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PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
This document Chapter package information document consisting chapters total.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
PACKAGE CLASSIFICATIONS
Packaging Trends
recent years, marked advances have been made electronics field. such advance been progression from vacuum tubes transistors finally, ICs. themselves have been more highly integrated into LSIs, VLSIs, now, ULSIs. With increased functions counts, packages have change significantly last years order keep-up with advancement semiconductor development. Functions required conventional packages follows: protect chips from external environment facilitate packaging handling chips dissipate heat generated chips protect electrical characteristics
Standard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage electronics industry number years. With increasing integration higher speed ICs, with miniaturization electronic equipment, newer packages have been requested industry which incorporate functions listed below: Multi-pin Ultra-miniature packages Packages suited high density Improved heat resistance with reflow soldering techniques High throughput speed Improved heat dissipation Lower cost
response these requests, developed diversified family packages meet myriad requirements today's burgeoning electronics industry.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Smaller size SURFACE MOUNTING TYPE
SSOP TSOP
Higher Count
TQFP/LQFP
SKINNY
SHRINK-DIP BGA/LGA
Figure 1.1.1
Packaging Trend
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Through-hole mounting type package (DIP, ZIP, SIP, PGA, etc.)
Usage rate
Surface mounting type package (SOP, QFP, SOJ, QFJ, BGA)
Tape carrier (TCP) COB, TCP, etc. 1995 2000 2005
Figure 1.1.2
Package Demand Trend Forecast
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Packaging Classification
[Classification mounting method] Through-hole mount packages Through-hole packages have structure which lead pins inserted soldered into holes (0.8 diameter) drilled through printed circuit (PC) board, find wide applications electronic equipment where board space premium where costs constraint. DIPs, PGAs typical packages this group. ZIPs, skinny DIPs, shrink DIPs high-pindensity packages which used these applications. Surface mount packages Surface mount packages have flat structure which lead pins soldered directly soldered pattern (called mount pad) provided board, used high-pin-density package situations because devices mounted both sides board. QFPs QFJs (PLCC) typical packages this group. Custom packages Memory modules packages which have several memory mounted board, Tape carrier packages (TCP) using Tape Automated Bonding (TAB) techniques, Chip Board (COB) packages, card packages. packages custom designs conforming customer's specifications.
[Classification package materials] Packages broadly classified into ceramic plastic packages. according their application operating environment. Package materials selected
Ceramic packages known their high reliability, plastic packages becoming more popular their cost (when compared ceramic packages). Reliability improved considerably last years making plastic very attractive alternative ceramic.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
packages classified indicated below according shape, material, mounting methods.
Quad Lead Rows
TQFP/LQFP Flat
Dual Lead Rows Surface Mounting Type
SSOP TSOP
Dual Lead Rows Quad Lead Rows
Chip Carrier
(PLCC) BGA/FBGA FLGA W-CSP
Plastic
Matrix
Standard
Throughhole Mounting Type
Skinny
Dual Lead Rows Miniature
Shrink Single Lead Rows Flat Matrix Dual Lead Rows Standard
Quad Lead Rows
(TAB)
Package Type
Ceramic CER-DIP
Surface Mounting Type Throughhole Mounting Type
Custom Type
Memory Module
Socket Type
SIMM DIMM
Figure 1.2.1
Package Classification
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Type Characteristics
Through-hole mounting type package
Type Package Types Package Symbol Count
Standard
Through-hole Mounting Type
Plastic
Skinny
Shrink
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Name
Characteristics
Dual In-line Package
Standard packages most widely used. lead pitch 2.54 (100 mil), spacing between terminal rows 300, 400, mil.
Skinny Dual In-line Package
Skinny packages standard DIPs with spacing between terminal rows 7.62 (300 mil) with more pins.
Shrink Dual In-line Package
Shrink packages standard DIPs with lead pitch reduced 1.778 mil). They smaller external size than standard DIPs suited compact electronic equipment using high-pin-density packages. packages featured leads which drawn from each package body into single allow vertical mounting with lead pitch 1.27 mil). leads each package Zigzag folded, within package surface thickness, into rows. Zigzag folding increases lead pitch each 2.54 (100 mil).
Zigzag In-line Package
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Type
Package Types
Package Symbol
Count
Through-hole Mounting Type
Standard
Ceramic
CER-DIP
73*2, 133*2, 177*2, 209*2, 257*2, 301*2, 240, 365*2,
Under development count includes preventing incorrect insertion.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Name
Characteristics packages hermetic ceramic package. lead pitch 2.54 (100 mil) package body made ceramics. Metal glass used sealing material. Dual In-line packages called "CER-DIP" package. lead pitch 2.54 (100 mil), package body molded with powder ceramics. sealing material glass. packages featured leads which drawn vertically from each package body arranged specified grid. package body made ceramics, standard lead pitch 2.54 (100 mil). packages suited multipin packaging.
