1-1. Packaging Trends recent years, marked advances have bee

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1-1. Packaging Trends recent years, marked advances have bee

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PACKAGE CLASSIFICATIONS
1-1.
Packaging Trends
recent years, marked advances have been made electronics field. such advance been progression from vacuum tubes transistors finally, ICs. themselves have been more highly integrated into LSIs, VLSIs, now, ULSIs. With increased functions counts, packages have change significantly last years order keep-up with advancement semiconductor development. Functions required conventional packages follows: protect chips from external environment facilitate packaging handling chips dissipate heat generated chips protect electrical characteristics
Standard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage electronics industry number years. With increasing integration higher speed ICs, with miniaturization electronic equipment, newer packages have been requested industry which incorporate functions listed below: Multi-pin Ultra-miniature packages Packages suited high density Improved heat resistance with reflow soldering techniques High throughput speed Improved heat dissipation Lower cost
response these requests, developed diversified family packages meet myriad requirements today's burgeoning electronics industry.
PACKAGE CLASSIFICATIONS
Smaller Size SURFACE MOUNTING TYPE
SSOP
TSOP
Higher Count
TQFP/LQFP
SKINNY
SHRINK
Figure 1-1-1 Packaging Trend
PACKAGE CLASSIFICATIONS
Through-hole mounting type package (DIP, SIP, ZIP, PGA, etc.)
Usage Rate
Surface mounting type package (SOP, QFP, SOJ, QFJ, BGA, etc.)
Tape carrier(TCP), COB, etc. 1995 2000 2005
Figure 1-1-2 Package Demand Trend Forecast

1-1. Packaging Trends recent years, marked advances have bee

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