74HC00 identical pinout LS00. device inputs compatible with Standard C
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74HC00 Quad 2-Input NAND Gate
74HC00 identical pinout LS00. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs.
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Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance With JEDEC Standard Requirements Performance: 2000 Machine Model Chip Complexity: FETs Equivalent Gates These Pb-Free Devices
LOGIC DIAGRAM
MARKING DIAGRAMS
SOIC-14 SUFFIX CASE 751A HC00G AWLYWW
TSSOP-14 SUFFIX CASE 948G HC00 Device Code Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location) ALYW
FUNCTION TABLE
Inputs Output
Pinout: 14-Lead Packages (Top View)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2007
March, 2007 Rev.
Publication Order Number: 74HC00/D
74HC00
MAXIMUM RATINGS
Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Iout Tstg Output Voltage (Referenced GND) Input Current, Output Current, Supply Current, Pins Power Dissipation Still Air, Storage Temperature Lead Temperature, from Case SOIC TSSOP Package SOIC Package TSSOP Package
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High- Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 Unit
ORDERING INFORMATION
Device 74HC00DR2G 74HC00DTR2G Package SOIC-14 (Pb-Free) TSSOP-14* Shipping
2500/Tape Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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74HC00
CHARACTERISTICS (Voltages Referenced GND)
|Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA Guaranteed Limit 25°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.20 3.70 5.20 0.40 0.40 0.40 ±1.0 Unit
Symbol
Parameter Minimum High-Level Input Voltage
Condition Vout 0.1V -0.1V |Iout| 20mA
Maximum Low-Level Input Voltage
Vout 0.1V 0.1V |Iout| 20mA
Minimum High-Level Output Voltage
|Iout| 20mA =VIH
Maximum Low-Level Output Voltage
|Iout| 20mA
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Iout
NOTE: Information typical parametric values found Chapter Semiconductor High- Speed CMOS Data Book (DL129/D).
CHARACTERISTICS Input
Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High- Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Buffer)*
Used determine load dynamic power consumption: Semiconductor High- Speed CMOS Data Book (DL129/D).
VCC. load considerations, Chapter
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74HC00
tPLH OUTPUT tTLH tTHL tPHL
INPUT
Figure Switching Waveforms
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure Test Circuit
Figure Expanded Logic Diagram (1/4 Device)
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74HC00
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
-A14
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
-TSEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04
1.52
0.58
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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74HC00
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 -1.20 -0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
SECTION
0.10 (0.004) -TSEATING PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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0.65 PITCH
DIMENSIONS: MILLIMETERS
74HC00
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74HC00/D
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