Dual In-line Package
Dual In-line Package (Glass Sealed)
Grid Array
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Surface mounting type package
Type Package Types Package Symbol SSOP GS-B TSOP(1) TSOP(2) 40*1 26/20, 26/24, 28/24, 44/40, 50/44, 66*1, 70/64, 86*1 100, 128, 160, 208, 240, 272, 100, 144, 176, 26/20, 26/24, 28/24, Count
GS-2 Surface Mounting Type GS-B Plastic High Heat Dissipation QFP*2 TQFP LQFP GS-C
(SJ)
(PLCC)
104, 144, 176, 224, 256, 352, 420,
BGA/FBGA
FLGA
Wafer Level (W-CSP) Under development Built-in Heat Spreader
Custom design
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Name
Characteristics packages characterized gull-wing type leads which drawn from each package body directions, mounted flat. standard lead pitch 1.27 mil).
Small Out-line L-Leaded Package
Shrink Small Out-line L-Leaded Package
packages with lead pitch less than 1.27 mil) called SSOP.
Thin Small Out-line L-Leaded Package
TSOP packages ultra thin SOPs with package L-Leaded mounting height less than 1.27 suited ultra-thin electronic equipment such smart cards. packages characterized gull-wing type leads which drawn from each package body four directions, mounted flat. There various QFPs available because lead pitch variable dimensions package body fixed. packages with heat sink. (for high power device)
Quad Flat L-Leaded Package Quad Flat L-Leaded Package with Heat Sink Quad Flat L-Leaded Package with Heat Spreader Thin Quad Flat L-Leaded Package Profile Quad Flat L-Leaded Package Small Out-line J-Leaded Package
packages with built-in heat spreader. (for high power device) Thin packages have package body heights (mold thickness) 1.27 LQFP packages have package body height (mold thickness) packages characterized J-shaped leads which drawn from each package body directions, mounted flat. standard lead pitch 1.27 mil). packages characterized J-shaped leads which drawn from each package body four directions, mounted flat. standard lead pitch 1.27 mil). packages surface mounting package with solder ball arrays backside surface printed circuit board (PCB). FLGA packages surface mounting packages with solder land arrays backside printed circuit board (PCB).
Quad Flat J-Leaded Package
Ball Grid Array/Fine Pitch
Fine Pitch Land Grid Array
Wafer Level Chip Size Package
packaged wafer separated into individual chips.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Type Surface Mounting Type
Package Types
Package Symbol
Count
Ceramic
HQFP
208,
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Name
Characteristics
Quad Flat Package
packages characterized flat gull wing leads which drawn from each package body four directions, mounted flat. These packages fabricated ceramics.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Special Packages
Type Package Types Package Symbol Count
(Chip Board)
Custom design
Special Packages
(Tape Carrier Package)
AV-Z
Custom design
Memory Module
Socket type
(Chip Tape)
card
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Name
Characteristics
Chip Board
packages customer-specified packages with chip mounted sealed each board.
Tape Carrier Package
packages constructed using Tape Automated Bonding (TAB) technique. packages suited multi-pin, thin, compact, high density packages. Custom designs available depending application.
Memory Module
Module packages designed that several surface mount packages mounted each board. These packages high-density packages with sophisticated functions, mostly used memories.
Chip Tape
packages customer-specified packages with chip directly mounted sealed each tape substrate.
Package Lineup
Material
Package Name Nominal Size (mil) 300mil
300(WIDE)
Lead Pitch (mm) Number Pins
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
OKI's package lineup follows.
Table 1.4.1
400mil 600mil 300mil 400mil 600mil 750mil
2.54
Skinny
2.54
Plastic
SDIP
1.778
Through-hole Mounting Type Package Lineup
475mil 300mil 400mil 600mil 300mil 400mil 600mil 600mil
400mil 1.27 400(WIDE)
2.54
Ceramic
CER-DIP
2.54
WDIP
2.54 1.27
2.54
Material
Package Name
SSOP
Table 1.4.2
TSOP(1)
TSOP(2)
Plastic
Surface Mounting Type Package Lineup
LQFP
TQFP
FBGA FLGA
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Ceramic
HQFP
Lead Nominal Number Pins Pitch (mm) Size (mil) 352420560 1.27 0.95 0.65 1.27 300mil 1.27 400mil 400mil 550mil 0.65 400mil 400mil 0.65 300mil 1.27 400mil 1.27 1.27 0.65
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Package Symbols Codes
This data book uses both package codes package codes. These package codes applicable OKI's product names their markings.
Note: This information expressed abbreviated codes.
Package code [New package code] package codes given outline view those specified ED-7303 (General Rules Integrated Circuits Package Name Code) established Electronic Industries Association Japan (EIAJ), shown below.
Table 1-5-1 Table 1-5-2 Table 1-5-3 Table 1-5-4 Table 1-5-5 Table 1-5-6 Package Symbol
Package material Package structure characteristics: Package name Number package leads Reference package dimensions Lead pitches OKI's serial number:
[Old package code] package codes given outline view those specified ED-7401-2 (General Rules Integrated Circuits Package Name Code) established Electronic Industries Association Japan (EIAJ), shown below.
