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Reliability Report Update Small Outline SO Package

National Semiconductor July 1986

Reliability Report Update Small Outline (SO) Package
National Semiconductor July 1986
Component Size Comparison Dual-In-Line Package Small Outline Package
C1995 National Semiconductor Corporation
TL HH 8685
RRD-B30M115 Printed in U S A
High Temperature Bias Device 54HC245 54HC373 54HC373 54HC373 74HC00 74HC00 74HC00 74HC00 74HC74 74HC74 74HC244 74HC244 74HC373 74HC373 74HC374 74HC374 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM339 LM339 LM358 LM358 LM358 LM358 Package SO-20 DIP-20 SO-20 SO-20 DIP-14 DIP-14 SO-14W SO-14W DIP-14 SO-14W DIP-20 SO-20 DIP-20 SO-20 DIP-20 SO-20 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-8 SO-8 SO-8 SO-8 Total DIP Total SO
Note 1 Parametric ICC leakage No measurements taken All SO packages board mounted (vapor-phase reflow soldering)
High Temperature Bias Device 74LS08 74LS08 74LS240 74LS240 CD4601 LF347 LF347 LF351 LF351 LF351 LF353 LF353 LF353 LF353 Package DIP-14 SO-14 SO-20 SO-20 SO-14 DIP-14 SO-14W DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 SO-8 168 Hours 0 0 0 0 0 1 0 0 0 0 0 0 0 0
High Temperature Bias Device LF411 LF411 LF411 LF412 LF412 LF412 LM111 LM111 LM308 LM308 LM308 LM308 LM311 LM311 LM311 LM311 LM346 LM346 LM348 LM348 LM359 LM359 LM442 LM442 LM592 LM592 LM723 LM723 LM741 LM741 LM741 LM741 LM1496 LM1524 LM1524 LM1558 LM1558 LM1558 LM2903 LM2903 LM3086 LM3086 Package DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 DIP-8 SO-8 SO-8 DIP-8 DIP-8 SO-8 SO-8 DIP-16 SO-16 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 SO-8 SO-8 SO-14 DIP-16 SO-16 DIP-8 SO-8 SO-8 DIP-8 SO-8 DIP-14 SO-14 Total DIP Total SO
Note 1 Parametric gain bandwidth Note 2 Parametric VOS Note 3 Oxide short-ESD Note 4 Package cracked (handling damage) Note 5 No visual defect
Note 6 Parametric gain
Note 7 Parametric load regulation Note 8 Parametric VSAT No measurements taken All SO packages board mounted (vapor-phase reflow soldering)
Temperature Humidity Bias Device 74HC00 74HC00 74HC00 74HC00 74HC74 74HC74 74HC244 74HC244 74HC245 54HC373 54HC373 54HC373 74HC373 74HC373 74HC374 74HC374 74LS08 74LS08 74LS240 74LS240 CD4601 LF347 LF347 LF351 LF351 LF351 LF353 LF353 LF353 LF353 LF411 LF411 LF411 LF412 LF412 LM111 LM111 LM308 LM308 LM311 LM311 LM311 LM311 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM346 LM346 Package DIP-14 SO-14 DIP-14 SO-14 DIP-14 SO-14 DIP-20 SO-20 SO-20 DIP-20 SO-20 SO-20 DIP-20 SO-20 DIP-20 SO-20 DIP-14 SO-14 SO-20 SO-20 SO-14 DIP-14 SO-14W DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 SO-8 DIP-8 SO-8 SO-8 DIP-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 DIP-16 SO-16 168 Hours 0 0 0 0 0 0 88 77 77 88 77 77
Temperature Humidity Bias Device LM348 LM348 LM358 LM358 LM358 LM359 LM359 LM442 LM442 LM592 LM592 LM723 LM723 LM741 LM741 LM832 LM1496 LM1496 LM1524 LM1524 LM1558 LM1558 LM1558 LM1902 LM1902 LM2903 LM2903 LM3086 LM3086 Package DIP-14 SO-14 SO-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 SO-14 DIP-14 SO-14 DIP-16 SO-16 DIP-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 Total DIP Total SO
Note 1 Short to VCC Note 2 Parametric IB e 13 84 nA (Max e 300 pA) Note 3 Marginal parametric (PSRR)-Tested good at 500 Hrs Note 4 Open metallization-ECR Note 5 Parametric VOUT High e 12 54V (Min e 26V) Note 6 Parametric VOUT High e 14 14V (Min e 26V)
Note 7 Parametric IB
Note 8 Parametric VOS Note 9 Parametric DC gain Note 10 Parametric MAXDCY No measurements taken All SO packages board mounted (vapor-phase reflow soldering)
Note 1 Parametric ICC leakage No measurements taken
96 Hours
Note 1 ECR-open metallization No measurements taken
1000 Hours
Temperature Cycle Device LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM339 LM339 LM358 LM358 LM358 LM358 Package SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-8 SO-8 SO-8 SO-8 Total SO
Note 1 Parametric swing failure No measurements taken All SO packages board mounted (vapor-phase reflow soldering)
Temperature Cycle Device 74HC74 74HC244 74HC373 74HC374 74LS08 74LS08 74LS240 74LS240 CD4601 DS75451 LM324 LM324 LM332 LM1902 LM1902 LM2903 LM2903 Package SO-14 SO-20 SO-20 SO-20 DIP-14 SO-14 SO-20 SO-20 SO-14 SO-14 DIP-14 SO-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 Total SO Total DIP
No measurements taken All SO packages board mounted (vapor-phase reflow soldering)
Thermal Shock Device CD4601 DS75451 LM111 LM111 LM308 LM308 LM324 LM324 LM324 LM832 LM1902 LM1902 Package SO-14 SO-14 SO-14 DIP-14 DIP-8 SO-8 DIP-14 SO-14 SO-14 SO-14 DIP-14 SO-14 Total DIP Total SO 15 Cycles 0 100 0 50 0 75 0 75 0 100 0 100 0 20 0 60 0 50 0 60 0 30 0 30 0 225 0 525
All SO packages board mounted (vapor-phase reflow soldering)
ijA - Thermal Resistance for SO Packages (Board Mount)
Body Width N e Narrow (0 150 inches) W e Wide (0 300 inches)
Air Flow
Reliability Report Update Small Outline (SO) Package
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2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness
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National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications