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74HC04 identical pinout LS04 MC14069. device inputs compatible with St
Top Searches for this datasheet74HC04 Inverter 74HC04 identical pinout LS04 MC14069. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. device consists three-stage inverters. http://onsemi.com MARKING DIAGRAMS Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance With JEDEC Standard Requirements Performance: 2000 Machine Model Chip Complexity: FETs Equivalent Gates These Pb-Free Devices LOGIC DIAGRAM SOIC-14 SUFFIX CASE 751A HC04G AWLYWW TSSOP-14 SUFFIX CASE 948G ALYW HC04 Device Code Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location) FUNCTION TABLE Inputs Outputs Pinout: 14-Lead Packages (Top View) ORDERING INFORMATION detailed ordering shipping information package dimensions section page this data sheet. Semiconductor Components Industries, LLC, 2007 March, 2007 Rev. Publication Order Number: 74HC04/D 74HC04 MAXIMUM RATINGS Symbol Iout Tstg Vout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Air, Storage Temperature Lead Temperature, from Case Seconds SOIC TSSOP Package SOIC Package TSSOP Package Output Voltage (Referenced GND) Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. *This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Derating SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Vin, Vout Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 Unit ORDERING INFORMATION Device 74HC04DR2G 74HC04DTR2G Package SOIC-14 (Pb-Free) TSSOP-14* Shipping 2500 Tape Reel information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free. http://onsemi.com 74HC04 CHARACTERISTICS (Voltages Referenced GND) Symbol Parameter Minimum High-Level Input Voltage Condition Vout 0.1V -0.1V |Iout| 20mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA Guaranteed Limit 25°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.20 3.70 5.20 0.40 0.40 0.40 ±1.0 Unit Maximum Low-Level Input Voltage Vout 0.1V 0.1V |Iout| 20mA Minimum High-Level Output Voltage |Iout| 20mA =VIH Maximum Low-Level Output Voltage |Iout| 20mA Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Iout NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). CHARACTERISTICS 50pF, Input 6ns) Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Inverter)* Used determine no-load dynamic power consumption: Semiconductor High-Speed CMOS Data Book (DL129/D). load considerations, Chapter http://onsemi.com 74HC04 INPUT tPLH OUTPUT tTLH tTHL tPHL Figure Switching Waveforms TEST POINT OUTPUT DEVICE UNDER TEST *Includes probe capacitance Figure Test Circuit Figure Expanded Logic Diagram (1/6 Device Shown) http://onsemi.com 74HC04 PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE 0.25 (0.010) NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. SEATING PLANE 0.25 (0.010) MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7.04 0.58 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 74HC04 PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE 0.10 (0.004) 0.15 (0.006) 0.25 (0.010) IDENT. DETAIL 0.15 (0.006) SECTION 0.10 (0.004) SEATING PLANE DETAIL SOLDERING FOOTPRINT* 7.06 0.36 1.26 *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 0.65 PITCH DIMENSIONS: MILLIMETERS 74HC04 Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. 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