Prepared Paul Shockman Semiconductor HFPD Applications Engineer I

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Prepared Paul Shockman Semiconductor HFPD Applications Engineer I

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AND8002/D ECLinPSTM, ECLinPS LiteTM, ECLinPS PlusTM, ECLinPS MAXTM, GigaCommMarking Ordering Information Guide
Prepared Paul Shockman Semiconductor HFPD Applications Engineer
Introduction This application note describes device markings ordering information following Semiconductor families (refer respective family data book family information): ECLinPS ECLinPS Lite ECLinPS Plus ECLinPS GigaComm Note that data sheet information takes precedence over this application note there differences.
Application Note Information This application note divided into following sections: Section Data Sheet Marking Diagrams diagrams provide identification, traceability, date, packaging information. Section Data Sheet Ordering Information Tables tables list device order numbers every available device configuration.
Semiconductor Components Industries, LLC, 2008
August, 2008 Rev.
Publication Order Number: AND8002/D
AND8002/D
SECTION Data Sheet Marking Diagrams
Device Marking Examples
marking format dependent upon device package, larger device packages allow inclusion more information face device. larger packages where marking space permits, Free designator will additional suffix letter added traceability date code line. marking example large 52-pin NB100LVEP222 shown below. Note that device marking includes following coded information that described later sections:
Code Circuit Identification Code
Code Circuit Identification Code Code Temperature Compensation Code Code Family Identification Code Code Function Type Code Code Assembly Location Traceability Code Code Wafer Traceability Code Code Year Date Code Code Work Week Date Code Code Free Designator
Code Temperature Compensation Code
Code Family Identification Code
NB100 LVEP
Code Function Type Code
Code Assembly Location Traceability Code
Code Wafer Traceability Code
Code Year Date Code
Code Work Week Date Code
Code Pb-Free Designator
Figure 52-Pin Marking Example
marking example 8-pin TSSOP MC100EP16 device shown Figure Note that 8-pin package does allow much marking information 52-pin package. smaller package where marking space limited, Free designator will additional "Dot" centered below traceability date code line, else "Microdot" positioned below right side traceability date code line.
AND8002/D
Code Family Identification Code Code Temperature Compensation Code
Code Temperature Compensation Code
Code Function Type Code
Code Assembly Location Traceability Code
Code Code Work Week Year Date Code Date Code Code Pb-Free Designators
There Temperature Compensation codes. "10" code indicates that device characteristics temperature dependent (refer AND8066/D additional information). "100" identification code indicates that device characteristics temperature dependent.
Code Family Identification Code
Family Identification Codes shown following table.
Code Wafer Traceability Code
Figure 8-Pin Marking Example Code Circuit Identification Code
identifies Motorola Circuits that owned Semiconductor. identifies circuits that were introduced Semiconductor. 8-pin packages) identifies Preproduction/Prereliability devices, 8-pin packages) identifies Prototype devices. Contact Semiconductor further information non-released device markings.
Table Family Identification Codes
Family ECLinPS Voltage ECLinPS ECLinPS Lite ECLinPS Lite Translator Voltage ECLinPS Lite Voltage ECLinPS Lite Translator ECLinPS Plus ECLinPS Plus Translator Voltage ECLinPS Plus GigaComm ECLinPS TSSOP-8 Code SO-8 Code Code Over 8-Pin Code LVEL LVELT LVEP
Code Function Type Code
Each device assigned unique function type identifier.
Code Assembly Location Traceability Code
character Assembly Location Traceability Codes identify final assembly location shown following table.
AND8002/D
Table Assembly Location Traceability Codes
Code ASECL ATP1 ASAT NSEB ASEK OSPI (Korea) Inc. Semiconductor Carmona Semiconductor ASE-Chung (METL) Assembly Site Advanced Interconnect Technologies Amkor Technology Philippines ASAT Holdings Limited Location Batam Island, Indonesia Manila, Philippines Territories, Hong Kong Bangkok, Thailand Seoul, Korea Carmona, Philippines Seremban, Malaysia Chung-Li, Taiwan
AND8002/D
Code Wafer Traceability Code Code Work Week Date Code
character Wafer Traceability Code dependent upon package size shown Table Wafer Traceability Code conjunction with Work Week Date Code provides unique wafer identification.
Code Year Date Code
character Work Week Date Code dependent upon package size listed Table
Traceability Date Code Tables
character Year Date Code dependent upon package size shown Table
