1-5. Package Symbols Codes Package code package codes given outli

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1-5. Package Symbols Codes Package code package codes given outli

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PACKAGE CLASSIFICATIONS
1-5.
Package Symbols Codes Package code package codes given outline view those specified ED-7401-2 (General Rules Preparation Outline Drawings Integrated Circuits Package Name Code) established Electronic Industries Association Japan (EIAJ). Package code applicable OKI's product name marking.
OKI's serial number Lead pitch Reference package dimensions Package material characteristics Number package leads Package name Package structure characteristics Note This information expressed abbreviated codes.
Package Symbol Table 1-5-6 Table 1-5-5 Table 1-5-4 Table 1-5-3 Table 1-5-2 Table 1-5-1
Examples: HQFP208-P-4040-0.65-K This indicates plastic type package with heat sink, consisting leads with package body size 40mm 40mm normal bending lead pitch 0.65mm DIP42-P-600-2.54 This indicates plastic type package consisting leads with spacing between terminal rows 600mil lead pitch 2.54mm. SOJ26/20-P-300-1.27 This indicates plastic type package consisting 20(up 26)leads with spacing between terminal rows 300mil lead pitch 1.27mm.
Table 1-5-1 Package Structure Characteristics
Function Additional structural function Package thickness Lead pitch position Code Appicable package Package with heat sink Package with translucent window Package with package body thickness 1.0mm Package with package body thickness 1.4mm Standard package with smaller lead pitch Package with pins that laid interstitially
PACKAGE CLASSIFICATIONS
Table 1-5-2 Package Names
Code
Package name Quad Flat Package Quad Flat J-Leaded Package Dual In-line Package Small Out-line Package Small Out-line J-Leaded Package Zigzag In-line Package Surface Horizontal Package Grid Array Ball Grid Array
Table 1-5-3 Number Package Leads(Typical Example)
Code 0008 0014 0064 0144 0256 Package name
Table 1-5-4 Package Material
Code Ceramic Ceramic Plastic Material Applicable package Multi-layer ceramic package Hermetic ceramic package sealed with glass Package molded with resin
PACKAGE CLASSIFICATIONS
Table 1-5-5 Reference Package Dimensions(Typical Example)
Package name TSOPI TSOPII SSOP
Reference dimensions Package body size(mm) Package body size(square rectangle) Maximum package mounting height Spacing between terminal rows Matrix size (cavity down) Inter-mount center distance Outermost size(mm) Package body width Package body width Package body width Package body/size (mm) Package body/size (mm)
Code example 1010, 1420 S115, R400 0325, 0400 0300, 0400 S10U, R11D 0225, 0300 1014, 0820 0300, 0400 0300, 0400 0300, 0044 2727, 3535 1125
Note:
English characters code examples shown below. SQUARE RECTANGLE CAVITY CAVITY DOWN
Table 1-5-6 Lead Pitches(Typical Example)
Code 2.54 1.78 1.27 1.00 0.80 0.65 0.50 0.40 0.30 Lead pitch 2.54mm 1.778mm 1.27mm 1.00mm 0.80mm 0.65mm 0.50mm 0.40mm 0.30mm
Package symbols package symbol indicates package name shape shown below.
Lead bending shape (Only QFP): Package structure (Only QFP): Package type: Table 1-5-9 Table 1-5-8 Table 1-5-7
PACKAGE CLASSIFICATIONS
Table 1-5-7 Package Type
Package Symbol AV-Z Plastic standard DIP, plastic skinny Plastic shrink Plastic Ceramic DIP, CER-DIP, ceramic Plastic with less pins Plastic with more than pins, plastic Plastic SOJ, plastic (PLCC) Ceramic SIMM/DIMM SIMM Tape carrier package (TAB) Plastic TSOP, plastic TQFP Plastic Refer "Memory Module Data Book" detail. Package Type
Table 1-5-8 Package Structure
Package Symbol Package Structure Normal heat resistant package(with reflow solding capability) heat resistant package(with reflow solding capability) heat resistant package (Thick type) (with reflow solding capability) Built-in thermal spreader Built-in board
Table 1-5-9 Lead Bending Shape
Package Symbol Lead Structure Flat leads (not bent) Normal bending Reverse bending External View (Side)
PACKAGE CLASSIFICATIONS
Product Naming Serveral kinds package symbols means shown below. package symbol denots type, lead shape package. package symbol does indicate count, shape, code package. details package code package dimentions, please read Data Books devices.
<example> plastic products* plastic products** GS-BK plastic products***
Device code (Device type)
Package symbol
This name format also used plastic skinny products. This name format also used plastic products. This name format also used plastic products.

1-5. Package Symbols Codes Package code package codes given outli

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