variety system applications from host processor dedicated coprocessor. High-level language support easily implemented through register-based architecture, large address space, powerful addressing modes, flexible instruction set, well-supported floating-point arithmetic.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. EPIC trademark Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 1997, Texas Instruments Incorporated
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SMJ320C30KGD FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
known good (KGD) technology
options available multichip modules chip-on-board (COB) applications. current verification technology that supports requirements SMJ320C30KGD removable (R-Tab). availability selected products tape-automated bond (TAB) configuration made possible R-Tab technique. leadframe attached gold-bumped using nonoptimal bonding parameters. This technique allows easy removal after needed screens parametric tests complete. tape removed from tested part shipped conventional container. gold bumps remain bond pads which provide subsequent attachment gold ball bonds. Future implementation have only aluminum bond pads. Please contact factory current information.
electrical specifications
electrical timing specifications, SMJ320C30 Digital Signal Processor data sheet, literature number SGUS014.
PREFIX
MIL-PRF-38535
REVISION 'C30 Revision
DEVICE FAMILY Family
SPEED RANGE
TECHNOLOGY CMOS
TEMPERATURE RANGE 55°C 125°C 70°C
DEVICE Floating-Point
PACKAGE TYPE Known Good
Figure SMJ320C30KGD Device Nomenclature
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SMJ320C30KGD FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
JEDEC STANDARD
thickness approximately mils Backside surface finish silicon.
mil.
Maximum allowable junction operating temperature 175°C. Glassivation material compressive nitride. Bond metal composed copper-doped aluminum. Percent defective allowed burned-in Life test data available. Configuration control notification Group attribute summary available (SMJ only). Suggested die-attach material Silverglass (QMI 2569F). Suggested bond wire size 1.25 mil. Suggested bonding method gold-ball bonding. rating Class Maximum allowable peak process temperature attach 440°C kerf dependent blade size used. backside potential left floating.
"5°C (for 2569F).
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SMJ320C30KGD FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
SMJ320C30KGD (rev 5.3) known good information
Figure shows SMJ320C30KGD die-numbering format. Table SMJ320C30KGD information.
Number Side Number
Side Number
Side Number
Designator
Zero-Zero (origin) Side Number
Figure '320C30KGD Die-Numbering Format (See Table Table provides reference following:
'C30 signal identities relation numbers 'C30 coordinates, where bond serves origin (0,0)
addition, significant specifications include: coordinate data microns. Coordinate origin (0,0) (center bond 51). active silicon dimensions 224.00 032.00 (402.52 mils 434.33 mils). size approximately 353.8 (415.00 mils 447.00 mils). Bond dimensions 115.00 115.00 (4.53 mils 4.53 mils). Gold bump dimensions approximately 97.2 77.2 (3.83 mils 3.04 mils), with longer edge bump lying adjacent outer edge die. Center bond edge ranges from (7.1 mils mils). range exists since dicing process results some tolerance. consistency precision bond locations reference each other, center bond chosen origin.
