MC74HC1G08 high speed CMOS 2-input gate fabricated with silicon gate C

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MC74HC1G08 high speed CMOS 2-input gate fabricated with silicon gate C

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MC74HC1G08 Single 2-Input Gate
MC74HC1G08 high speed CMOS 2-input gate fabricated with silicon gate CMOS technology. internal circuit composed multiple stages, including buffer output which provides high noise immunity stable output. MC74HC1G08 output drive current compared MC74HC series.
SC-88A SOT-353 SC-70 SUFFIX CASE 419A
High Speed: (Typ) Power Dissipation: (Max) 25°C High Noise Immunity Balanced Propagation Delays (tpLH tpHL) Symmetrical Output Impedance (IOH Chip Complexity: Pb-Free Packages Available
TSOP-5 SOT-23 SC-59 SUFFIX CASE
Device Code Date Code* Pb-Free Package
(Note: Microdot either location) *Date Code orientation and/or position vary depending upon manufacturing location.
Figure Pinout
ASSIGNMENT
Figure Logic Symbol FUNCTION TABLE
Inputs Output
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2007
February, 2007 Rev.
Publication Order Number: MC74HC1G08/D
MC74HC1G08
MAXIMUM RATINGS
Symbol VOUT IOUT TSTG VESD Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink Current Supply Current Supply Storage Temperature Range Lead Temperature, from Case Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation Still 85°C Moisture Sensitivity Flammability Rating Withstand Voltage Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 125°C (Note SC70-5/SC-88A/SOT-353 (Note SOT23-5/TSOP-5/SC59-5 SC70-5/SC-88A/SOT-353 SOT23-5/TSOP-5/SC59-5 Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 $12.5 )150 )150 Level 0.125 u2000 u200 $500 Unit °C/W
ILATCHUP
Latchup Performance
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Measured with minimum spacing board, using mm-by-1 inch, ounce copper trace with flow. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VOUT Supply Voltage Input Voltage Output Voltage Operating Temperature Range Input Rise Fall Time Parameter )125 1000 Unit
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS TIME 0.1% BOND FAILURES
Junction Temperature Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4
FAILURE RATE PLASTIC CERAMIC UNTIL INTERMETALLICS OCCUR 130°C 120°C 100°C 110°C 90°C 80°C TIME, YEARS
1000
Figure Failure Rate Time Junction Temperature
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MC74HC1G08
ELECTRICAL CHARACTERISTICS
Symbol Parameter Minimum High-Level Input Voltage Test Conditions 4.18 5.68 4.31 5.80 0.17 0.18 0.26 0.26 $0.1 3.15 4.20 1.35 1.80 4.13 5.63 0.33 0.33 $1.0 255C 855C 3.15 4.20 1.35 1.80 4.08 5.58 0.40 0.40 $1.0 *555C 1255C 3.15 4.20 1.35 1.80 Unit
Maximum Low-Level Input Voltage
Minimum High-Level Output Voltage
-2.6 Maximum Low-Level Output Voltage
Maximum Input Leakage Current Maximum Quiescent Supply Current
ELECTRICAL CHARACTERISTICS (Input
255C Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Test Conditions 855C *555C 1255C Unit
tTLH, tTHL Output Transition Time Maximum Input Capacitance Typical 255C, Power Dissipation Capacitance (Note defined value internal equivalent capacitance which calculated from operating current consumption without load. Average operating current obtained equation: ICC(OPR) ICC. used determine no-load dynamic power consumption; VCC2 VCC.
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MC74HC1G08
INPUT tPLH tTLH
tPHL
OUTPUT
tTHL
Figure Switching Waveforms
INPUT OUTPUT
*Includes probe capacitance. 1-MHz square input wave recommended propagation delay tests.
Figure Test Circuit
ORDERING INFORMATION
Device MC74HC1G08DFT1 MC74HC1G08DFT1G MC74HC1G08DFT2 MC74HC1G08DFT2G MC74HC1G08DTT1 MC74HC1G08DTT1G Package SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 (Pb-Free) SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 (Pb-Free) SOT23-5/TSOP-5/SC59-5 SOT23-5/TSOP-5/SC59-5 (Pb-Free) 3000 Tape Reel Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D.
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MC74HC1G08
PACKAGE DIMENSIONS
SC-88A, SOT-353, SC-70 CASE 419A-02 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. 419A-01 OBSOLETE. STANDARD 419A-02. DIMENSIONS INCLUDE MOLD FLASH, PROTRUSIONS, GATE BURRS.
(0.008)
INCHES 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 0.004 0.004 0.010 0.004 0.012 0.008 0.079 0.087
MILLIMETERS 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 0.10 0.10 0.25 0.10 0.30 0.20 2.00 2.20
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
inches
0.0748
SCALE 20:1
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC1G08
PACKAGE DIMENSIONS
TSOP-5 CASE 483-02 ISSUE
NOTES: DIMENSIONING TOLERANCING ASME Y14.5M, 1994. CONTROLLING DIMENSION: MILLIMETERS. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. DIMENSIONS INCLUDE MOLD FLASH, PROTRUSIONS, GATE BURRS. OPTIONAL CONSTRUCTION: ADDITIONAL TRIMMED LEAD ALLOWED THIS LOCATION. TRIMMED LEAD EXTEND MORE THAN FROM BODY. MILLIMETERS 3.00 1.50 0.90 1.10 0.25 0.50 0.95 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 2.50 3.00
NOTE
0.20
0.10 0.20
DETAIL
DETAIL
0.05
SEATING PLANE
SOLDERING FOOTPRINT*
0.074
0.95 0.037
0.094 0.039 0.028
SCALE 10:1
inches
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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PUBLICATION ORDERING INFORMATION
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MC74HC1G08/D

MC74HC1G08 high speed CMOS 2-input gate fabricated with silicon gate C

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