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BC637, BC639, BC639-16 High Current Transistors
These Pb-Free Devices*
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COLLECTOR
MAXIMUM RATINGS
Rating Collector Emitter Voltage BC637 BC639 Collector Base Voltage BC637 BC639 Emitter Base Voltage Collector Current Continuous Total Device Dissipation 25°C Derate above 25°C Total Device Dissipation 25°C Derate above 25°C Operating Storage Junction Temperature Range VEBO Tstg VCBO +150 mW/°C mW/°C TO-92 CASE STYLE Symbol VCEO Value Unit
BASE EMITTER
STRAIGHT LEAD BULK PACK
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Symbol RqJA RqJC 83.3 Unit °C/W °C/W
BENT LEAD TAPE REEL AMMO PACK
MARKING DIAGRAMS
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. AYWW BC63 9-16 AYWW
Assembly Location Year Work Week Pb-Free Package (Note: Microdot either location)
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2007
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
March, 2007 Rev.
Publication Order Number: BC637/D
BC637, BC639, BC639-16
ELECTRICAL CHARACTERISTICS 25°C unless otherwise noted)
Characteristic CHARACTERISTICS Collector Emitter Breakdown Voltage (Note mAdc, Collector Emitter Zero-Gate Breakdown Voltage(Note mAdc, Collector Base Breakdown Voltage mAdc, Emitter Base Breakdown Voltage mAdc, Collector Cutoff Current (VCB Vdc, (VCB Vdc, 125°C) CHARACTERISTICS (Note Current Gain mAdc, Vdc) mAdc, Vdc) Collector Emitter Saturation Voltage mAdc, mAdc) Base Emitter Voltage mAdc, Vdc) DYNAMIC CHARACTERISTICS Current Gain Bandwidth Product mAdc, Vdc, MHz) Output Capacitance (VCB Vdc, MHz) Input Capacitance (VEB Vdc, MHz) Pulse Test: Pulse Width Duty Cycle 2.0%. VCE(sat) VBE(on) BC637 BC639 BC639-16ZLT1 V(BR)CEO BC637 BC639 V(BR)CES BC639-16 V(BR)CBO BC637 BC639 V(BR)EBO ICBO nAdc mAdc Symbol Unit
ORDERING INFORMATION
Device BC637G BC639G BC639RL1G BC639ZL1G BC639-16ZL1G Package TO-92 (Pb-Free) TO-92 (Pb-Free) TO-92 (Pb-Free) TO-92 (Pb-Free) TO-92 (Pb-Free) Shipping 5000 Units Bulk 5000 Units Bulk 2000 Tape Reel 2000 Ammo 2000 Ammo
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D.
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BC637, BC639, BC639-16
1000 COLLECTOR CURRENT (mA) 25°C 25°C BC635 BC637 BC639 25°C 25°C hFE, CURRENT GAIN
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
COLLECTOR CURRENT (mA)
1000
Figure Active Region Safe Operating Area
BANDWIDTH PRODUCT (MHz)
Figure Current Gain
VOLTAGE (VOLTS)
VCE(sat) IC/IB
VBE(sat) IC/IB VBE(on)
CURRENT-GAIN
COLLECTOR CURRENT (mA)
1000
COLLECTOR CURRENT (mA)
1000
Figure Current-Gain Bandwidth Product
Figure "Saturation" "On" Voltages
TEMPERATURE COEFFICIENTS (mV/°C)
-0.2
-1.0 VOLTS +100°C
-1.6
-2.2
COLLECTOR CURRENT (mA)
1000
Figure Temperature Coefficients
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BC637, BC639, BC639-16
PACKAGE DIMENSIONS
TO-92 (TO-226) CASE 29-11 ISSUE
SEATING PLANE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. CONTOUR PACKAGE BEYOND DIMENSION UNCONTROLLED. LEAD DIMENSION UNCONTROLLED BEYOND DIMENSION MINIMUM. INCHES 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 0.250 0.080 0.105 0.100 0.115 0.135 MILLIMETERS 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 6.35 2.04 2.66 2.54 2.93 3.43
STRAIGHT LEAD BULK PACK
SECTION
BENT LEAD TAPE REEL AMMO PACK
SEATING PLANE
NOTES: DIMENSIONING TOLERANCING ASME Y14.5M, 1994. CONTROLLING DIMENSION: MILLIMETERS. CONTOUR PACKAGE BEYOND DIMENSION UNCONTROLLED. LEAD DIMENSION UNCONTROLLED BEYOND DIMENSION MINIMUM. MILLIMETERS 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 2.04 2.66 1.50 4.00 2.93 3.43 STYLE EMITTER COLLECTOR BASE
SECTION
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
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BC637/D

These Pb-Free Devices* http://onsemi.com COLLECTOR MAXI

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