coding example each available package type shown Table Note that smaller packages one-character alpha code "Year", one-character alpha code "Work Week". alpha codes deciphered Table
Table Traceability Date Code Markings Examples
Traceability Codes Package CDIP-16 Example EIAJ SO-14 Example FCBGA-16 Example LQFP-32, LQFP-52, LQFP-64 Example PLCC-20, PLCC-28 Example QFN-10, QFN-16, QFN-24 Example SO-8 Example SO-16 Example SO-20 Example TSSOP-8, TSSOP-16, TSSOP-20 Example Assembly Code (Code ATP1 OSPI ASAT ATP1 Wafer (Code First Second First First First Second Second First First Second Year (Code 1996 2002 2002 1996 1996 2002 2002 2002 1996 2002 Date Codes Work Week (Code 46th Week 46th Week 46th Week 46th Week 46th Week 46th Week 46th Week 46th Week 46th Week 46th Week
AND8002/D
Table Alpha Year Work Week Date Codes
Alpha Year Date Codes (Code Year 1989, 2002 1989, 2002 1990, 2003 1990, 2003 1991, 2004 1991, 2004 1991, 2005 1991, 2005 1993, 2006 1993, 2006 1994, 2007 1994, 2007 1995, 2008 1995, 2008 1996, 2009 1996, 2009 1997, 2010 1997, 2010 1998, 2011 1998, 2011 1999, 2012 1999, 2012 2000, 2013 2000, 2013 2001, 2014 2001, 2014 First Second Half-Year First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half First Half Second Half Alpha Work Week Date Codes (Code First Half-Year Work Week Second Half-Year Work Week
Package Information marking diagram includes following package information: Package: industry standard designation package. Package Suffix: This suffix used order device, part device order number listed
SO-8 SUFFIX CASE TSSOP-8 SUFFIX CASE 948R
Ordering Information table. Refer following "Ordering Information" section. Package Case Number: industry standard case designation package. Packaging information examples from MC100EP16 NB100LVEP222 data sheets shown below.
52-LEAD LQFP THERMALLY ENHANCED CASE 848H SUFFIX
Figure 8-Pin Packaging Information Example
Figure 52-Pin Packaging Information Example
AND8002/D
SECTION Data Sheet Ordering Information Tables
Ordering Information Examples
Ordering Information tables from MC100EP16, NB100LVEP222, NBSG16 data sheets shown below.
Table Ordering Information Table Examples
Ordering Information Table Data Sheet Device MC10EP16D MC10EP16DR2 MC100EP16D MC10/100EP16 MC100EP16DR2 MC10EP16DT MC10EP16DTR2 MC100EP16DT MC100EP16DTR2 NB100LVEP222 NB100LVEP222FA NB100LVEP222FAR2 NBSG16BA NBSG16 NBSG16BAR2 NBSG16BA100 NBSG16BA500R2 Package SO-8 SO-8 SO-8 SO-8 TSSOP-8 TSSOP-8 TSSOP-8 TSSOP-8 LQFP-52 LQFP-52 FCBGA-16 FCBGA-16 FCBGA-16 FCBGA-16 Shipping Units/Rail 2500 Tape Reel Units/Rail 2500 Tape Reel Units/Rail 2500 Tape Reel Units/Rail 2500 Tape Reel Units/Tray 1500 Tape Reel Units/Rail 2500 Tape Reel Units/Tray Tape Reel
following table decodes device order numbers some above examples. Note that order number made Codes from data sheet Marking Diagram. Refer previous "Code" sections description codes.
Table Device Order Number Decoding
Circuit Identification Code (Code Motorola Circuit Circuit Circuit Temperature Compensation Code (Code Family Identification Code (Code ECLinPS Plus LVEP Voltage GigaComm Function Type Code (Code Unique Identifier Unique Identifier Unique Identifier
Device Order Number MC100EP16DT NB100LVEP222FA NBSG16BA
Package Suffix TSSOP-20 LQFP-52 FCBGA-16
AND8002/D
Package Suffix
package suffixes shown data sheet Marking Diagram. package suffixes ECLinPS families GigaComm family listed following table.
Table ECLinPS GigaComm Package Suffixes
Suffix Package FCBGA-16 SO-8 SO-16 TSSOP-8 TSSOP-16 TSSOP-20 SO-20 LQFP-32 LQFP-52 LQFP-52 LQFP-64 PLCC-20 PLCC-28 CDIP-16 EIAJ SO-14 QFN-16 QFN-24 CDIP-16 PDIP-16 Pins Case 751B 948R 948F 948E 751D 873A 848-D 848H 848G 485G 485L Ball Grid Array Small Outline Small Outline Thin Shrink Small Outline Package Thin Shrink Small Outline Package Thin Shrink Small Outline Package Small Outline Leaded Quad Flat Pack Leaded Quad Flat Pack Leaded Quad Flat Pack Leaded Quad Flat Pack Plastic Leaded Chip Carrier Plastic Leaded Chip Carrier Ceramic EIAJ Small Outline Quad Flat No-Lead Quad Flat No-Lead Ceramic Plastic Description
Shipping Specification
"Shipping" column Ordering Information table specifies shipping configuration that corresponds device order number. regular package suffix order tape reel shipping configurations. Refer Brochure BRD8011/D further tape reel information.
Additional Information
Additional traceability date code information available upon request. make request, please visit website http://www.onsemi.com click "Technical Support," contact Technical Information Center (TIC) 1-800-282-9855.
ECLinPS, ECLinPS Lite ECLinPS Plus, ECLinPS MAX, GigaComm trademarks Semiconductor Components Industries, LLC.
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
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AND8002/D

Prepared Paul Shockman Semiconductor HFPD Applications Engineer I

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