NAME'S NEC'S PACKAGES PACKAGE CODES EIAJ Construction package cod
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EIAJ Standards JEDEC Standards Standards
NAME'S NEC'S PACKAGES PACKAGE CODES EIAJ
Construction package code
DIMENSION SYMBOL EXAMPLE DIMENSIONS
Example dimensions packages Dimension Symbols 4.2.1 Reference dimensions "true geometric location" 4.2.2 Dimensional indication geometric tolerance 4.2.3 (Tolerance terminal center)
PACKING PACKAGES
Packing Style Notes 5.1.1 Packing style 5.1.2 Notes hanging Dimension tapings 5.2.1 Taping SOP/TSOP 5.2.2 Taping 5.2.3 Taping 5.2.4 Taping
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INTRODUCTION
Packages semiconductor products have been diversified become more complicated recent years chiefly because these packages have significant clue increasing density electronic systems where they semiconductor products they house employed. Take products example. Through Hole Device (THD), whose representative package been Dual In-line Package (DIP), have increasingly employed newly developed packages such those with shrunk lead pitches, Zig-zag In-line Packages (ZIP), Quad In-line Packages (QUIP), Grid Array packages (PGA), order contribute increasing density board which device mounted. addition, order satisfy demands compact slim packages, Surface Mount Device (SMD) packages such Small Outline Packages (SOP), Quad Flat L-leaded Packages (QFP), Quad flat J-leaded Packages (QFJ), Surface Vertical Package (SVP) Ball Grid Array (BGA) have been developed increasingly made their through market. This manual describe packages THDs SMDs, including their dimensions packing style, order deepen your understanding these diversified packages. recommended that also refer "Semiconductor Device Mounting Technology Manual" (C10535E) separately available. April, 1999 Corporation
STANDARDIZATION PACKAGES
necessary that packages standardized manufacturers that they easy users.
Therefore, standardizes packages exchanging opinions with users, related system manufacturers, parts supplier, actively participating various activities standardization. These activities standardization packages, shown figure below, developed Japan, United States, European nations. international standardization activities promoted Semiconductor Devices Sub-committee (SC47D) Technical Committee (TC-47) International Electrotechnical Commission (IEC). Japan, these activities organized Technical Standardization Committee Semiconductor Device Package (EE-13), subcommittees subordinate organizations Electronic Industry Association Japan (EIAJ). United States, organization semiconductor packages (JC-11) Joint Electronic Device Committee, subordinate organization Electronic Industry Association, mainly responsible standardization activities. These standardization activity organizations shown Fig. 1-1. activities each organization periodically conducted actively promoted.
Fig. Standardization Activity Organizations
World IEC; TC-47, SC47D (Deliberation: times/year)
International Electrotechnical Commission
Committee Japan
Committee U.S.A
Committee each country
EIAJ Technical Standardization Committee Semiconductor Device Package; EE-13 (Deliberation: Once/2 months)
JEDEC; JC-11 (Deliberation: times/year)
Standardization organization each country
Sub-Comittee Plastic Package Sub-Committee Ceramic Package Sub-Committee Discrete Semiconductor Package Sub-Committee Semiconductor Packing Sub-Committee Area Array Package Sub-Committee IEC/SC47D matters
EIAJ
Electronic Industries Association Japan Electronic Industries Association JEDEC Joint Electron Device Engineering Council
EIAJ Standards
EIAJ standards enacted Technical Standardization Committee Semiconductor Device Package (EE-13), which consists semiconductor manufacturers, package manufacturers, socket manufacturers, major standards related packages enacted this committee follows: Remark standards following lists readily available from Electronic Industry Association Japan(EIAJ). Electronic Industry Association Japan 5-13, Nishi-shinbashi 1-chome, Minato-ku, tokyo 105, Japan Public Affaires Office Phone: +81-3-3213-5861/FAX: +81-3-3213-5863
EIAJ Standard (1/4) General Rule Semiconductor Device Package
