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2 WATT C-BAND POWER GaAs MESFET

NE8500200 NE8500295-4 NE8500295-6 NE8500295-8 PART NUMBER

2 WATT C-BAND POWER GaAs MESFET
FEATURES
NE8500200 NE8500295-4 NE8500295-6 NE8500295-8 PART NUMBER
NE85002 SERIES
SELECTION CHART
TYPICAL PERFORMANCE FREQUENCY GL RANGE (dBm) (GHz) (dB) POUT 33.8 MIN 33.8 MIN 33.8 MIN 33.5 MIN 2.0 to 10 3.5 to 4.5 5.5 to 6.5 7.5 to 8.5 8.0 MIN 10.5 MIN 9.5 MIN 8.0 MIN
DESCRIPTION
The NE8500295 power GaAs FET covers the 3.5 to 8.5 GHz frequency range with three different Class A, 2 W partially matched devices. Each packaged device has an input lumped element matching network. The NE8500200 is the six-cell recessed gate chip used in the "95" package. The device incorporates a Ti-Al gate structure, SiO2 glassivation and plated heat sink technology.
PART NUMBER PACKAGE OUTLINE SYMBOLS IDSS VP gm BVGDO IGS RTH PTEST2 NE85002001 00 (CHIP) NE8500295-4 95 NE8500295-6 95 NE8500295-8 95 TYP MAX 660 1650 -1.0 600 18 2.4 15 -2.4 2.4 15
TYP MAX MIN 660 -1.0 600 18 2.4 -2.4 1650 -3.0
TYP MAX MIN 660 -1.0 600 18 2.4 15 -2.4 1650 -3.0
TYP MAX MIN 660 -1.0 600 1650 -3.0
Thermal Resistance (Channel-to-Case) °C / W
dBm dBm dBm
GL ADD3
Notes: 1. Six-cell chip: all cells are used. RF performance of the chip is determined by packaging 10 chips per wafer. Wafer rejection criteria for standard devices are 2 rejects per 10 samples. 2. This is a production test. Test frequencies are: -4 @ 4.2 GHz, -6 @ 6.5 GHz, -8 and NE8500200 @ 8.5 GHz.
California Eastern Laboratories
SYMBOLS VDS VGD VGS ID IG TCH TSTG PT PARAMETERS Drain to Source Voltage Gate to Drain Gate to Source Voltage Drain Current Gate Current Channel Temperature Storage Temperature Total power Dissipation UNITS V V V A mA °C °C W RATINGS 15 -18 -12 2.5 13 175 -65 to +175 13
RECOMMENDED OPERATING CONDITIONS
SYMBOLS VDS TC GCOMP Rg PARAMETERS Drain to Source Voltage Channel Temperature Input Power Gate Resistance UNITS V °C dBCOMP k 1 MIN 9 TYP MAX 10 130 3 2
NE8500295-6 LARGE SIGNAL IMPEDANCES
FREQUENCY GHz 5.90 6.20 6.40 6.50 ZIN 13.16 - j44.75 22.77 - j59.68 149.70 - j73.98 43.58 - j56.13 ZOUT 11.48 - j21.52 16.16 - j25.02 23.44 - j40.36 12.87 - j11.86
ZIN is the impedance of the input matching circuit as seen by the gate. ZOUT is the impedance of the output matching circuit as seen by the drain.
POWER DERATING CURVE
OUTPUT POWER vs. INPUT POWER
Total Power Dissipation, PT (W)
Output Power, POUT (dBm)
Case Temperature, TC (°C)
Input Power, PIN (dBm)
S22 10 GHz
S21 0.1 GHz
S22 0.1 GHz
S21 10 GHz
S12 0.1 GHz
S11 10 GHz S11 0.1 GHz
S12 10 GHz
FREQUENCY (GHz) 0.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 MAG 1.003 0.971 0.972 0.987 0.976 0.965 0.927 0.886 0.843 0.882 0.929 0.945 0.937 0.929 0.919 0.905 0.883 0.843 0.779 0.723 0.683 S11 ANG -81.900 -161.600 -179.600 169.800 160.100 150.700 145.700 139.600 134.633 129.600 118.200 106.500 96.800 87.900 76.700 60.100 34.100 0.700 -29.300 -59.300 -97.000 MAG S21 ANG MAG 0.009 0.010 0.012 0.013 0.017 0.018 0.018 0.020 0.014 0.021 0.037 0.047 0.054 0.058 0.069 0.086 0.117 0.142 0.141 0.133 0.114 14.230 135.700 3.768 90.400 2.006 69.100 1.479 51.400 1.255 34.300 1.205 15.900 1.149 -2.500 1.343 -30.300 1.486 -73.367 1.233 -126.500 0.738 -166.200 0.455 166.100 0.303 143.700 0.227 124.600 0.190 104.500 0.186 80.200 0.187 47.000 0.174 8.700 0.144 -26.400 0.124 -51.800 0.116 -74.600 S12 ANG -14.900 26.000 19.700 27.200 27.600 18.300 20.200 11.800 20.367 76.600 54.400 38.400 25.900 15.100 7.600 0.300 -18.200 -44.800 -74.800 -95.500 -110.500 MAG 0.428 0.414 0.429 0.457 0.479 0.514 0.588 0.700 0.864 0.931 0.838 0.785 0.769 0.763 0.756 0.725 0.676 0.629 0.623 0.647 0.661 S22 ANG -158.600 -173.100 -178.200 -178.700 179.500 177.400 -176.700 -176.000 173.900 153.400 137.500 127.500 121.100 116.400 112.300 107.100 96.600 80.500 66.100 55.900 52.500 -0.384 0.655 0.923 0.521 0.804 0.976 1.876 1.464 1.049 -0.147 -0.011 0.325 1.053 1.876 2.389 2.654 2.868 3.794 6.295 8.799 11.714 K MAG1 (dB) 31.990 25.761 22.231 20.560 18.682 18.257 12.657 14.232 18.899 17.687 12.999 9.859 6.087 0.532 -2.190 -3.736 -5.411 -7.842 -10.881 -12.745 -13.614
