74HC125 identical pinout LS125. device inputs compatible with standard

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74HC125 identical pinout LS125. device inputs compatible with standard

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74HC125 Quad 3-State Noninverting Buffers
74HC125 identical pinout LS125. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. HC125 noninverting buffer designed used with 3-state memory address drivers, clock drivers, other bus-oriented systems. device four separate output enables that active-low.
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SOIC-14 SUFFIX CASE 751A HC125G AWLYWW
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with JEDEC Standard Requirements Performance: 2000 Machine Model Chip Complexity: FETs Equivalent Gates These Pb-Free Devices
TSSOP-14 SUFFIX CASE 948G ALYWG
Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2007
March, 2007 Rev.
Publication Order Number: 74HC125/D
74HC125
ASSIGNMENT
LOGIC DIAGRAM HC125 Active-Low Output Enables
FUNCTION TABLE
HC125 Inputs Output
MAXIMUM RATINGS
Symbol Iout Tstg Vout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Storage Temperature Lead Temperature, from Case Seconds (SOIC TSSOP Package) SOIC Package TSSOP Package Output Voltage (Referenced GND)
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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74HC125
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 Unit
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit Symbol Parameter Minimum High-Level Input Voltage Test Conditions Vout |Iout| |Iout| |Iout| |Iout| |Iout| |Iout| |Iout| 25_C 3.15 1.35 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 ±0.5 85_C 3.15 1.35 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 ±5.0 125_C 3.15 1.35 ±1.0 Unit
Maximum Low-Level Input Voltage
Vout |Iout|
Minimum High-Level Output Voltage
|Iout|
Maximum Low-Level Output Voltage
|Iout|
Maximum Input Leakage Current Maximum Three-State Leakage Current Maximum Quiescent Supply Current (per Package)
Output High-Impedance State Vout Iout
NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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74HC125
ELECTRICAL CHARACTERISTICS Input
Guaranteed Limit Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures 25_C 85_C 125_C Unit
tPLZ, tPHZ
Maximum Propagation Delay, Output Enable (Figures
tPZL, tPZH
Maximum Propagation Delay, Output Enable (Figures
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Cout
Maximum Input Capacitance Maximum 3-State Output Capacitance (Output High-Impedance State)
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Buffer)* Used determine no-load dynamic power consumption: VCC2 load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
ORDERING INFORMATION
Device 74HC125DR2G 74HC125DTR2G Package SOIC-14 (Pb-Free) TSSOP-14* Shipping 2500 Tape Reel 2500 Tape Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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74HC125
SWITCHING WAVEFORMS
(HC126A) tPZL OUTPUT tTHL tPZH OUTPUT tPHZ tPLZ HIGH IMPEDANCE HIGH IMPEDANCE
INPUT tPLH
tPHL tTLH
(HC125A)
OUTPUT
Figure
Figure
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST
TEST POINT OUTPUT CONNECT WHEN TESTING tPLZ tPZL. CONNECT WHEN TESTING tPHZ tPZH.
*Includes probe capacitance
*Includes probe capacitance
Figure Test Circuit
Figure Test Circuit
HC125 (1/4 DEVICE)
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74HC125
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04 0.58
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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74HC125
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
0.65 PITCH
DIMENSIONS: MILLIMETERS
74HC125
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PUBLICATION ORDERING INFORMATION
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74HC125/D

74HC125 identical pinout LS125. device inputs compatible with standard

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