Number ED-7300 EIAJ Standard Recommended practice standard preparation outline drawing semiconductor packages Manual standard integrated circuits package Manual integrated circuits package design guideline Measuring Method Package Dimensions Ball Grid Array(BGA) Measuring Method Package Dimensions Small Outline Package(SOP) Unit Design Guide Preparation Package Outline Drawing Integrated Circuits(Gullwing-lead) Standard dimensions semiconductor devices (Integrated Circuits) Standard dimensions semiconductor devices (Integrated Circuits) Standard dimensions semiconductor devices (Integrated Circuits) Package name code semiconductor device package(Integrated Circuits) Method measuring semiconductor device package dimensions(Integrated Circuits) Standard packages universal Memory-devices Standard deimensions semiconductor devices (Discrete semiconductor devices) Registration 1997.08
ED-7301 ED-7302 ED-7304 ED-7304-1 ED-7305
1996.12 1997.04 1997.05 1997.03 1997.04
ED-7400 ED-7400-1 ED-7400-2 ED-7401-2 ED-7401-4 ED-7441B ED-7500A
1990.09 1990.09 1991.06 1994.06 1995.05 1998.03 1996.07
EIAJ Standard (2/4) Standard integrated circuits package
Number ED-7311 ED-7311-1 ED-7311-2 ED-7311-3 ED-7311-4 ED-7311-5 ED-7311-6 ED-7311-9 ED-7311-10 ED-7311-11 EIAJ Standard Standard integrated circuits package(QFP) Standard integrated circuits package [TSOP(I)] Standard integrated circuits package [TSOP(II)] Standard integrated circuits package (1.0mm pitch T-FBGA) Standard integrated circuits package (1.27mm pitch T-FBGA) Standard integrated circuits package (32/48-pin FBGA) Standard integrated circuits package (60/90-pin FBGA) Standard integrated circuits package [P-BGA(C/U type)] Standard integrated circuits package [P-BGA(C/D type)] Standard integrated circuits package (119/153-pin P-BGA) Registration 1997.05 1997.08 1997.08 1997.08 1997.08 1998.04 1998.04 1998.03 1998.03 1998.03
EIAJ Standard (3/4) General Rules Preparation Outline Drawings Integrated Circuits
Number ED-7402-1 ED-7403-1 ED-7405 ED-7405-1 ED-7406A ED-7407 ED-7408A ED-7409 ED-7410 ED-7412 ED-7413 ED-7414 ED-7415 ED-7417 ED-7418 ED-7419 ED-7421 ED-7422 ED-7423 ED-7424 ED-7431A ED-7432 ED-7433 Small Outline Package Plastic Dual In-line Package Zigzag In-line Package Shrink Zigzag In-line Package SZIP Small Outline J-leaded Package Quad Flat J-leaded Package Grid Array Quad Flat I-leaded Package Small Outline I-leaded Package Quad Flat lead-less Package Single In-line Package Guard ring Quad Flat Package GQFP Small Outline Package with Heat sink HSOP Bumpered Quad Flat Package BQFP Glass seal Quad Flat Package QFP-G Glass seal Dual In-line Package DIP-G Ceramic Dual In-line Package DIP-C Glass seal Quad Flat J-leaded Package QFJ-G Ceramic Quad Flat J-leaded Package QFJ-C Surface Vertical Package Quak Tape carrier Package Dual Tape carrier Package (Type I)(DTP Dual Tape carrier Package (Type II)(DTP EIAJ Standard Registration 1989.02 1988.04 1991.10 1990.03 1995.05 1988.06 1994.02 1988.06 1988.06 1988.06 1989.01 1989.11 1989.11 1990.02 1990.07 1990.07 1991.10 1992.10 1993.02 1993.12 1994.10 1993.12 1993.12
EIAJ Standard (4/4) Design guideline integrated circuits
Number EDR-7311 EDR-7312 EDR-7313 EDR-7314 EDR-7315 Quad Flat Package(QFP) Thin Small Outline Package (Type I)(TSOP Thin Small Outline Package (Type II)(TSOP Shrink Small Outline Package (SSOP) Balll Grid Array (BGA) EIAJ Standard Registration 1996.04 1996.04 1996.04 1996.08 1997.05
JEDEC standards
JEDEC standards deliberated semiconductor package-related activity organization (JC-11), subordinate organization EIA, enacted sequence which standards registered, with type name given. Example Outlines/Registrations Diode Outlines Transistor Outlines Carrier Outlines Uncased Outlines Microelectronic Outlines Standards Transistor Standard Gauge Standard Carrier Standard Uncased Standard Microelectronic Standard
standards
standards internationally standards deliberated enacted based proposals extended from standardization activity organizations major countries producing semiconductor devices. Here examples standards: IEC-Publication-148 IEC-Publication-191 IEC-Publication-747 IEC-Publication-286.3 Character codes semiconductor elements integrated circuits Package standardization semiconductor elements integrated circuits Ratings characteristics semiconductors measuring methods Parts packing style automatic mounting
Names NEC's Packages
indicates names packages following format:
Nominal dimensions (option) (300 mil)
Number pins
Material
style (option)
style
Supplement (option)
(Ex.)
