QUALITY POLICY establish maintain system continuously grasping an
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QUALITY POLICY
QUALITY POLICY
establish maintain system continuously grasping analyzing customer expectations needs reflecting them products services. continuously propose provide quality products that satisfy customer expectations needs. promptly effectively respond customer demand.
QUALITY TARGETS
improve quality one's work, including conformance social expectations such environmental protection safety, thereby assuring quality one's responsibility. prevent eliminate recurrence reported nonconformities. reduce defects products supplied RICOH.
QUALITY SYSTEM
order ensure that product conforms stipulated requirements, documented Quality System been established. Quality System communicated enforced concerned personnel this Division. Quality manuals have been established ensure implementation Quality System based requirements ISO9001(1994). Written standards procedures efficiently implementing Quality System meeting stipulated requirements have been established, implemented accordingly. order accurately ascertain quality requirements satisfy items constituting quality elements development products technologies, methods identifying implementation plans, management means, processes, resources verification methods documented. order satisfy stipulated requirements respect products technological development, quality plans, including development specifications, development plans, etc., specifying production flows, material procurement, outsourcing procurement, etc., documented.
<DOCUMENTATION SYSTEM>
Examples
POLICY
Quality manuals
PRIMARY Documentation
Company standards STIPULATIONS, STANDARDS Division standards: General management standards Technical management standards Departmental management standards SECONDARY Documentation
DEPARTMENTAL STANDARDS, OPERATIONAL DOCUMENTATION
Operational standards Operational instructions
TERTIARY Documentation
Records, Drawings, QUALITY DOCUMENTATION Specifications, Data, Travelers
QUATERNARY Documentation
QUALITY ASSURANCE SYSTEM
STEP CUSTOMER INFORMATION PLAN BUSINESS CONSIDERATION DELIBERATION DEVELOPMENT SPECIFICATION INFORMATION INVESTIGATION EVALUTION DESIGN PLANNING DEVELOPMENT SPECIFICATION PRODUCT SPECIFICATION DESIGN ASSESSMENT PRODUCT DESIGN DESIGN DESIGN REVIEW TRIAL PRODUCTION
CHARACTERISTICS EVALUATION
COUNCIL
SALES
DESIGN
ENGIN.
PRODU.
PURCH.
P.PLAN
(TS) EVALUATION TRIAL PRODUCTION RELIABILITY TEST EVALUATION
EPARATION
(CS) DELIBERATION MASS PRODUCTION SPECIFICATION SPEC.SEND RECEIVE INDICATION MEETING PRODUCTION MARKETING PRODUCT CLAIM SHIPMENT
PRODUCTION PREPARATION
PRODUCTION
MASS PRODUCTION TEST
SALES
QULITY PROBLEM ACTION PLAN PERIODICAL QUALITY CONFERENCE FAILURE ANALISYS CORRECTIVE ACTION REPORT
QUALITY
ANALISYS REPORT AUDIT QUALITY SYSTEM PRODUCT CORRECTIVE ACTION CHECK
QUALITY CONTROL FLOW CHART
PROCESS QUALITY CONTROL METHOD
Materials
Incoming Inspection
Materials Inspection Data Check
Quality Monitor Accept/Reject
Wafer Process
Machines,Dimensions, Environment, Process-Parameters, Sub-Materials,Operators
Quality Monitor Accept/Reject
Wafer Probe
Electrical Test 100%
Go/No-go
Assembly
Machines,Dimensions, Environment, Process-Parameters, Feedback Sub-Materials,Operators
Quality Monitor Accept/Reject
Final Test
Visual,Electrical Test 100%
Go/No-go
Outgoing Inspection
Visual,Electrical Sampling Inspection Short Term,Environmental Sampling(+Data Check) Inspection Periodical Reliability Monitoring
Accept/Reject
Life,Environmental Reliability Monitoring
Reliability Monitor
Warehousing
Storage Environment, Time
Quality Monitor
Shipping Returns Field Information etc.
Customer
Quality Information
ASSURANCE INSPECTION
ASSURANCE INSPECTION executed verify quality every wafer process fablication lot. assured delivery initial reliability.
(for Power Management ICs)
TEST ITEMS TEST CONDITION Sample LTPD
High Temperature Operating Test Soldering Heat Heat Treatment (SOT-23/89 Package) Reflow (SOP Package)
Ta=125°C 48Hrs. Ta=260°C Immersion Solder Bath Heating Profile (Fig-1) Twice Ta=125°C RH=85% 20Hrs.
Pressure Cooker Bias Test
Fig-1 HEATING TREATMENT CONDITION INFRARED-RAY REFLOW
240°C MAX. 235±5°C Temperature (°C) 200°C
10±1s 150±10°C 30±10s 90±30s
Time
OUTGOING INSPECTION
OUTGOING INSPECTION sampling type inspection finally verifying delivery initial quality (electrical, visual) product delivered.
