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PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
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PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PACKAGE OUTLINES DIMENSIONS
External Package Dimensions
package dimensional symbols used this information manual according Standards Electronic Industries Association Japan (EIAJ).
Dimensional Symbol Item Mounting height Stand-off height Package height Lead shoulder width Lead width Lead thickness Package length Package width Lead pitch Spacing between lead rows Overall length Overall width Length flat part lead Soldered portion length Angle lead flat portions Tolerance lead center position Coplanarity Contents Height between seating plane package body Height between seating plane bottom package body Package thickness Maximum lead width above seating plane Lead width below seating plane Lead thickness Package body length Package body width Distance between lead centers Distance between lead rows Maximum package length longitudinal direction) including leads Maximum package width including leads Through-hole mounting type: Length between seating plane lead Surface mounting type: Length lead flat part contact with seating plane "LP" horizontal projection distance from upper edge lead intersection inner surface lead with gage plane defined basic dimension "0.25" Through-hole mounting type: Angle between lead plane perpendicular seating plane Surface mounting type: Angle between lead flat part seating plane This indicates that maximum allowable position lead center when width maximum material condition (MMC) (the concept maximum material condition applied). Surface mounting type: This indicates uniformity lead bottom against seating plane. maximum value. Distance between center outermost lead package
2.1.1 Package Dimensional Display Symbol
Package overhang
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
2.1.2 Allowable Lead Position Through-hole mounting type (See Figure 2.1.1)
displayed. This display indicates that, when lead width maximum value, maximum allowable position lead center this case, concept maximum material condition (MMC) applied.
When 0.25 displayed DIP, example, 0.25 assuming that lead width leads exist within circle with radius {max. x}/2 {(0.5 0.1) 0.25}/2 centered true center position (geometric position) leads. This means that, when through-hole diameter board 0.85 leads this package inserted. Surface mounting type (See Figure 2.1.2)
displayed. This display indicates that, when lead width maximum value, maximum allowable position lead center parallel direction with board mounted
When 0.13 displayed QFP, example, 0.13 assuming that lead width lead flat parts exist within limits {max. x}/2 {(0.3 0.1) 0.13}/ from true center position (geometric position) leads. This means that, when mount width board 0.53 leads this package mounted mount pad. Definition seating plane Surface mounting type package: seating plane refers plane which lead contacts surface board. seating plane refers plane which determined when lead completely inserted through hole 0.05
Through-hole mounting type package:
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
True Lead Center Maximum Lead Width max. Lead Center Position Maximum Displacement Side
Lead Board Through-hole
Through-hole Diameter
Figure 2.1.1
Allowable Lead Position Through-hole Mounting Type Package
True Lead Center Maximum Lead Width max.
Lead Center Position Maximum Displacement Side
Lead
Soldering (mount pad)
Board
Soldering Length (mount pad)
Figure 2.1.2
Allowable Lead Position Surface Mounting Type Package
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
Through-hole Mounting Type
PLASTIC
Note:
dimensions include resin burrs remains from support.
Package Structural Diagram
EPOXY RESIN
CHIP
SUPPORT LEAD BONDING WIRE WIRE)
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
CERAMIC
INDEX MARK
SEATING PLANE
Package Structural Diagram CHIP BONDING WIRE WIRE) SEALING MATERIAL
LEAD CERAMIC HEADER (Al2O3)
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
SEATING PLANE
Package Structural Diagram GLASS (WDIP only) CHIP GLASS SEAL CERAMIC (AI2O3)
BONDING WIRE WIRE) CERAMIC BASE (AI2O3) LEAD
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC
Note dimensions include resin burrs remains from support. Note dimension includes burrs.
Package Structural Diagram EPOXY RESIN
CHIP
LEAD BONDING WIRE WIRE)
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
CERAMIC
Usual route given numbers
INDEX MARK
SEATING PLANE
Note dimension applies section leads. Note number leads includes leads preventing incorrect insertion.
Package Structural Diagram (CERAMIC PGA) SEAL RING CERAMIC HEADER (AI2O3)
STAND
LEAD BONDING WIRE(AI WIRE) CHIP
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
Surface Mounting Type
PLASTIC
INDEX MARK
SEATING PLANE
Note:
dimensions include resin burrs remains from support.
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram EPOXY RESIN
CHIP
SUPPORT BONDING WIRE WIRE) LEAD
0.25
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC TSOP
Note: dimensions include resin burrs remains from support.
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram
EPOXY RESIN
CHIP
SUPPORT BONDING WIRE WIRE) LEAD
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC TSOP
Note:
dimensions include resin burrs remains from support.
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram EPOXY RESIN
CHIP
SUPPORT BONDING WIRE WIRE) LEAD
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC QFP, TQFP, LQFP
Note:
dimensions include resin burrs remains from support.
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram CHIP EPOXY RESIN
BONDING WIRE WIRE) SUPPORT
LEAD
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC
Note:
dimensions include resin burrs remains from support.
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram EPOXY RESIN
CHIP
SUPPORT LEAD BONDING WIRE WIRE)
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC (PLCC)
Note:
dimensions include resin burrs remains from support.
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural EPOXY RESIN CHIP
BONDING WIRE WIRE)
LEAD
SUPPORT
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram CHIP
EPOXY RESIN
EPOXY
SOLDER BUMP BONDING WIRE WIRE)
PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS
PLASTIC
Notes Mounting Surface Mounting Type Package: SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), packages which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Package Structural Diagram CHIP BONDING WIRE WIRE) EPOXY RESIN
LAND

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