Contents What (Ball Grid Array)? Varieties NEC's Advantages Photograph
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Contents What (Ball Grid Array)? Varieties NEC's Advantages Photographs Line-up_ Characteristics Standardization package outline Application Mounting Technology Recommended Soldering Conditions Reliability_ Process Flow Marking Packing (Frequently Asked Questions) Attachment Drawings Attachment Daisy chain Layouts Attachment Sockets
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What (Ball Grid Array)?
"BGA" type surface mount device, with solder balls formed array underside package body. further classified interposer material: PBGA (Plastic BGA) uses printed wire board (PWB), TBGA (Tape BGA) uses polyimide tape.
Varieties NEC's
offers following four types BGA. PBGA (Plastic BGA, using single layer PWB) ABGA (Advanced BGA, using multiple-layer PWB) Metal TBGA (using single layer polyimide tape) Metal TBGA (using layer polyimide tape)
Standard type
PBGA 300pin
Wire Resin
High speed type
ABGA 700pin
Heat spreader
paste
PBGA
hole pattern
chip
chip Resin
cost package Metal TBGA 700pin
Heat spreader
Solder ball
Solder ball
high speed device Very thermal resistance Metal TBGA 1000pin
Heat spreader Stiffener chip Resin
TBGA
Stiffener
Tape
chip Resin Signal pattern Ground pattern Solder ball Solder ball
Thin package high speed device
very high speed devices high count
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Advantages
PBGA TBGA smaller, lighter packages than currently prevalent packages. They have excellent electrical performance suitable high frequency counts. Also, broader terminal pitch than same count easier mounting onto PCB. size, weight terminal pitch compared those QFP?
27mm
225pin PBGA 208pin
Size reduced Weight reduced
Terminal Pitch
0.5mm
Terminal pitch wider 300%
1.5mm
0.75 0.75
much does broad terminal pitch improve assembly yield? yield loss 1/14 yield loss comparable count QFP. Count PBGA Terminal Pitch 1.27 Size Failure 0.07
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thermal resistance performance characteristics improved with packaging? following figures show characteristics various package types: Thermal Resistance
Rja(°C/W 0m/sec)
Thermal Resistance
FCBGA: Flip Chip CSP: Chip Size (Scale) Package
PBGA
Metal TBGA
Metal TBGA
ABGA FCBGA
1000 2000
Count
Frequency Characteristics
(MHz)
FCBGA
Frequency
ABGA Metal TBGA PBGA
Metal TBGA
1000
2000
Count
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Photographs
PBGA
119pin
225pin
256pin
313pin
352pin
ABGA
Metal TBGA
272pin
352pin
584pin
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Metal TBGA
256pin
432pin
352pin
420pin
500pin
576pin
696pin
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Line-up
design development status packages follows: PBGA Package Size Count Ball Pitch [mm] 1.27 Status* Chip Size [mm]
Ball Arrangement (Bottom View)
10.5
1.27
10.5
2.54
10.5
1.27
10.4 15.0
15.0
Production Under development
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ABGA
Package Size Count Ball Pitch [mm] Status* Chip Size [mm]
Ball Arrangement (Bottom View)
10.0
1.27
15.0
15.0
15.0
15.0
15.0
15.0
Production Under development
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Metal TBGA Package Size Count Ball Pitch [mm] 1.27 Status* Chip Size [mm]
Connection
Ball Arrangement (Bottom View)
1.27
:112
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Metal TBGA Package Size Count Ball Pitch [mm] 1.27 Status Chip Size [mm]
Ball Arrangement (Bottom View)
:104 :108
Production Under development
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Characteristics
Count 15.1 11.7 11.7 13.6 14.3 13.3 15.2 14.6 12.9 (nH) (pF) 25.5 20.5 Rj-a (°C/W) 0m/s 1m/s 2m/s Rj-a (°C/W)
PBGA ABGA Metal TBGA
10.5 10.5 10.5
Metal TBGA
Note: Exact Values Depend Size
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Standardization Package Outline
EIAJ JEDEC have established harmonized package outline standards ensure compatibility other BGAs. follows EIAJ standards extended line-up BGAs.
Standard (EDR7315)
Ball pitch (mm) Ball diameter (mm) Coplanarity Max) Overall height Max) Package outline 0.75 1.27 0.15
Recommended Package outline EIAJ established recommended package outline standards compatibility with other package type only.