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SMJ320C30KGD FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Table '320C30KGD Information (0,8
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY PDVDD PDVDD FSR0 CLKR0 CLKX0 FSX0 TCLK0 TCLK1 EMU6 IODVDD IODVDD XD10 XD11 XD12 XD13 XD14 XD15 XD16 XD17 XD18 XD19 XD20 XD21 XD22 XD23 XD24 XD25 XD26 XD27 XD28 XD29 XD30 IODVDD IODVDD X-COORDINATE BOND Y-COORDINATE BOND 9563.00 9367.80 9199.20 9007.20 8823.20 8631.20 8447.20 8255.20 8071.20 7879.20 7695.20 7503.20 7319.20 7127.20 6947.00 6751.80 6583.20 6399.20 6207.20 6023.20 5831.20 5647.20 5455.20 5271.20 5083.20 4887.80 4731.00 4535.80 4367.20 4183.20 3991.20 3807.20 3615.20 3431.20 3239.20 3055.20 2863.20 2679.20 2487.20 2303.20 2111.20 1927.20 1735.20 1551.20 1359.20 1175.20 983.20 799.20 619.00 423.80
423.80
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Table '320C30KGD Information (0,8 (Continued)
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY DVSS DVSS CVSS CVSS XD31 ADVDD ADVDD EMU0 EMU1 EMU2 EMU3 EMU4 XA12 XA11 XA10 IVSS IVSS DVSS DVSS X-COORDINATE BOND 0.00 195.20 374.80 570.00 746.60 983.60 1138.60 1338.60 1530.60 1730.60 1922.60 2122.60 2322.60 2514.60 2714.60 2902.80 3098.00 3274.60 3474.60 3666.60 3866.60 4066.60 4258.60 4458.60 4650.60 4846.80 5042.00 5214.80 5410.00 5578.60 5778.60 5970.60 6170.60 6370.60 6562.60 6774.80 6990.80 7198.80 7402.60 7606.80 7822.80 8026.60 8218.60 8418.60 8610.60 8810.60 9010.60 9202.60 9398.80 9594.00 9758.80 9954.00 Y-COORDINATE BOND
0.00
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Table '320C30KGD Information (0,8 (Continued)
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY ADVDD ADVDD DDVDD DDVDD DDVDD DDVDD X-COORDINATE BOND Y-COORDINATE BOND 430.60 625.80 764.40 986.40 1170.40 1362.40 1546.40 1738.40 1922.40 2114.40 2298.40 2490.40 2674.40 2866.40 3046.60 3241.80 3410.40 3594.40 3786.40 3970.40 4162.40 4346.40 4538.40 4722.40 4910.60 5105.80 5262.60 5457.80 5626.40 5810.40 6002.40 6186.40 6378.40 6562.40 6754.40 6938.40 7130.40 7314.40 7506.40 7690.40 7882.40 8066.40 8258.40 8442.40 8634.40 8818.40 9010.40 9194.40 9374.60 9569.80
10377.80
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SMJ320C30KGD FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Table '320C30KGD Information (0,8 (Continued)
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY DVSS DVSS CVSS CVSS CLKIN VSUBS VBBP EMU5 XRDY MSTRB IOSTRB HOLDA HOLD MDVDD MDVDD STRB RESET IACK INT0 INT1 INT2 INT3 RSV0 RSV1 RSV2 RSV3 RSV4 RSV5 RSV6 RSV7 RSV8 RSV9 RSV10 FSR1 CLKR1 CLKX1 FSX1 DVSS DVSS X-COORDINATE BOND 9947.20 9752.00 9587.20 9392.00 9217.00 9043.80 8696.00 8535.40 7935.40 7739.40 7551.40 7359.40 7175.40 6991.40 6795.20 6611.20 6416.00 6243.20 6055.40 5863.40 5667.20 5479.40 5295.40 5111.40 4915.20 4731.20 4536.00 4371.20 4176.00 4003.20 3803.20 3603.20 3403.20 3203.20 3003.20 2795.20 2595.20 2407.40 2223.40 2039.40 1855.40 1671.40 1479.40 1295.40 1111.40 927.40 743.40 559.40 375.40 195.20 0.00 Y-COORDINATE BOND
9986.80
9993.60
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IMPORTANT NOTICE Texas Instruments (TI) reserves right make changes products discontinue semiconductor product service without notice, advises customers obtain latest version relevant information verify, before placing orders, that information being relied current. warrants performance semiconductor products related software specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques utilized extent deems necessary support this warranty. Specific testing parameters each device necessarily performed, except those mandated government requirements. Certain applications using semiconductor products involve potential risks death, personal injury, severe property environmental damage ("Critical Applications"). SEMICONDUCTOR PRODUCTS DESIGNED, INTENDED, AUTHORIZED, WARRANTED SUITABLE LIFE-SUPPORT APPLICATIONS, DEVICES SYSTEMS OTHER CRITICAL APPLICATIONS. Inclusion products such applications understood fully risk customer. products such applications requires written approval appropriate officer. Questions concerning potential risk applications should directed through local sales office. order minimize risks associated with customer's applications, adequate design operating safeguards should provided customer minimize inherent procedural hazards. assumes liability applications assistance, customer product design, software performance, infringement patents services described herein. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right covering relating combination, machine, process which such semiconductor products services might used.
Copyright 1996, Texas Instruments Incorporated
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