74HCT157 identical pinout LS157. device inputs compatible with standar

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74HCT157 identical pinout LS157. device inputs compatible with standar

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74HCT157 Quad 2-Input Data Selectors Multiplexers
74HCT157 identical pinout LS157. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device routes nibbles single port determined Select input. data presented outputs noninverted form. high level Output Enable input sets four outputs level.
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SOIC-16 SUFFIX CASE 751B TSSOP-16 SUFFIX CASE 948F 74HCT157 Device Code Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location) ALYWG HCT157G AWLYWW
Output Drive Capability: LSTTL Loads TTL/NMOS-Compatible Input Levels Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Performance: 2000 Machine Model Chip Complexity: FETs 20.5 Equivalent Gates These Pb-Free Devices
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2007
March, 2007 Rev.
Publication Order Number: 74HCT157/D
74HCT157
NIBBLE INPUTS NIBBLE INPUTS SELECT OUTPUT ENABLE DATA OUTPUTS
SELECT
OUTPUT ENABLE
Figure Assignment
Figure Logic Diagram FUNCTION TABLE
Inputs Output Enable Select Outputs
don't care levels respective Data-Word Inputs.
ORDERING INFORMATION
Device 74HCT157DR2G 74HCT157DTR2G Package SOIC-16 (Pb-Free) TSSOP-16* Shipping 2500 Units Reel 2500 Units Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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74HCT157
MAXIMUM RATINGS
Symbol Iout Tstg Vout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Air, Storage Temperature Lead Temperature, from Case Seconds (SOIC TSSOP Package) SOIC Package TSSOP Package
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 Unit
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Symbol Parameter Minimum High-Level Input Voltage Maximum Low-Level Input Voltage Minimum High-Level Output Voltage Condition Vout 0.1V |Iout| 20mA Vout 0.1V |Iout| 20mA |Iout| 20mA Maximum Low-Level Output Voltage |Iout| 20mA Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Additional Quiescent Supply Current Iout 2.4V, Input GND, Other Inputs Iout |Iout| 4.0mA |Iout| 4.0mA Guaranteed Limit 25°C 3.98 0.26 ±0.1 85°C 3.84 0.33 ±1.0 125°C 3.70 0.40 ±1.0 Unit
DICC
-55°C
125°C
Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Total Supply Current DICC.
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74HCT157
ELECTRICAL CHARACTERISTICS Input
Guaranteed Limit Symbol tPLH, tPHL tPLH, tPHL tPLH, tPHL tTLH, tTHL Parameter Maximum Propagation Delay, Input Output (Figures Maximum Propagation Delay, Select Output (Figures Maximum Propagation Delay, Output Enable Output (Figures Maximum Output Transition Time, Output (Figures Maximum Input Capacitance 25_C 85_C 125_C Unit
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Package)*
Used determine no-load dynamic power consumption: Semiconductor High-Speed CMOS Data Book (DL129/D).
load considerations, Chapter
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74HCT157
DESCRIPTIONS
INPUTS (Pins
Nibble inputs. data present these pins transferred outputs when Select input level Output Enable input level. data presented outputs noninverted form.
(Pins
data present these pins noninverted form. Output Enable input high level, outputs level.
CONTROL INPUTS Select (Pin
Nibble inputs. data present these pins transferred outputs when Select input high level Output Enable input level. data presented outputs noninverted form.
OUTPUTS (Pins
Nibble select. This input determines data word transferred outputs. level this input selects inputs high level selects inputs.
Output Enable (Pin
Output Enable input. level this input allows selected input data presented outputs. high level this input sets outputs level.
Data outputs. selected input Nibble presented these outputs when Output Enable input level. SWITCHING WAVEFORMS
INPUT tPLH OUTPUT tTLH tTHL tPHL SELECT tPLH OUTPUT tTLH tTHL tPHL
Figure HCT157
OUTPUT ENABLE tPHL OUTPUT tTHL
Figure versus Selected, Noninverted
tPLH
tTLH
Figure HCT157
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure Test Circuit
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74HCT157
EXPANDED LOGIC DIAGRAM
OUTPUT ENABLE SELECT
DATA OUTPUTS
NIBBLE OUTPUTS
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74HCT157
PACKAGE DIMENSIONS
SOIC-16 CASE 751B-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
SOLDERING FOOTPRINT*
6.40
1.12
0.58
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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74HCT157
PACKAGE DIMENSIONS
TSSOP-16 CASE 948F-01 ISSUE
0.10 (0.004) 0.15 (0.006)
SECTION
IDENT.
0.15 (0.006)
DETAIL
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
0.65 PITCH
DIMENSIONS: MILLIMETERS
74HCT157
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
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74HCT157/D

74HCT157 identical pinout LS157. device inputs compatible with standar

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