Reliability Report Update Plastic Chip Carrier (PCC) Package Nati

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Reliability Report Update Plastic Chip Carrier (PCC) Package Nati

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Reliability Report Update Plastic Chip Carrier (PCC) Package
Reliability Report Update Plastic Chip Carrier (PCC) Package
National Semiconductor continues conduct reliability tests complete line surface mount components assure highest level reliability performance possible This Reliability Report Update presents additional data recently gathered National's family plastic chip carrier packages with leadcounts data demonstrates that reliability performance products assembled National's plastic chip carrier package excellent comparable reliability performance product assembled National's standard dual-inline package (DIP) INTRODUCTION (Plastic Chip Carrier) package been developed meet customer demand ever-increasing miniaturization component density surface mounting requirements These devices occupy only 25-35% board area required conventional packages These small packages mount directly surface board substrate Users should note that boards devices have different design considerations from those typically used traditional insertion-mounted DIPs Several techniques ``high density surface mounting'' have been developed well board substrate materials National's Reliability Department performed series accelerated environmental tests determine reliability this package Descriptions these tests results follow Thermal resistance characteristics appear this report TEST DESCRIPTIONS High Temperature Bias Continuous operation rated supply voltage High Temperature Bias most generally accepted accelerated life test elevated temperature along with
National Semiconductor July 1986
applied voltage stress accelerates many failure mechanisms associated with packaging system with accelerated environmental tests failures analyzed package related failure mechanisms Temperature Humidity Bias Continuous operation rated supply voltage Temperature Humidity Bias standard test plastic package integrity with respect moisture external contaminant penetration combination temperature humidity bias accelerates failure mechanisms that would occur moisture penetrates package primary failure mechanism corrosion electrolysis device metallization bonding wires Autoclave Unbiased 100% Autoclave designed accelerate penetration moisture into package order determine resistance packaging system moisture external contaminants Temperature Cycle Unbiased minutes cycle Temperature cycle tests thermal expansion coefficient compatibility materials used design packaging systems alternating temperature extremes expected failure mechanisms include cracking encapsulation-leadframe interfaces fractured lifted bond wires addition moisture contaminants tend driven into cracks openings seals seams package expands contracts Thermal Shock Unbiased liquid minutes immersion seconds transfer time cycle This test while similar Temperature cycle designed examine different rates thermal conductivity package materials affect integrity package materials when exposed alternating temperature extremes
Component Size Comparison Plastic Chip Carrier Dual-in-Line Package
8671 8671
C1995 National Semiconductor Corporation
8671
RRD-B30M115 Printed
High Temperature Bias Device DS75451 DS75451 DS75451 DS75451 LM324 LM324A LM324A LM324A 87S191 87S191 87S181 87S181 87S191 87S191 DMPAL16L8 DMPAL16L8 DMPAL16R4 DMPAL16R4 DMPAL16R8 DMPAL16R8 INS8250A INS8250A INS8250A INS8250A INS8250A INS8250A SCX6324 SCX6324 SCX6234 SCX6234 SCX6234 Package 8-DIP 20-PCC 28-PCC 44-PCC 14-DIP 20-PCC 28-PCC 44-PCC 24-DIP 28-PCC 24-DIP 28-PCC 24-DIP 28-PCC 20-DIP 20-PCC 20-DIP 20-PCC 20-DIP 20-PCC 40-DIP 44-PCC 40-DIP 44-PCC 40-DIP 44-PCC 48-DIP 68-PCC 68-PCC 68-PCC 68-PCC
Note Functional Note Leakage bake recoverable Note Functional Note Marginal (Parametric) Note Functional packages board mounted (Vapor-phase soldering
