RESULT ITEM (#1) METHOD 260) Soldering heat stress reflow pe

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RESULT ITEM (#1) METHOD 260) Soldering heat stress reflow pe

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Reliability Test Result DEVICE BA2901S Family
RESULT
ITEM (#1) METHOD 260)
Soldering heat stress reflow peak 260)
CONDITION
(pcs)
(pcs)
Resistance Soldering Heat
(#1)
260±3
Soak into solder 260±3
Resistance Soldering Heat
10sec
(#2)
Tstg (30min) Tstg (30min)
Temperature Cycling
100cycles
Steady State Operating Life Test
Topr
Apply specified voltage Topr
1000hours
High Temperature Storage
Tstg
Storage Tstg
1000hours
Temperature Storage
Tstg
Storage Tstg
1000hours
(#2)
Ta=85
RH=85
Temperature Humidity Storage
Place Ta=85 RH=85%
1000hours
(#2)
Ta=85
RH=85
Temperature Humidity Bias
Apply specified voltage Ta=85 RH=85%
1000hours
(#2)
Ta=121 RH=100
Pressure Cooker
Storage Ta=121 RH=100% 2atm
100hours
(HBM)
Electro Static Discharge (HBM)
C=100pF
R=1.5k,
±2000V
(MM)
Electro Static Discharge (MM)
C=200pF
R=0,
±200V ±200mA
Latch-up
Current Latch
SOP14, SSOP-B14, VQFN16 Preconditioning Bake,Ta=125 Soak,Ta=85 RH=85% 168h
(#1)
(#2) Preconditioning Bake,Ta=125 Soak,Ta=85 RH=85% 168h Reflow, Peak=260
Copyright 2008 ROHM Co., Ltd. rights reserved.
Excellence Electronics
Appendix
Notes
technical content pages this document reproduced form transmitted means without prior permission ROHM CO.,LTD. contents described herein subject change without notice. specifications product described this document reference only. Upon actual use, therefore, please request that specifications separately delivered. Application circuit diagrams circuit constants contained herein shown examples standard operation. Please careful attention peripheral conditions when designing circuits deciding upon circuit constants set. data, including, limited application circuit diagrams information, described herein intended only illustrations such devices specifications such devices. ROHM CO.,LTD. disclaims warranty that such devices shall free from infringement third party's intellectual property rights other proprietary rights, further, assumes liability whatsoever nature event such infringement, arising from connected with related such devices. Upon sale such devices, other than buyer's right such devices itself, resell otherwise dispose same, express implied right license practice commercially exploit intellectual property rights other proprietary rights owned controlled ROHM CO., LTD. granted such buyer. Products listed this document antiradiation design.
products listed this document designed used with ordinary electronic equipment devices (such audio visual equipment, office-automation equipment, communications devices, electrical appliances electronic toys). Should intend these products with equipment devices which require extremely high level reliability malfunction which would directly endanger human life (such medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers other safety devices), please sure consult with sales representative advance. priority supply products with utmost quality reliability. However, there always chance failure unexpected factors. Therefore, please take into account derating characteristics allow sufficient safety features, such extra margin, anti-flammability, fail-safe measures when designing order prevent possible accidents that result bodily harm fire caused component failure. ROHM cannot held responsible damages arising from products under conditions range specifications non-compliance with NOTES specified this catalog.
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Appendix1-Rev2.0

RESULT ITEM (#1) METHOD 260) Soldering heat stress reflow pe

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