Type PBGA Standard Name Cavity type Cavity down type
Rectangular type (for memory device)
Standard Number ED-7311-9 ED-7311-10 ED-7311-11 ED-7311-4 ED-7311-3 50mm 50mm 14~22mm 40mm 40mm
Summary 1.50mm pitch 1.27mm pitch 119pin/153pin 6rows 6rows
TBGA
1.27mm pitch 1.0mm pitch 0.8mm pitch
Application
BGAs give opportunity significant system size reduction. They extremely well suited applications such personal computers, telecommunication instruments, etc. example such package following;
64bit (Vr4300) CPU-Board Device: 313pin PBGA Application: Telecommunication Instruments
Life Size
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Mounting Technology
Soldering Mechanism (PBGA TBGA)
When soldering onto PCB, solder balls will melt height decreases 70um after reflow soldering. ensure reliability application, solder paste, mount size reflow conditions should optimized.
Assembly flow Solder Paste Print
Solder Paste: 150um Package Solder Ball 0.6±0.1mm
Mounting
Reflow
225pin PBGA: 696pin TBGA:
Relationship between PCB's Layers Package Temperature
During soldering process, temperature solder balls lower than package surface temperature, solder joints primary touched forcing heat. Therefore, contradiction conventional SMD, temperature lead higher than package surface temperature. necessary consider maximum temperature BGA's solder balls with respect that package surface.
Layers Package Temperature
Temperature(°C)
PKG: Metal TBGA BGA: Package Surface QFP: Reflow: PCB: FR-4,1.6mm Solder Ball Surface Temperature 240°C Lead QFP: Package Surface
Package Temperature Terminal Temperature
Layer
Layers
Layers
Layers
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Solder conditions mixed soldering
peak temperature depends package size, type reflow system. simultaneous reflow QFP, necessary select hot-air reflow system combined system, using hot-air infrared rays.
IR+AIR
Lead Ball PBGA
PCB:FR-4, 1.6mm, Layers
Solder Ball
Surface Temperature
Upper Limit Temp.(235°C)
Temperature(°C)
Combined
Lower Limit Temp. (200°C) PBGA
PBGA ABGA Metal TBGA ABGA
Package Size(mm)
9.3.1 Temperature Profile Examples (PBGA ABGA)
hot-air reflow system combined reflow system recommended assembly ABGA.
Surface Temperature: 234°C Package Surface Temperature: 225°C Ball Temperature: 205°C
Surface Temperature: 234°C Package Surface Temperature: 174°C Ball Temperature: 167°C
Temperature(°C) Temperature(°C)
PBGA
PCB:FR-4, 1.6mm, Layers
ABGA
Solder Ball
Solder Ball
Time
Time
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Solder Print Condition Soldering Mixed Packages
concurrent soldering QFP, screen thickness should selected with consideration both pitch opening diameter. recommends screen thickness 120um 150um.
Solder Print Condition Mixed Soldering test Results
Package
(Defect/Total)
0.8mm Pitch TBGA 432PIN
1.27mm Pitch PBGA 225PIN
1.0mm Pitch TBGA 696PIN
0.5mm Pitch 208PIN
Open 2/100 0/100 0/100 0/100 Bridge 0/100 0/100 0/100 0/100
0.4mm Pitch 256PIN
Open 4/100 0/100 0/100 Bridge 0/100 0/100 0/100
Opening Width Screen Thickness 100um 120um 150um 200um
0.35
Open 0/100 0/100 0/100 Bridge 0/100 0/100 0/100
0.60
Open 0/200 0/200 0/200 0/200 Bridge 0/200 0/200 0/200 0/200
0.50
Open 0/180 0/180 0/180 0/180 Bridge 0/180 0/180 0/180 0/180
Solder Solder Print Print
Solder Solder Print Print
PCB:FR-4, 1.6mm, Layers, 36um thickness)
Inspection
packages allow visual inspection these state-of-the-art conventional SMD. Anyhow, quality solder joints checked either X-ray electrical testing. Most popular X-ray methods, these provide least same comfort like visual check, also automized. Electrical testing might most efficient, Boundary Scan passed implemented design.
