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packages classified indicated below according shape, material, mountin


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PACKAGE CLASSIFICATIONS
packages classified indicated below according shape, material, mounting method.
4-way Lead TQFP LQFP Flat Bidirectional Lead Surface Mounting Type Chip Carrier SSOP TSOP Bidirectional Lead 4-way Lead Matrix Plastic Bidirectional Lead Miniature Shrink Unidirectional Lead Flat Matrix Bidirectional Lead Standard 4-way Lead (TAB) Custom Type Memory Module Socket Type SIMM DIMM Card Card Memory Card Card Standard Throughhole Mounting Type Surface Mounting Type Throughhole Mounting Type (PLCC) Skinny
Package Type
Ceramic CER-DIP
Figure 1-2-1 Package Classification

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