Package structure characteristics: Package name Number package leads Package material Reference package dimensions Lead pitches OKI's serial number:
Table 1-5-2 Table 1-5-3 Table 1-5-4 Table 1-5-1 Table 1-5-5 Table 1-5-6 Package Symbol
Examples: P-HQFP208-40 40-0.65-K (HQFP208-P-4040-0.65-K) This indicates plastic type package with heat sink, consisting leads with package body size normal bending lead pitch 0.65 P-DIP42-13.7 51.98-2.54 (DIP42-P-600-2.54) This indicates plastic type package consisting leads with package body width 13.7 package body length 51.98 lead picth 2.54
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
P-SOJ26/20-7.62 17.15-1.27 (SOJ26/20-P-300-1.27) This indicatesa plastic type package consisting leads leads) with package body width 7.62 package body length 17.15 lead pitch 1.27 P-TFLGA48-0707-0.80 This indicates plastic type package consisting leads with package body height less, package body size lead pitch 0.80
Table 1.5.1
Code Material Ceramic Ceramic Plastic
Package Material
Applicable Package
Multi-layer ceramic package Hermetic ceramic package sealed with glass Package molded with resin
Table 1.5.2
Function Additional structural function Package thickness Code Lead pitch position
Package Structure Characteristics
Applicable Package Package with heat sink Package with translucent window Package with package body thickness Package with package body thickness Standard package with smaller lead pitch packages with pitch less package with pitch less Package with pins that laid interstitially
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Table 1.5.3
Code
Package Names
Package Name
Quad Flat Package Quad Flat J-Leaded Package Dual In-line Package Small Out-line Package Small Out-line J-Leaded Package Zigzag In-line Package Grid Array Ball Grid Array Land Grid Array
Table 1.5.4
Code 0008 0014 0064 0144 0256
Number Package Leads (Typical Example)
Package Name
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Table 1.5.5
Package Name TSOP(1) TSOP(2) SSOP Note:
Reference Package Dimensions (Typical Example)
Reference Dimensions Code Example 1010, 1420 S115, R400 0325, 0400 0300, 0400 S10U, R11D 0225, 0300 1014, 0820 0300, 0400 0300, 0400 0300, 0044 2727, 3535 0806
Package body size (mm) Package body size (square rectangle) Maximum package mounting height Spacing between terminal rows Matrix size (cavity down) Inter-mount center distance Outermost size (mm) Package body width Package body width Package body width Package body/size (mm) Package body/size (mm)
English characters code examples shown below. SQUARE RECTANGLE CAVITY CAVITY DOWN
Table 1.5.6
Code 2.54 1.78 1.27 1.00 0.80 0.65 0.50 0.40 0.30
Lead Pitches (Typical Example)
Lead Pitch 2.54 1.778 1.27 1.00 0.80 0.65 0.50 0.40 0.30
Package symbols package symbol indicates package name shape shown below. [Old package symbol]
Lead bending shape (Only QFP): Package structure (Only QFP): Package type:
Table 1.5.9 Table 1.5.8
Table 1.5.7
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Table 1.5.7
Package Symbol AV-Z Plastic shrink Plastic
Package Type
Package Type
Plastic standard DIP, plastic skinny
Ceramic DIP, CER-DIP, ceramic Plastic with less pins Plastic with more than pins, plastic Plastic SOJ, plastic (PLCC) Ceramic SIMM/DIMM SIMM Tape carrier package (TAB) Plastic TSOP, plastic TQFP Plastic Refer "Memory Module Data Book" detail.
Table 1.5.8
Package Symbol
Package Structure
Package Structure
Normal heat resistant package (with reflow soldering capability) heat resistant package (with reflow soldering capability) heat resistant package (Thick type) (with reflow soldering capability) Built-in thermal spreader
Table 1.5.9
Package Symbol Normal bending Reverse bending
Lead Bending Shape
External View (Side)
Lead Structure
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
[New package symbol]
Package type
Table 1.5.10
Table 1.5.10
Material Ceramic Standard CER-DIP HQFP Plastic Standard Shrink Skinny SOP* SSOP* TSOP (1)* TSOP (2)* QFP* (High Heat Dissipation QFP)* TQFP* LQFP* (PLCC) BGA/FBGA FLGA W-CSP Custom type SIMM (Gold Plating) SIMM (Solder Plating) DIMM (Gold Plating) SIMM (Gold Plating) DIMM (Gold Plating) Reverse bending Package Type
Package Type
Symbol
Note: additional symbol inserted into position package symbol each device.
PACKAGE INFORMATION PACKAGE CLASSIFICATIONS
Product Naming manufactured over years. Several kinds package symbols have been used names with symbol such MSM, indicating structure. Because recently kinds devices have increased long package symbols required multifunctions devices, becomes necessary change product naming method. product naming method used products. upgraded gate arrays mask products with code, product naming method used only package symbols option codes. product naming method used existing products. more details, please contact Oki's sales person. [Old product naming]
plastic products* plastic products** GS-BK plastic products***
Device code (Device type)
Package symbol
This name format also used plastic skinny products. This name format also used plastic products. This name format also used plastic products.
[New product naming]
plastic products plastic TQFP products plastic products
Device code Package symbol Product name
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