Plastic Plastic Plastic Ceramic Ceramic
(Straight) (Glass sealed)
Number pins principle, number pins based pitch indicated, i.e., number pins includes missing pins. preventing insertion wrong direction included number pins PGA. case outermost drawn out, above principle observed.
Material sealing materials package indicated. distinguish between glass sealed seal ring products between cerdip seam weld products, code indicated position Supplement. Example 28-pin ceramic (cerdip) (300 mil) 72-pin ceramic (Glass sealed)
Package style (option) following codes indicated package that features which cannot indicated package style (2): Example (Shrink). Reduced pitch Thin With window
Package style most appropriate following codes indicated: Example DIP, SOP,
Supplement (option) Information that supplements code package style package style indicated. Example (straight) (Glass sealed)
Package Codes EIAJ
EIAJ regulates names codes package Integrated Circuit Dimension Rule "Package Name
Code" ED7303, follows: Package code configuration Package Code configured 6-item below, maximum letters shall specified.
Material code package body letter shall specified. Multi-layer ceramic package Glass sealed ceramic package Package consisting metallic materials Package molded with plastic Package consisting tape Package consisting plastic/glass composite substrate
Package specific feature code Maximum features shall specified. (Maximum letters) Outline addition Heat sink Window Assembled piggyback
Seated height profile Thin Very thin
Terminal pitch position Shrink Fine pitch Example: Terminal pitch less QFP. Terminal pitch less LGA. Interstitial
Lead protection Bumper Guard ring Retain
Package name code letters shall specified. Example DIP, SIP, ZIP, PGA, SOP, SOJ, QFP, QFJ, QFN,
Package terminal number code Maximum letters shall specified.
Package nominal dimension code Maximum letters shall specified. Example 39.65 39.65
Terminal in-line interval code letters shall specified. Example 0.65, 0.50 0.40
Dimension Symbol Example Dimensions
Example dimensions packages
(Dual In-line Package)
Term Mounting height Stand-off height Main unit height Maximum terminal length Terminal width Terminal width (Max.) Terminal thickness Direct terminal pitch Package overhang Package length Direct terminal pitch Package width Tolerance terminal center Terminal angle
Symbol
Meaning Distance from mounting surface edge package Distance from mounting surface base surface (bottom edge package) Height package itself Length terminal from munting surface terminal Width terminal inserted into mounting hole board Maximum width terminal Thickness terminal Direct true geometrical position center terminal Distance from true position terminal outermost position edge package Longest dimension package true geometrical position center terminal Width package Difference center each from original position. Maximum measure condition (MMC) applied Angle between terminal line right angles mounting surface
(Zigzag In-line Package)
Base surface Terminal neck
Term Mounting height Stand-off height Main unit height Maximum terminal length Terminal width Terminal thickness Straight terminal pitch Package overhang Package length Distance between terminal rows Package width Tolerance terminal center
Symbol
Meaning Distance from mounting surface edge package Distance from mounting surface base surface (bottom edge package) Height package itself Length terminal from mounting surface terminal Width terminal inserted into mounting hole board Thickness terminal Direct true geometrical position center terminal Distance from true position terminal outermost position edge package Longest dimension package true geometrical position center terminal Width package Difference center each from original position. Maximum measure condition (MMC) applied
(Pin Grid Array)
Note
Heat sink
Orientation
ANote
Note Heat sink dimensions mentions "E1" "D1". (Case heat sink package) Seated height includes heat sink height. (Case heat sink package)
Term Mounting height Stand-off height Package body height Stopper diameter Terminal width Straight line spacing Package width Package length Terminal length Package overhang Heat sink width Heat sink length Tolerance terminal center
Symbol
Meaning Distance from mounting surface edge package Distance from mounting surface base surface (bottom edge package) Height package itself Diameter stopper Diameter terminal inserted into mounting hole board Direct true geometrical position center terminal Width package Maximum dimensions package Length from mounting surface terminal Distance from true position terminal outermost position edge package Width heat sink Length heat sink Difference center each from original position. Maximum measure condition (MMC) applied
(Small Outline Package)
Term Nominal size Seating plane Base plane Mounting height Stand-off height Package height Terminal width Terminal thickness Package length Package width Terminal spacing linear Package overhang Overall width Length flat part terminal Terminal length Tolerance terminal center Uniformity bottom face terminal Angle terminal flat part
Symbol
