Photo Link Modules Recommended soldering conditions (Lead frame t

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Photo Link Modules Recommended soldering conditions (Lead frame t

Datasheet Thumbnail

Top Searches for this datasheet

Remote control receiver Modules
Photo Link Modules
Recommended soldering conditions (Lead frame type) apply high temperature exceeding maximum storage temperature epoxy resin. apply force epoxy resin high temperature. Soldering process distance between holes should same that between terminal leads component avoid stress during soldering process. stress lead open circuit. Also, lead forming should done before soldering process apply stress inside epoxy resin. apply stress component during soldering process. Recommended soldering condition.
(Condition)
Pre-heating solder bath Pre-heating Less than Solder bath Less than Soldering area away from bottom epoxy resin. time Less than seconds. Less than twice.
(Lead frame type)
Soldering iron
Temperature Less than within seconds,2times Soldering area away from bottom epoxy resin.
Rev.B
Appendix
Notes
technical content pages this document reproduced form transmitted means without prior permission ROHM CO.,LTD. contents described herein subject change without notice. specifications product described this document reference only. Upon actual use, therefore, please request that specifications separately delivered. Application circuit diagrams circuit constants contained herein shown examples standard operation. Please careful attention peripheral conditions when designing circuits deciding upon circuit constants set. data, including, limited application circuit diagrams information, described herein intended only illustrations such devices specifications such devices. ROHM CO.,LTD. disclaims warranty that such devices shall free from infringement third party's intellectual property rights other proprietary rights, further, assumes liability whatsoever nature event such infringement, arising from connected with related such devices. Upon sale such devices, other than buyer's right such devices itself, resell otherwise dispose same, express implied right license practice commercially exploit intellectual property rights other proprietary rights owned controlled ROHM CO., LTD. granted such buyer. Products listed this document antiradiation design.
products listed this document designed used with ordinary electronic equipment devices (such audio visual equipment, office-automation equipment, communications devices, electrical appliances electronic toys). Should intend these products with equipment devices which require extremely high level reliability malfunction with would directly endanger human life (such medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers other safety devices), please sure consult with sales representative advance. About Export Control Order Japan Products described herein objects controlled goods Annex (Item Export Trade Control Order Japan. case export from Japan, please confirm applies "objective" criteria "informed" MITI clause) basis "catch controls Non-Proliferation Weapons Mass Destruction.
Appendix1-Rev1.1

Photo Link Modules Recommended soldering conditions (Lead frame t

Top Searches for this datasheet

Other recent searches