| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
BT139B series GENERAL DESCRIPTION Passivated triacs plastic
Top Searches for this datasheetBT139B series GENERAL DESCRIPTION Passivated triacs plastic envelope suitable surface mounting, intended applications requiring high bidirectional transient blocking voltage capability high thermal cycling performance. Typical applications include motor control, industrial domestic lighting, heating static switching. QUICK REFERENCE DATA SYMBOL PARAMETER BT139BBT139BBT139BRepetitive peak off-state voltages on-state current Non-repetitive peak on-state current MAX. 600F 600G MAX. 800F 800G UNIT VDRM IT(RMS) ITSM PINNING SOT404 DESCRIPTION main terminal main terminal gate main terminal CONFIGURATION SYMBOL LIMITING VALUES Limiting values accordance with Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages on-state current Non-repetitive peak on-state current fusing Repetitive rate rise on-state current after triggering full sine wave; full sine wave; prior surge 16.7 dIG/dt A/µs GT2- GT2- CONDITIONS MIN. -600 6001 MAX. -800 UNIT A/µs A/µs A/µs A/µs dIT/dt PG(AV) Tstg Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature over period Although recommended, off-state voltages 800V applied without damage, triac switch on-state. rate rise current should exceed A/µs. July 2001 1.300 BT139B series THERMAL RESISTANCES SYMBOL j-mb PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Thermal resistance full cycle junction mounting base half cycle Thermal resistance minimum footprint, board junction ambient STATIC CHARACTERISTICS unless otherwise stated SYMBOL PARAMETER Gate trigger current CONDITIONS BT139BVD GT2- GT2- GT2- GT2- VDRM(max); MIN. TYP. 0.25 MAX. UNIT Latching current Holding current On-state voltage Gate trigger voltage Off-state leakage current DYNAMIC CHARACTERISTICS unless otherwise stated SYMBOL dVD/dt PARAMETER Critical rate rise off-state voltage Critical rate change commutating voltage Gate controlled turn-on time CONDITIONS BT139BVDM VDRM(max); exponential waveform; gate open circuit IT(RMS) dIcom/dt A/ms; gate open circuit VDRM(max); dIG/dt A/µs MIN. TYP. MAX. UNIT V/µs dVcom/dt V/µs July 2001 1.300 BT139B series Ptot Tmb(max) IT(RMS) BT139 IT(RMS) Fig.1. Maximum on-state dissipation, Ptot, versus on-state current, IT(RMS), where conduction angle. ITSM Fig.4. Maximum permissible current IT(RMS) versus mounting base temperature Tmb. IT(RMS) 1000 limit quadrant 10us time initial 100us 10ms 100ms 0.01 surge duration Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width sinusoidal currents, 20ms. ITSM ITSM time Fig.5. Maximum permissible repetitive on-state current IT(RMS), versus surge duration, sinusoidal currents, 99°C. VGT(Tj) VGT(25 initial Number cycles 50Hz 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number cycles, sinusoidal currents, Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25°C), versus junction temperature July 2001 1.300 BT139B series IGT(Tj) IGT(25 GT2- GT2- 1.195 0.018 Ohms Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25°C), versus junction temperature IL(Tj) IL(25 Fig.10. Typical maximum on-state characteristic. j-mb (K/W) unidirectional bidirectional 0.01 0.001 10us 0.1ms 10ms 0.1s Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus junction temperature IH(Tj) IH(25C) Fig.11. Transient thermal impedance j-mb, versus pulse width dV/dt (V/us) off-state dV/dt limit BT139.G SERIES 1000 BT139 SERIES BT139.F SERIES dIcom/dt A/ms Fig.9. Normalised holding current IH(Tj)/ IH(25°C), versus junction temperature Fig.12. Typical commutation dV/dt versus junction temperature, parameter commutation dIT/dt. triac should commutate when dV/dt below value appropriate curve pre-commutation dIT/dt. July 2001 1.300 BT139B series MECHANICAL DATA Dimensions Mass: 10.3 15.4 0.85 (x2) 2.54 (x2) Fig.13. SOT404 centre connected mounting base. MOUNTING INSTRUCTIONS Dimensions 11.5 17.5 5.08 Fig.14. SOT404 soldering pattern surface mounting. Notes Plastic meets UL94 1/8". July 2001 1.300 BT139B series DEFINITIONS DATA SHEET STATUS DATA SHEET STATUS2 Objective data PRODUCT STATUS3 Development DEFINITIONS This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, ordere improve design supply best possible product This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A Preliminary data Qualification Product data Production Limiting values Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections this specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. Philips Electronics N.V. 2001 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent other industrial intellectual property rights. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. Please consult most recently issued datasheet before initiating completing design. product status device(s) described this datasheet have changed since this datasheet published. latest information available Internet July 2001 1.300 Other recent searchesXBRP40045CTL - XBRP40045CTL XBRP40045CTL Datasheet TORX193 - TORX193 TORX193 Datasheet QLM4S781 - QLM4S781 QLM4S781 Datasheet MIC2826 - MIC2826 MIC2826 Datasheet HV219 - HV219 HV219 Datasheet FDFME3N311ZT - FDFME3N311ZT FDFME3N311ZT Datasheet CDLE-052-101 - CDLE-052-101 CDLE-052-101 Datasheet 5to1200MHz - 5to1200MHz 5to1200MHz Datasheet
Privacy Policy | Disclaimer |