(for Power Management ICs)
DIVISION TEST ITEMS CRITERIA LEVEL
Electrical Function Appearance Light Defect Heavy Defect Visual Inspection Criteria 1.0% 0.65% Specification 0.25%
Catastrophic Failures (short, open functionally inoperative) 0.065%
PERIODICAL RELIABILITY MONITORING
PERIODICAL RELIABILITY MONITORING executed verify that long-term reliability retained same level after product authorized verify stabilized quality reliability wafer process assembly process. period time specified each type circuit function process technique execute life environmental tests. Information data gained feed back fablication process stored retain improve reliability.
FAILURE ANALYSIS FLOW CHART
CUSTOMER SALES MARKETING SECT. QUALITY ASSURANCE SECT. Claims (Defective Devices Field Information) Failure Analysis
FAILURE INFORMATION CHECK FIELD INFORMATION/LOT HISTORY
REAPPEARANCE CHECK
EXTERNAL VISUAL INSPECTION
Scope/Xray Video Auto Tester Manual Checker Oscilloscope Parametric Analyzer
Temperature Cycle Shock Vibration Burn-In
ELECTRICAL ANALYSIS
FAILURE MODE PREDICTIONS Decap Scope Cross Section, (EDS), FIB, Tester, I.R.Scope, Liquid Crystal Analysis, Circuit Analysis, Emission Microscope
INTERNAL VISUAL INSPECTION
ANALYSIS
CLASSIFICATION FAILURE MECHANISM
PROCESS ENGINEERING SECT.
REPORT
DESIGN SECT. Corrective Action
QUALITY ASSURANCE SECT.
Confirmation Corrective Action Failure Analysis Report
SALES MARKETING SECT.
CUSTOMER
RELIABILITY TEST REQUIREMENTS
(for SOT89, SOT89-5 Package)
TEST ITEMS TEST CONDITIONS DURATION SAMPLE ACCEPT/ SIZE REJECT
High Temperature Operating Bias Test Ta=125°C DC=VDD (MAX.) Temperature Humidity Bias Test Ta=60°C RH=90% DC=VDD (MAX.) High Temperature Storage Test Temperature Storage Test Ta=150°C Ta=-65°C
1000h 1000h 1000h 1000h 1000h 100cycles 100cycles 100h 100h 5times 3times once
Temperature Humidity Storage Test Ta=85°C RH=85% Temperature Cycling Test (air) Thermal Shock Test (Liquid) USPCBT USPCT Ta=-65 150°C (30-5-30min) Ta=-65 150°C (5min-10s-5min) Ta=125°C RH=85% DC=VDD (MAX.)
Ta=125°C RH=85%
Resistance soldering heat
Ta=85°C RH=65% t=168h
Ta=260°C (dipping) Ta=350°C (only terminal)
Solderability Sensitivity Sensitivity Latch
Ta=235°C aging steam) C=200pF ±150V (MIN.) C=100pF R=1.5k ±1kV (MIN.) C=200pF ±150V (MIN.)
[Pre-condition] Test No.2, shall performed this pre-condition before testing.
Fig-1 HEATING TREATMENT CONDITION INFRARED-RAY REFLOW
240°C MAX. 235±5°C Temperature (°C)
Ta=85°C RH=65% Storage 168h Reflow soldering heat stress (twice)
200°C
10±1s 150±10°C 30±10s 90±30s
Time
RELIABILITY TEST REQUIREMENTS
(for SC82AB, SOT23, SOP, SSOP Package)
TEST ITEMS TEST CONDITIONS DURATION SAMPLE ACCEPT/ SIZE REJECT
High Temperature Operating Bias Test Ta=125°C DC=VDD (MAX.) Temperature Humidity Bias Test Ta=85°C RH=85% DC=VDD (MAX.) High Temperature Storage Test Temperature Storage Test Ta=150°C Ta=-65°C
1000h 1000h 1000h 1000h 1000h 100cycles 100cycles 100h 100h twice 5times 3times once
Temperature Humidity Storage Test Ta=85°C RH=85% Temperature Cycling Test (air) Thermal Shock Test (Liquid) USPCBT USPCT Ta=-65 150°C (30-5-30min) Ta=-65 150°C (5min-10s-5min) Ta=125°C RH=85% DC=VDD (MAX.)
Ta=125°C RH=85%
Resistance soldering heat
Ta=85°C RH=65% t=168h
Reflow (see Fig-1) Ta=350°C(only terminal)
Solderability Sensitivity Sensitivity Latch
Ta=235°C aging steam) C=200pF ±150V (MIN.) C=100pF R=1.5k ±1kV (MIN.) C=200pF ±150V (MIN.)
[Pre-condition] Test No.2, shall performed this pre-condition before testing.