Meaning Size package. Center-to-center distance mount pads Plane determined when placed horizontal surface Plane that runs along bottom surface package parallel with mounting surface Distance from mounting surface package Distance from mounting surface base surface Height package from base plane package Width each terminal (including plating) Thikcness terminal (including plating) Length package (including resin burr) Width package (excluding resin burr) Direct true geometrical position center terminal. Also called lead pitch Distance from true position terminal outermost position edge package Width including terminal length Length part projected terminal mounting surface contacting mounting Length terminal projected mounting surface package from terminal Difference center each from original position. Maximum measure condition (MMC) applied Maximum value difference each terminal from plane right angles mounting surface angle between terminal flat part mounting surface
(Quad Flat Package)
Detail lead
Term Nominal size Seating plane Mounting height Stand-off height Package height Terminal width Terminal thickness Package length Package width Terminal spacing linear Package overhang Overall length Overall width Length flat part terminal Terminal length Tolerance terminal center Uniformity bottom face terminal Angle terminal flat part
Symbol
Meaning Size package Plane determined when placed horizontal surface Distance from mounting surface package Distance from mounting surface base surface (bottom surface package) Height package from base plane package Width each terminal (including plating) Thickness terminal (including plating) Length package (excluding resin burr) Width package (excluding resin burr) Direct true geometrical position center terminal. Also called lead pitch Distance from true position terminal outermost position edge package Dimensions including terminal length peripheral terminal existing longitudinal direction package Width including terminal length peripheral terminal existing latitudinal direction package Length part projected terminal mounting surface contacting mounting Length terminal projected mounting surface package from terminal Difference center each from original position Maximum measure condition (MMC) applied Maximum value difference terminal from mounting surface direction right angles mounting surface angle between terminal flat part mounting surface
(Quad Flag J-leaded package)
Term Nominal size Seating plane Seating height Stand-off height Package height Terminal height Maximum terminal width Terminal width Terminal thickness Package length Package width Terminal spacing linear Package overhang Terminal spacing linear Overall length Overall width Tolerance terminal center Uniformity bottom face terminal
Symbol
Meaning Size package Plant determined when placed horizontal surface Distance from mounting surface package Distance from mounting surface base surface (bottom surface package) Height package from base plant package Distance terminal projecting from package from surface mounting surface Maximum width each terminal Width each terminal (including plating) Thickness terminal (including plating) Length package (excluding resin burr) Width package (excluding resin burr) Direct true geometrical position center terminal. Also called lead pitch Distance from true position terminal outermost position edge package Direct center bending terminal Dimensions including terminal length peripheral terminal existing longitudinal direction package Width including terminal length peripheral terminal existing latitudinal direction package Difference center each from original position. Maximum measure condition (MMC) applied Maximum value difference terminal from mounting surface direction right angles mounting surface
INDEX MARK
Term Nominal dimension Package length Package width Package center offset Seating plane Datum plane Datum plane Mounting height 1st. Standoff height Package height 2nd. Standoff height Terminal spacing linear Terminal diameter Tolerance terminal center Uniformity bottom face terminal Package flatness
Symbol Meaning Combination integral value package width package length regarded nominal dimension Length package Width package Difference center package from original position Plane determined when placed horizontal surface Shall specified plane passing center form package plane form. Shall specified plane passing center form package plane form. Distance from mounting surface package 1st. stand-off height defined distance from seating plane lowest point package except cavity. Height package from base plane package 2nd. stand-off height defined distance from seating plane lowest point cavity. Direct true geometrical position center terminal. Also called lead pitch. Diameter terminal. Difference center each ball from original position. Maximum measure condition (MMC) applied. Maximum value difference terminal from mounting surface direction right angles mounting surface Package flatness defined difference between distance from seating plane highest points package distance lowest points. Distance from position terminal outermost position edge package direction Distance from position terminal outermost position edge package direction
Overhang body direction Overhang body direction
4.2.1
Dimensional symbols Reference dimensions "true geometric location" Examples: 1.27 2.54
Theoretical dimension enclosed square.
4.2.2
Dimensional indication geometric tolerance
Tolerance indication accoding Tolerance Type geometric tolerance (positional tolerance example)
Maximum material condition (MMC) Applied allowable positional tolerance terminals. (refer ISO/1101, Parts Positional tolerance terminals (See note) 0.25 Note Tolerance deviation from "true" position (the center each terminal) cumulative error. Example terminal width maximum, allowable deviation from center terminal ("true" position) 0.25 terminal width less than maximum, tolerance increased proportionally.
