INTRODUCTION Since their introduction years SGSTHOMSON, ZEROPOWER RAMs

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INTRODUCTION Since their introduction years SGSTHOMSON, ZEROPOWER RAMs

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ZEROPOWER TIMEKEEPER SRAM SURFACE MOUNTED SNAPHAT PACKAGE
INTRODUCTION Since their introduction years SGSTHOMSON, ZEROPOWER RAMs, self contained battery backed-up static memories, have offered system designer non-volatile memory with excellent performance characteristics. date, though, battery-basednon-volatile SRAMs have been offered some form dual-in-line package. non-volatile technology evolved into surface mount configurations primary reason that energy cell cannot survive ultra high temperatures needed solder reflow. SNAPHATpackage from SGSTHOMSON overcomes this obstacle offers industry's first integrated battery backed SRAM that surface mounted. This revolutionary surface mount design combines company's patented monolithic memory battery control circuitry with unique battery housing small outline package form highly compact solution. SNAPHAT package consists parts: JEDEC standard Small Ouline package (SO) attachable battery housing. package conventional press fitted sockets both ends. Once other surface mount components attached printed circuit board battery housing, with four interconnect pins mechanically, locks package provide energy backup event system power loss. SGS-THOMSON designed SNAPHAT package with long term reliability mind. Critical contact points socket battery package pins gold plated resist oxidation. Internally, each socket contains independent contact fingers form redundant connections between components. These sockets were designed provide high point contact force scrape away potential contamination from users assembly process. Furthermore, battery package flexible snaps both ends firmly secure housing package. addition ZEROPOWER® RAM, TIMEKEEPERRAM, which incorporates built-in real time clock, also offered SNAPHAT package. This device includes crystal attachable housing which allows timekeeping function continue absence system power. When assembled, SNAPHAT ZEROPOWER TIMEKEEPER offer non-volatile memory real time clock solution with smallest footprint form factor market today. Director Memory Products Group Quality Control Reliability
QR103/0494
QR103 Qualification Report
QUALIFICATION TEST PLAN qualification strategy included stressing SNAPHAT housing package separately well assembled module form. This allowed evaluation possible failure modes. test vehicle chosen M48T08. Each component different reliability manufacturing concerns that were addressed qualification. These summarized Table Based this analysis, qualification test plan, described Table used qualify ZEROPOWER SNAPHAT package. Specific details test methods chapter "Description Qualification Tests". Samples stress were taken from backend production lots were divided equally between stresses. results stressing described chapter "Qualification Test Results".
Table Reliability Concerns Failure versus Stress Matrix
Component Potential Failure Mechanism Package "POPCORN" Failures Bonding Failures Moisture Induced Failures Female Corrosion SNAPHAT Housing Battery Crystal Welds Poor Battery Lifetime Male Plating Peeling, Cracking Module SNAPHAT Operational Life Failures Moisture Induced Failures Loss Memory with Male/Female Corrosion Accelerated Life 125°C Temperature Humidity 85°C Storage, Temperature Cycle, both with Patterns Temperature Humidity, Post Stress Visual Inspection 100°C, 125°C, 140°C Storage, Temperature Cycle Welding Characterization, Pull Strengths 100°C, 125°C, 140°C Storage, Temperature Cycle 100°C, 125°C, 140°C Storage, Temperature Cycle Resistance Surface Mount Temperature Cycling: -40°C 125°C Autoclave HAST Autoclave HAST Stress Used Verify Reliability
Table Qualification Test Plan Module
Stress Temperature Humidity Temperature Cycling High Temperature Storage with Patterns Condition 85°C, R.H. 85%, 5.5V -40°C 125°C 85°C Duration 1000 cycles 1000 Samples
QR103 Qualification Report
Table Qualification Test Plan Package
Stress Operational Life HAST Autoclave Temperature Cycling Resistance Surface Mounting Condition 125°C 131°C, R.H. 85%, 121°C, R.H. 100%, Unbiased -40°C 125°C "Description Qualification Tests" Duration 1000 1000 cycles Samples
Table Qualification Test Plan SNAPHAT Housing
Stress High Temperature Storage High Temperature Storage High Temperature Storage Condition 100°C 125°C 140°C Duration Sigma Volts Sigma Volts Sigma Volts Samples
DESCRIPTION QUALIFICATION TEST qualification devices this program were sampled from four separate assembly lots. samples were processed through standard production flow including Final Test described Table These units were subjected reliability tests described follows. High Temperature Operational Life High Temperature Operating Life (H.T.O.L) testing performed accelerate failure mechanisms which thermally activated through application extreme temperatures biased operating conditions. H.T.O.L. testing performed 125°C volts. high voltage stress increases electric field strength across gate interlevel oxides well beyond level device will encounter during application, thereby providing maximum acceleration potential dielectric breakdown failures. This stress also increases active currents power dissipation, thereby increasing acceleration electromigration failures. devices were exercised sequentially addressing cells memory array alternately writing reading complementing data. Temperature Humidity Biased Test Temperature Humidity Bias (T.H.B.) testing performed assess moisture resistance plastic encapsulated devices. Failure mechanisms expected primarily corrosion external leads connections, aluminum traces within IC's. test samples were stressed 85°C statically biased achieve minimum power dissipation junction heating. Input pins were alternatelybiased order maximize numberof biased gaps accelerate electrolytic corrosion metallization. This stress performed hours. Extreme care taken prevent dryout packages during period when devices were removed from stress electrical readouts storing them 25°C, wet-box. initial final electrical tests were performed 70°C; however, interim tests were performed 25°C prevent baking moisture devices during test.