Fig-1 HEATING TREATMENT CONDITION INFRARED-RAY REFLOW
240°C MAX. 235±5°C Temperature (°C)
Ta=85°C RH=65% Storage 168h Reflow soldering heat stress (twice)
200°C
10±1s 150±10°C 30±10s 90±30s
Time
RELIABILITY TEST REQUIREMENTS
(for VSOP-0.65mm pitch Package)
TEST ITEMS TEST CONDITIONS DURATION SAMPLE ACCEPT/ SIZE REJECT
High Temperature Operating Bias Test Ta=125°C DC=VDD (MAX.) Temperature Humidity Bias Test Ta=85°C RH=85% DC=VDD (MAX.) High Temperature Storage Test Temperature Storage Test Ta=125°C Ta=-55°C
1000h 1000h 1000h 1000h 1000h 100cycles 100cycles 100h 100h twice 5times 3times once
Temperature Humidity Storage Test Ta=85°C RH=85% Temperature Cycling Test (air) Thermal Shock Test (Liquid) USPCBT USPCT Ta=-55 125°C (30-5-30min) Ta=-55 125°C (5min-10s-5min) Ta=125°C RH=85% 105Pa DC=VDD (MAX.) Ta=125°C RH=85%
Resistance soldering heat
Ta=85°C RH=65% t=168h
Reflow (see Fig-1) Ta=350°C (only terminal)
Solderability Sensitivity Sensitivity Latch
Ta=235°C aging steam) C=200pF ±150V (MIN.) C=100pF R=1.5k ±1kV (MIN.) C=200pF ±150V (MIN.)
[Pre-condition] Test No.2, shall performed this pre-condition before testing.
Fig-1 HEATING TREATMENT CONDITION INFRARED-RAY REFLOW
240°C MAX. 235±5°C Temperature (°C)
Ta=85°C RH=65% Storage 168h Reflow soldering heat stress (twice)
200°C
10±1s 150±10°C 30±10s 90±30s
Time
RELIABILITY TEST REQUIREMENTS
(for TO-92 Package)
TEST ITEMS TEST CONDITIONS DURATION SAMPLE ACCEPT/ SIZE REJECT
High Temperature Operating Bias Test Ta=125°C DC=VDD (MAX.) Temperature Humidity Bias Test Ta=85°C RH=85% DC=VDD (MAX.) High Temperature Storage Test Temperature Storage Test Ta=150°C Ta=-65°C
1000h 1000h 1000h 1000h 1000h 100cycles 100cycles 100h 100h 5times 3times once
Temperature Humidity Storage Test Ta=85°C RH=85% Temperature Cycling Test (air) Thermal Shock Test (Liquid) USPCBT USPCT Ta=-65 150°C (30-5-30min) Ta=-65 150°C (5min-10s-5min) Ta=125°C RH=85% DC=VDD (MAX.)
Ta=125°C RH=85%
Resistance soldering heat
Ta=85°C RH=65% t=168h
Ta=260°C (only terminal) Ta=350°C (only terminal)
Solderability Sensitivity Sensitivity Latch
Ta=235°C aging steam) C=200pF ±150V (MIN.) C=100pF R=1.5k ±1kV (MIN.) C=200pF ±150V (MIN.)
[Pre-condition] Test No.2, shall performed this pre-condition before testing.
Ta=260°C (Soldering heat stress)
HANDLING DESIGN GUIDELINES
HANDLING PRECAUTIONS
1.Soldering surface temperature exposure time shold kept below. MAX. Temp. 260°C 235°C 350°C MAX. Time Applicable part Lead Body Lead (when hand-soldering necessary)
Don't halogenous solder flux. Recommended heating profiles shown Fig-1 Fig-4 Baking step preceding reflow process necessary. Though heating process carried twice, reflow method, sure minimize temperature exposure time. board cleaning conditions. 1-4.1 recommend alternative Freon solvent. ex.ST-100s (Arakawa) Don't trichloroethylene. 1-4.2 Cleaning time should less than 180s (including solvent, vapor ultrasonic bath). 1-4.3 Ultrasonic cleaning usable Frequency Power Time 40kHz (resonant damage should avoided) 15W/l (MAX.) (MAX.)
2.Storage Please sure store devices proper conditions maintain device quality. Ambient temperature Humidity 35°C
(Note) humidifiers being used, provide pure water boiled water. When devices stored long term, maintain purified temperature stabilized.
3.AntiE.S.D Relative humidity should maintain more than manufacturing workstation. parts machines which come into contact with must grounded metal other conductive material. When hand-soldering necessary, provide ground straps apparatus used sure that soldering ties grounded.
4.Recommended Heating Profile Fig-1: Reflow Soldering
MAX. MAX. 235±5 Surface Temperature (°C) 4°C/s 150±10 90±30s 5°C/s Time MAX.
Fig-2: Vapor Phase Reflow Slodering(VPS) SOT-23/SOT-89/SOT-89-5/SC-82AB
MAX. Surface Temperature (°C) 150±10 5°C/s Time
Fig-3: Vapor Phase Reflow Slodering(VPS) SOP/SSOP/VSOP
215±5 MAX. Surface Temperature (°C) 150±10 90±30s 5°C/s Time
Fig-4: Soldering SOT-23/TO-92
Dipping Pre-heating 3min MAX. Surface Temperature (°C) Board Surface Temp. Cooling Solder Melting point
Time
RECOMMENDED LAND PATTERN
SOT-89
SOT-89-5
MAX. MAX.
(Unit:
(Unit:
SOT-23-5
MAX.
SC-82AB
0.65 0.65
0.65 0.95 0.95
(Unit:
(Unit:
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