0.25
4.2.3
(Tolerance terminal center)
Through hole packages (Standard DIP)
0.25
terminal width maximum, allowable deviation from center terminal ("true" position) 0.25 terminal width less than maximum, tolerance increased proportionally. Terminal center figure below true position maximum terminal width tolerance standard are, respectively, 0.60 0.25 Therefore, allowable terminal existing range calculated follows: 0.25 bMAX. 0.60
0.85
0.50
±0.10
0.25
0.60
0.25
0.25
0.60
0.85 Printed-circuit board
2.54 Hole diameter
Surface mount packages (SOP)
0.12
terminal width maximum, allowable deviation from center terminal ("true" position) 0.12 terminal width less than maximum, tolerance increased proportionally. figure below shows that center shifted from true center maximum width, bMAX, 0.50 positional tolerance, 0.12 allowable existing range 0.62 obtained following expression: 0.12 bMAX. 0.50
0.62 recommended mounting width 0.76 allow position shift ±0.07 unless self-aligning effect cannot expected.
0.50
0.12
0.12
0.50
0.07
0.62
0.07
0.76
Mounting
Printed-circuit board 1.27
PACKING PACKAGES
Packing Styles Notes Packing styles
5.1.1
following figures show general packing styles NEC's products. Example Packing Packages
MAGAZINE TRAY TAPE
CONTAINER
Scotch tape (NEC original)
Scotch tape (NEC original)
INNER
Label
Scotch tape (NEC original) Label
Label
5.1.2 Notes handling Inner boxes should handled with care. strong vibration shock during transportation cause pins distorted and/or main unit damaged. Storage environment high temperature high humidity should avoided. transparent plastic magazine case coated with antistatic agent. Things remember: magazine washed with water, antistatic coating could come off. Rubbing surface repeatedly reduces antistatic effect. Minimize frequency inserting removing into from magazine. Under normal storage conditions, surface resistivity shows change with aging shown satisfying specification 1012 MAX. Change with Aging Surface Resistivity Magazine Case
Value surface resistivity
1012 Max. specification
Storage time (year)
Storage extremely unsatisfactory storage environment could affect soldering characteristics, damage appearance and/or lower other characteristics. following recommended environmental conditions storage: Temperature Humidity Ambience Others less There should toxic gases such sulfurous acid gas. Dust should minimal. There should vibration shock which could distort packing container. avoid excess weight stack many packing containers each other.
Delamination tension emboss taping delamination tension emboss taping irrespective storage environment. emboss taping mounting machine, necessary consider delamination tension. Emboss Tape Delamination Tension Test
<Test method> Tension gage Angle tension 180° Cover tape
Tensional strength (gf)
Carrier tape Tensional speed mm/MIN.
Storage time (day)
Heat proof packing material Tray There types trays: non-heat proof tray heat proof tray. baking, necessary heat proof tray. heat proof tray used products contained aluminum-laminated pack. This type tray labelled "HEAT PROOF". allowable temperature MAX. Magazine, Emboss tape Reel plastic magazine, emboss tape reel heat proof. bake products, necessary transfer them heat proof container. Note When baking, necessary careful cause lead pins become distorted.
Dimensions tapings
reel standards tape standards products packed tape described, which conform "JIS 0806-3 Taping electronic parts (Surface-Mount Parts)" "Taping leadless parts automatic mounting (RS481)" EIA. uses following ordering codes emboss taped ICs: 5.2.1 Taping SOP/TSOP
Indication direction adhesive-type taping (SOP only) When side which drawout side
indication
Tape drawout direction
When side which takeup side
indication
Product example: µPD4011BG-T1 (This taping product µPD4011BG with facing tape drawout direction) Indication direction embossed-type taping When side which drawout side
indication
Tape drawout direction
When side which takeup side
indication
5.2.2
Taping
Indication direction embossed-type taping When side which drawout side
indication
Tape drawout direction
When side which takeup side
indication
Product example: µPD421000LA-10-E1 model µPD421000LA with access time drawout side)
5.2.3 Taping Indication direction embossed-type taping When side which drawout side
indication
Tape drawout direction
When side which takeup side
indication
When side which right when viewed from drawout side
Tape drawout direction
indication
When side which left when viewed from drawout side
Tape drawout direction
indication
Product example: µPD41265L-12-E1 model µPD41256L with access time with drawout side)
5.2.4 Taping Indication direction embossed-type taping
indication
When side which drawout side opposite side sprocket hole
Tape drawout direction
When side which takeup side sprocket hole side
indication
Tape drawout direction
Product example: µPD23C32000AGX-$$$-E2 model µPD23C32000A with takeup side sprocket hole side)
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