Note: 1. Gain Calculations:
S22 10 GHz
S21 0.1 GHz S21 10 GHz
S22 0.1 GHz
S12 0.1 GHz
S11 10 GHz S11 0.1 GHz
S12 10 GHz
FREQUENCY (GHz) 0.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 Note: 1. Gain Calculations:
S11 MAG 0.963 0.952 0.947 0.963 0.956 0.949 0.948 0.898 0.876 0.847 0.813 0.737 0.560 0.264 0.344 0.539 0.623 0.637 0.610 0.574 0.514 ANG -59.200 -149.100 -173.800 172.900 161.800 150.900 140.700 138.500 128.200 116.000 101.800 85.400 69.800 73.200 127.700 117.600 90.700 53.500 16.000 -16.900 -55.800 MAG
S21 ANG MAG 0.003 0.016 0.017 0.018 0.021 0.022 0.029 0.031 0.036 0.041 0.048 0.054 0.057 0.046 0.023 0.013 0.038 0.075 0.096 0.099 0.090 16.698 149.400 5.714 97.600 3.033 74.200 2.152 56.400 1.701 41.000 1.472 26.000 1.328 11.300 1.164 0.700 1.168 -13.300 1.278 -28.700 1.432 -47.900 1.648 -71.000 1.926 -99.800 2.118 -137.200 1.924 -176.300 1.625 151.000 1.406 119.500 1.163 84.600 0.868 52.600 0.676 25.900 0.561 -0.600
S12 ANG 29.700 22.800 20.000 17.400 22.200 21.200 20.600 17.400 11.000 4.800 -6.900 -23.900 -47.400 -82.700 -123.600 99.500 36.300 -1.900 -41.300 -69.300 -88.500 MAG 0.373 0.463 0.485 0.512 0.532 0.556 0.578 0.605 0.607 0.595 0.616 0.664 0.757 0.871 0.920 0.884 0.838 0.779 0.718 0.693 0.673
S22 ANG -169.500 -171.200 -179.300 177.700 173.900 172.700 170.500 168.000 163.200 158.400 152.300 146.000 140.000 131.200 120.200 110.200 95.900 74.700 56.000 47.000 43.200
K 0.408 0.377 0.769 0.653 0.859 1.018 0.806 1.547 1.554 1.529 1.250 1.072 0.966 1.101 1.866 3.241 1.283 1.035 1.653 2.524 3.931
MAG1 (dB) 37.455 25.528 22.514 20.776 19.085 17.440 16.608 11.388 10.727 10.646 11.735 13.203 15.288 14.693 13.858 12.959 12.486 10.759 4.837 1.493 -0.936
S22 10 GHz
S21 0.1 GHz S21 10 GHz
S22 0.1 GHz
S11 10 GHz
S12 0.1 GHz
S11 0.1 GHz
S12 10 GHz
FREQUENCY (GHz) 0.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 Note: 1. Gain Calculations:
S11 MAG 0.971 0.937 0.934 0.947 0.939 0.921 0.906 0.887 0.866 0.836 0.805 0.734 0.587 0.303 0.116 0.394 0.536 0.570 0.497 0.354 0.288 ANG -54.800 -146.300 -174.000 170.900 158.300 153.800 145.400 137.000 126.200 113.900 98.800 80.200 57.400 23.500 -152.800 158.700 126.700 91.000 45.200 3.800 -34.500 MAG
S21 ANG MAG 0.004 0.016 0.018 0.020 0.026 0.023 0.027 0.034 0.041 0.044 0.056 0.065 0.073 0.075 0.063 0.042 0.025 0.033 0.069 0.067 0.068
S12 ANG 35.400 24.000 22.300 20.800 28.100 22.700 20.900 19.900 10.200 6.000 -4.100 -18.900 -41.500 -69.900 -101.500 -134.100 165.800 49.500 -26.200 -59.800 -86.200 MAG 0.427 0.464 0.492 0.513 0.534 0.573 0.592 0.603 0.602 0.583 0.592 0.628 0.695 0.788 0.874 0.883 0.858 0.843 0.773 0.747 0.712
S22 ANG -155.900 -172.300 -178.900 177.400 173.300 169.500 168.100 165.700 160.300 155.200 149.200 142.800 138.700 133.400 125.700 115.900 102.200 81.500 59.800 51.700 46.800
MAG1 (dB)
NE85002 SERIES RF TEST CIRCUIT
GATE RF POWER SOURCE
S1 BIAS SUPPLY
20dB DIRECTIONAL COUPLER
Circulator
BIAS TEE
TUNER
D.U.T.
TUNER
BIAS TEE
10 dB ATTN.
POWER METER
30 dB ATTN.
OUTLINE DIMENSIONS AND HANDLING
PACKAGE OUTLINE 95 (Units in mm)
NE8500200 (CHIP) (Units in µm)
DIE ATTACHMENT
PRECAUTIONS
The user must operate in a clean, dry environment. The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean environment. The bonding equipment should be periodically checked for sources of surge voltage and should be properly grounded at all times. All test and handling equipment should be grounded to minimize the possibilities of static discharge. See AN-1001 Recommended Handling Procedure for Microwave Transistor & MMIC Chips for additional infromation.
BONDING
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RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
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