MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM (max) (max) 0.57 VERY SM

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MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM (max) (max) 0.57 VERY SM

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STPS340U/S/B
MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM (max) (max) 0.57
VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES FORWARD VOLTAGE DROP THERMAL RESISTANCE EXTREMELY FAST SWITCHING SURFACE MOUNTED DEVICE DESCRIPTION Single chip Schottky rectifier suited Switch Mode Power Supplies high frequency converters. Packaged SMB, DPAK this device intended medium voltage operation, high frequency inverters, free wheeling polarity protection applications where switching losses required. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM Tstg dV/dt Parameter Repetitive peak reverse voltage forward current Average forward current Surge repetitive forward current Repetitive peak reverse current Storage temperature range Maximum operating junction temperature Critical rate rise reverse voltage 135°C 105°C
DPAK STPS340B
(JEDEC DO-214AA) STPS340U
(JEDEC DO-214AB) STPS340S
Value DPAK DPAK
Unit
Sinusoidal 1kHz square
10000 V/µs
June 1999
STPS340U/S/B
THERMAL RESISTANCES Symbol (j-l) (j-c) Parameter Junction leads Junction case DPAK Value Unit °C/W °C/W
STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Reverse leakage current Forward voltage drop Tests Conditions 25°C 125°C 25°C 25°C 125°C 125°C
Pulse test evaluate maximum conduction losses following equation 0.42 IF(AV) 0.050 IF2(RMS)
Min.
Typ.
VRRM VRRM 0.52 0.63
Max. 0.63 0.84 0.57 0.72
Unit
Fig. Average forward power dissipation versus average forward current.
PF(av)(W)
0.05
Fig. Average current temperature =0.5).
IF(av)(A)
Rth(j-a)=65°C/W
versus
ambient
Rth(j-a)=Rth(j-c) (DPAK)
Rth(j-a)=Rth(j-l) (SMB/SMC)
IF(av)
=tp/T
=tp/T
Tamb(°C)
STPS340U/S/B
Fig. 3-1: repetitive surge peak forward current versus overload duration (SMB)(Maximum values). Fig. 3-2: repetitive surge peak forward current versus overload duration(SMC) (Maximum values).
IM(A) 1E-3
IM(A)
Ta=25°C
Ta=25°C
Ta=50°C
Ta=100°C
Ta=50°C
Ta=100°C
=0.5
=0.5
t(s) 1E-2 1E-1 1E+0
1E-3
t(s)
1E-2 1E-1 1E+0
Fig. 3-3: repetitivesurge peak forward current versus overload duration (DPAK) (Maximum values).
IM(A)
Fig. 4-1: Relative variation thermal transient impedance junction lead versus pulse duration (SMB).
Zth(j-a)/Rth(j-a) Printed circuit board (e=35µm) tp(s) Single pulse 1.0E-2 1.0E-1 1.0E+0 1.0E+1
Tc=25°C
Tc=50°C Tc=100°C
=0.5
1E-3
t(s)
1E-2 1E-1 1E+0
=tp/T
1.0E+2
1.0E+3
Fig. 4-2: Relative variation thermal transient impedance junction lead versus pulse duration (SMC).
Zth(j-a)/Rth(j-a) Printed circuit board (e=35µm) tp(s) Single pulse 1.0E-2 1.0E-1 1.0E+0 1.0E+1
Fig. 4-3: Relative variation thermal transient impedance junction lead versus pulse duration(DPAK).
Zth(j-a)/Rth(j-a)
=tp/T
1.0E+2
1.0E+3
Printed circuit board (e=35µm) Single pulse 1E-3 1E-2
tp(s)
=tp/T
1E-1
1E+0
STPS340U/S/B
Fig. Reverse leakage current versus reverse voltage applied (Typical values). Fig. Junction capacitance versus reverse voltage applied (Typical values).
IR(A) 1E-2
Tj=150°C
C(pF)
F=1MHz Tj=25°C
Tj=125°C
1E-3
Tj=100°C
1E-4
Tj=75°C
VR(V) 1E-5
VR(V)
Fig. Forward voltage drop versus forward current (Maximum values).
Fig. 8-1: Thermal resistance junction ambient circuit boardFR4, copperthickness: 35µm) (SMB).
Rth(j-a) (°C/W)
10.00
IFM(A)
Typical values Tj=150°C
Tj=125°C
1.00
0.10 VFM(V) 0.01
S(Cu)
Fig. 8-2: Thermal resistance junction ambient versus coppersurface undereachlead(Epoxyprinted circuit boardFR4, copperthickness:35µm) (SMC).
Rth(j-a) (°C/W) S(Cu)
Fig. 8-3: Thermal resistance junction ambient versuscoppersurface undereachlead (Epoxyprinted circuit boardFR4, copperthickness:35µm) (DPAK).
Rth(j-a) (°C/W)
S(Cu)
STPS340U/S/B
PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. Millimeters Min. 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039
FOOTPRINT DIMENSIONS millimeters)
STPS340U/S/B
PACKAGE MECHANICAL DATA
DIMENSIONS REF.
Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
FOOTPRINT DIMENSIONS millimeters)
1.52
2.75
1.52
STPS340U/S/B
PACKAGE MECHANICAL DATA
DIMENSIONS REF.
Millimeters Min. 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 Max. 2.45 0.20 0.41 8.15 7.15 4.70 6.25 1.60
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
FOOTPRINT DIMENSIONS millimeters)
Ordering type STPS340U STPS340S STPS340B STPS340B-TR
Marking S340 S340
Package DPAK DPAK Weight 0.107g 0.243g 0.30g 0.30g Base 2500 2500 2500 Delivery mode Tape reel Tape reel Tube Tape reel
Band indicates cathode SMB, Epoxy meets UL94,V0
Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringementof patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics.
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MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM (max) (max) 0.57 VERY SM

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