QR103 Qualification Report
Temperature Cycling Temperature cycle testing accelerates effects thermal expansion coefficient mismatch among different components within given packaging system. This stress performed accordance with MIL-STD-883C, Method 1010. Qualification components were stressed from -40°C 125°C minimum 1000 cycles. Modules were tested with "final pattern" written into memory array. readpointswas occurred, memory read this pattern remained memory. Failure read proper data cause stress failure. High Temperature Storage SNAPHAT This stress accelerates evaporation liquid electrolyte within battery indicated decreasing battery voltage over time. Three temperatures 140°C, 125°C, 100°C will used determine acceleration factor evaporation. resultant data will compared historical values when stressing iscompleted later 1994. effects high temperaturestressing physical joints through aging expansion dissimilar materials will also assessed. High Temperature Storage with Patterns Module determine modules ability retain patterns high storage temperatures test pattern written into memory completed SNAPHAT module. then removed unbiased units were stored 85°C oven. first test each readpoint verification this pattern, failure revealed corrupted missing. Resistance Surface Mounting effects surface mounting package were determined using series preconditions, stresses, evaluations. flow listed Table Devices were baked dry, then exposed cycles -40°C 60°C temperature cycle which stresses leadframe-to-plastic interface order later maximize moisture uptake. units were then into 85°C, relative humidity chamber hours which gave units moisture content approximately 1400 weight. This immediately followed exposure infrared radiation source which produced maximum body temperature 215°C measured with thermocouple. Post stress testing included external visual inspection cracks, electrical test cracks, internal cross-sectioning diepad-to-leadframe cracks.
Table Resistance Surface Mounting Stress Flow
Stress Storage Temperature Cycling Moisture Exposure Infrared Exposure Visual Inspection Electrical Test Cross Section 125°C -40°C 60°C 85°C, R.H. 215°C External Cracks Final Test Internal Cracks Condition Duration cycles
QR103 Qualification Report
QUALIFICATION TEST RESULTS This section contains results stressing described chapter "Qualification Test Plan". Four backend lots were assembled submitted reliability testing. stresses used, along with results each readpoint, have been compiled tables below. Module Stressing Results Biased Temperature Humidity stressing produced failures through 2000 hours stress. sample units were deprocessed this readpoint evidence internal metal corrosion gold contact deterioration including cracking, peeling, corrosion. degradation kind detected. Also Temperature Cycling 85°C storage with patterns, data corruption failures occurred indicating SNAPHAT housing package connections remained intact throughout stress. Post stress inspection both male female connection pieces after 1000 cycles indicate corrosion other physical deformation. SNAPHAT Housing Stressing Results 100°C, 125°C, 140°C high temperature storage tests have exhibited battery lifetimes comparable standard CAPHATpackage. Stressing will continue until battery life which expected later 1994. Brand Permanency, Physical Dimension, X-ray indicated good construction dimensional characteristics. Table Qualification Tests Results Module
Stress Temperature Humidity: hours Readpoint 1500 cycles cycles 1000 cycles 2000 cycles 1000 Samples Failures Notes
Temperature Cycling: -40°C 125°C with Stored Patterns
Storage with Stored Patterns: 85°C
Table Qualification Tests Results SNAPHAT
Stress High Temperature Storage: 140°C High Temperature Storage: 125°C High Temperature Storage: 100°C Brand Permanency Physical Dimension X-Ray Readpoint 1000 1500 2000 Samples Failures mean Sigma Volts mean Sigma Volts Notes
Note: Readpoint indicates last time units fail failure criteria.