1000
77(1)
76(2)
77(3) 80(5) 1260
80(4) 75(4) 1264
1261
Temperature Humidity Bias Device DS75451 DS75451 DS75451 LM324 LM324A LM324A LM324A 87S191 87S191 87S181 87S181 87S191 87S191 DMPAL16L8 DMPAL16L8 DMPAL16R4 DMPAL16R4 DMPAL16R8 DMPAL16R8 INS8250A INS8250A INS8250A INS8250A INS8250A INS8250A SCX6324 SCX6324 Package 8-DIP 20-PCC 28-PCC 14-DIP 20-PCC 28-PCC 44-PCC 24-DIP 28-PCC 24-DIP 28-PCC 24-DIP 28-PCC 20-DIP 20-PCC 20-DIP 20-PCC 20-DIP 20-PCC 40-DIP 44-PCC 40-DIP 44-PCC 40-DIP 44-PCC 48-DIP 68-PCC
Note Note Parametric Note Parametric Input leakage Note Functional Note Marginal (Parametric) Measurements packages board mounted (Vapor-phase soldering
1000 43(1) 46(2)
70(3) 80(5) 1081
80(4) 1004
1081
Autoclave 100% Device LM324 LM324A LM324A LM324A 87S191 87S191 87S181 87S181 87S191 87S191 DMPAL16L8 DMPAL16L8 DMPAL16R4 DMPAL16R4 DMPAL16R8 DMPAL16R8 INS8250A INS8250A INS8250A INS8250A INS8250A SCX6234 SCX6234 SCX6234 SCX6234 SCX6234 SCX6234 Package 14-DIP 20-PCC 28-PCC 44-PCC 24-DIP 28-PCC 24-DIP 28-PCC 24-DIP 28-PCC 20-DIP 20-PCC 20-DIP 20-PCC 20-DIP 20-PCC 40-DIP 40-DIP 44-PCC 40-DIP 44-PCC 68-PCC 68-PCC 68-PCC 68-PCC 68-PCC 68-PCC
Note Marginal Note Marginal Note Marginal (Parametric) Note Parametric
55(1) 55(3) 55(4) 1387
54(2)
55(4) 1387
1387
Temperature Cycle Device DS75451 DS75451 DS75451 DS75451 DS75451 DS75451 LM324A LM324A LM324A 87S191 87S191 87S181 87S181 87S191 87S191 DMPAL16L8 DMPAL16L8 DMPAL16R4 DMPAL16R4 DMPAL16R8 DMPAL16R8 INS8250A INS8250A INS8250A INS8250A INS8250A SCX6234 SCX6234 Package 20-PCC 20-PCC 28-PCC 28-PCC 44-PCC 44-PCC 20-PCC 28-PCC 44-PCC 24-DIP 28-PCC 24-DIP 28-PCC 24-DIP 28-PCC 20-DIP 20-PCC 20-DIP 20-PCC 20-DIP 20-PCC 40-DIP 40-DIP 44-PCC 40-DIP 44-PCC 68-PCC 68-PCC
Note Rampup intermetal oxide short
1000 Cycles 2000 Cycles
Cycles
1827
45(1) 1827
1825
packages board mounted (Vapor-phase soldering
Thermal Shock Device DS75451 DS75451 DS75451 DS75451 LM324 LM324A LM324A LM324A 87S191 87S191 87S181 87S181 87S191 87S191 DMPAL16L8 DMPAL16L8 DMPAL16R4 DMPAL16R4 DMPAL16R8 DMPAL16R8 SCX6234 SCX6234 SCX6234 SCX6234 SCX6234 Package 8-DIP 20-PCC 28-PCC 44-PCC 14-DIP 20-PCC 28-PCC 44-PCC 24-DIP 28-PCC 24-DIP 28-PCC 24-DIP 28-PCC 20-DIP 20-PCC 20-DIP 20-PCC 20-DIP 20-PCC 68-PCC 68-PCC 68-PCC 68-PCC 68-PCC
Note Parametric Input leakage packages board mounted (Vapor-phase reflow soldering
Cycles Cycles Cycles
1137
1137
1137
8671
CONCLUSION Data presented this report demonstrate that reliability performance product assembled National's Plastic Chip Carrier (PCC) package excellent comparable
reliability performance product assembled National's standard dual-in-line (DIP) package
Reliability Report Update Plastic Chip Carrier (PCC) Package
980040
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT NATIONAL SEMICONDUCTOR CORPORATION used herein Life support devices systems devices systems which intended surgical implant into body support sustain life whose failure perform when properly used accordance with instructions provided labeling reasonably expected result significant injury user
National Semiconductor Corporation 1111 West Bardin Road Arlington 76017 1(800) 272-9959 1(800) 737-7018
critical component component life support device system whose failure perform reasonably expected cause failure life support device system affect safety effectiveness
National Semiconductor Europe (a49) 0-180-530 Email cnjwge tevm2 Deutsch (a49) 0-180-530 English (a49) 0-180-532 Fran (a49) 0-180-532 Italiano (a49) 0-180-534
National Semiconductor Hong Kong 13th Floor Straight Block Ocean Centre Canton Tsimshatsui Kowloon Hong Kong (852) 2737-1600 (852) 2736-9960
National Semiconductor Japan 81-043-299-2309 81-043-299-2408
National does assume responsibility circuitry described circuit patent licenses implied National reserves right time without notice change said circuitry specifications

Reliability Report Update Plastic Chip Carrier (PCC) Package Nati

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