Surface mounting type package Package Symbol SSOP GS-B TSOP (Type
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PACKAGE CLASSIFICATIONS
Surface mounting type package
Package Symbol SSOP GS-B TSOP (TypeI) TSOP (TypeII)
Type
Package Types
count
40*1 26/20, 26/24, 28/24, 44/40, 50/44, 70/64, 100, 128, 136, 144, 160, 176, 208, 240, 272, 144, 208*1 48*1, 100, 120*1 144, 176,
Surface Mounting Type GS-2 GS-B Plastic HQFP
High Heat Dissipation QFP*2
GS-C GS-E (SJ)
High Speed QFP*3
TQFP LQFP
26/20, 26/24, 28/24,
(PLCC)
256,
Under development Built-in Heat Spreader *3Built-in
PACKAGE CLASSIFICATIONS
Package Name Small Out-line L-Leaded Package Characteristics packages characterized gull-wing type leads which drawn from each package body directions, mounted flat. standard lead pitch 1.27 mil).
Shrink Small Out-line L-Leaded Package
packages with lead pitch less than 1.27 mil) called SSOP.
Thin Small Out-line L-Leaded Package
TSOP packages ultra thin SOPs with package L-Leaded mounting height less than 1.27 suited ultra-thin electronic equipment such smart cards.
Quad Flat L-Leaded Package
packages characterized gull-wing type leads which drawn from each package body four directions, mounted flat. There various QFPs available because lead pitch variable dimensions package body fixed. packages with heat sink.(for high power device) packages with built-in heat Spreader.(for high power device) packages with built-in PCB.(for high speed device) Thin packages have package body heights (mold thiceness) 1.0mm 1.27mm. LQFP packages have pakacge body height (mold thickness) 1.4mm. packages characterized J-shaped leads which drawn from each package body directions, mounted flat. standard lead pitch 1.27 mil). packages characterized J-shaped leads which drawn from each package body four directions, mounted flat. standard lead pitch 1.27 mil). packages surface mounting package with solder ball arrays backside surface printed circuit board (PCB).
Quad Flat L-Leaded Package with Heat Sink Quad Flat L-Leaded Package with Heat Spreader Quad Flat L-Leaded Package with High Speed Thin Quad Flat L-Leaded Package Profile Quad Flat L-Leaded Package Small Out-line J-Leaded Package
Quad Flat J-Leaded Package
Ball Grid Array
Surface horizontal Package
packages characterized Gull-Wing leads which drawn from package body direction dummy leads which hold package body other direction, mounted flat.
PACKAGE CLASSIFICATIONS
Surface Mouting Type
Type
Package Types
Package Symbol
Count
Ceramic
HQFP
208,
PACKAGE CLASSIFICATIONS
Package Name
Characteristics
Quad Flat Package
packages characterized flat gull wing leads which drawn from each package body four dirctions, mounted flat. These packages fabricated ceramics.
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