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Ceramic single-ended DIL-bent-SIL flat package; heatsink mounted; moun


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Ceramic single-ended DIL-bent-SIL flat package; heatsink mounted; mounting hole; (Sn) plated leads
SOT558A
Package under development
Philips Semiconductors reserves right make changes without notice.
scale DIMENSIONS original dimensions) UNIT 0.25 20.2 19.8 13.4 13.0 1.27 21.7 21.3 4.54 4.14 18.1 17.9 18.1 17.9 0.25 3.75 3.55
OUTLINE VERSION SOT558A
REFERENCES JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 99-05-05

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