QR103 Qualification Report
QUALIFICATION TEST RESULTS (cont'd) Stressing Results OperationalLife stressing producefailures. M48T08 device used this qualification mature, well documented product. technology manufacture this focus this qualification. However interactions with minor process changes from standard package manufacturing were examined. temperature cycle test performed samples increased sample size this stress allowed measurement parameters tested module form such Battery Current (IBAT). failures occurred this stress. HAST Autoclave were critical tests understand gold plated connectors would corrode resistant moisture package would Post stress, examination female pins, which attached package, resulted neither corrosion, cracking, peeling gold plating. With determination electrical failures during stress evidence post stress corrosion, connection package system chosen have been established very reliable. addition qualificationtesting, Failure Mode Effects Analysis (FMEA) documented. process FMEA used means assure that, extent possible, potential manufacturing concerns have been considered addressed. most rigorous form, FMEA summary developement process. This includes analysis experiences past concerns relations potential failures. then develops list potential failure modes ranked according their effects final product, thus establishing priority system corrective action considerations. FMEA then reviewed risk factors reassessed corrective actions controls implemented process matures. Results this FMEA obtained contacting SGS-THOMSON.
Table Qualification Tests Results
Stress Operational Life: 125°C Readpoint 1000 1000 1300 215C Reflow after soak Samples Failures Notes
Temperature Cycling: -40°C 125°C
HAST Autoclave Resistance Surface mounting
QR103 Qualification Report
FAILURE RATE CALCULATIONS While adequate models derating accelerated test data various environmental stresses (T.H.B., Temperature Cycle, HAST) actual conditions available, package 125°C Operating Life Test data been derated 55°C shown below:
Stress Devicehrs 276,000 0.7eV Equiv. 55°C Device-hrs 21.3M
Test Operational Life
Number Tested
Fail
Failure Rate
stress hours were derated from 125°C 55°C using Arrhenius Model assuming activation energy. This gives estimated device failure rate 55°C (Tj) FITS assuming: Arrhenius temperature acceleration device hours from 125°C 55°C 77.4 0.7eV Voltage Acceleration from 5.5V using Berman model oxide failures. Chi-Squared Failure Distribution,
SUMMARY CONCLUSIONS After reviewing qualification data, manufacturing support documentation, corrective actions that currently place, Surface Mount ZEROPOWER Package been released manufacturing. During first months production, this product will sampled monthly SGS-THOMSON Product Monitoring Program order assure continual product quality. Samples will then reviewed quarterly. data will published quarterly Report published Carrollton Quality Reliability group.
QR103 Qualification Report
Table Assembly Test Technical Description ASSEMBLY PACKAGE Small Outline Package Type: Assembly Location: Female pins: (MH) Package (JEDEC MO-059) Carrollton, Texas Shell finish: 200-400 microinches over 100-150 microinches Nickel Contact finish: 30-35 microinches Gold over 50-100 microinches Nickel Ablestik 84-1 LMIS Epoxy Copper with spot silver, Size: mils mils Gold Thermosonic Bonding Sumikon 6300HG 175°C, hours Solder-plate, tin, lead
Attach Adhesive: Leadframe: Wire Bonding: Molding Compound: Cure Conditions: Lead Finish: SNAPHAT HOUSING Shell: Encapsulant: Male pins:
General Electric Valox Thermoplastic Hysol XES-0491 Brass Alloy 360, hard with plating finish 30-35 microinches Gold over 50-100 microinches Nickel.
TEST Test Finishing Location: PACKAGE Preburn: Burn-in: Final Test Final Test Final Electrical: Final Visual: SNAPHAT HOUSING Final Test Carrollton, Texas
100% 80°C AC-DC-Functional Test, Teradyne hours, 125°C 100% 80°C AC-DC-Functional Test, Teradyne 100% 25°C AC-DC-Functional Test, Teradyne 0.1% AQL; n=125, 25°C, AC-DC-Functional Test 0.25% AQL; n=50,
Battery Voltage Crystal impedance, 80°C, based tester using View software.
QR103 Qualification Report
Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics Rights Reserved ZEROPOWER registered trademark SGS-THOMSON Microelectronics TIMEKEEPER, SNAPHAT CAPHAT trademarks SGS-THOMSON Microelectronics
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INTRODUCTION Since their introduction years SGSTHOMSON, ZEROPOWER RAMs

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