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Rework
repair defect application boards, rework systems should used. These systems should provide easy desoldering capability enough protection other components near device removed. Most appropriate hot-air reflow stations where process supported some additional heater from below application board. Rework Machine Products Corp.: HG7900 Method: Hot-air Available Rework Equipments: Motorola Corp. Chipmaster Nu-Concept System Corp. Hart300
Hot-air
Nozzle
Heater
Design consideration
optimal results when using BGAs your application, makes following recommendations: copper thickness wiring should least 30um. solder resist printing should cover edges land pads
Inadequate Resist Coverage Recommended Resist Coverage
16µm
Solder Resist
Avoid gold plating land pad! gold contamination results decreased reliability solder joint recommended. performance FR-4 polyimide, measure temperature cycling test, same. quality level regarding will same.
32µm
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Recommended Soldering Conditions
Test Humidity Bias Test (THB) samples pass electrical test after1000 hours stress (85°C, 85%RH, with bias applied). Cooker Test (PCT) samples pass electrical test after hours stress (125°C-100%RH). Cycling Test (T/C) samples pass electrical test after cycles (-65°C~+150°C). package crack delamination
(1)Method determining recommended soldering conditions
Pre-treatment (Baking) absorption 30°C-70%RH
Reflow Reflow
Pre-Treatment
initialization, which dis-absorption, performed specified time 125°C. moisture absorption time depends product.
Reflow
samples subjected infrared reflow three times with temperature profile shown Figure
Test
reliability tests after pre-treatment reflow consist THB, T/C. Susceptibility package crack delamination evaluated. recommended soldering condition determined based these test results.
Notes:
conducted only reference test some products. condition test some products +125°C
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Recommended Soldering Conditions
quality each heavily influenced following factors. -Moisture absorption package (storage conditions) -Soldering conditions (method conditions) -Package structure (thickness, chip size, etc.) specifies recommended soldering conditions each product, rather than categories products (such memories microcomputer) packages (such BGA).
Example recommended soldering conditions
example recommended soldering condition Metal TBGA product shown figure conditions different from those shown figure particular product. Please consult details. recommended peak temperature infrared reflow soldering either 220°C, 230°C 235°C depending products. Please consult details. number times product mounted either twice three times depending products. Please consult details. Maximum storage time from opening dry-pack until mounting depends upon product, generally less than seven days.
Figure Recommended soldering conditions Infrared Reflow
following recommended soldering conditions. (Moisture sensitive device)
Unpacking (Dry Pack) temperature 235°C below (plastic surface temperature) time seconds less 210°C) number reflow processes Three times limit (Store unitl final reflow process starts) days less Rosin flux containing small amount chlorine (Flux with maximum chlorine content 0.2wt.% recommended.)
Stored days less*
Baking (for hours 125°C)
Infrared/Hot reflow
Does apply magazine tape packed devices.
*Storage conditions:25°C 65%RH less.
Packages Surface Temperature(°C)
(ACTUAL HEAT) ~10s 235°C 210°C 120~160°C 60~90s (PRE-HEAT) ~30s
TIME(s) REFLOW TEMPERATURE PROFILE
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Reliability
BGAs have excellent package solder joint reliability. This shown below mentioned test results. 11.1 Package Reliability
Conditions pre-treatment: IR30-103-2: Temperature Cycling -65°C/+150°C, cycles High Temperature Storage 125°C hours High Humidity Storage 30°C, 70%RH hours Application IR-Reflow process 230°C peak temperature, twice IR35107-3: Temperature Cycling -65°C/+150°C, cycles High Temperature Storage 125°C hours High Humidity Storage 30°C, 70%RH hours Application IR-Reflow process 235°C peak temperature, three times
Items Condition count Pretreatment PBGA Metal TBGA IR30-103-2 IR30-103-2 IR30-103-2 IR30-103-2 IR35-107-3 IR35-107-3 Temp. Cycling -65°C/150°C 1000cyc 0/30 1000cyc 0/25 500cyc 0/20 500cyc 0/138 300cyc 0/82 300cyc 0/48 85°C85%RH With Bias 1000Hr 0/35 1000Hr 0/13 1000Hr 0/106 1000Hr 0/75 1000Hr 0/45 125°C With Bias 1000Hr 0/10 125°C100%RH 2.3atmospheres 200Hr 0/30 200Hr 0/28 200Hr 0/30 200Hr 0/28 200Hr 0/24
Type
11.2 Solder Joint Reliability Temperature Cycling Test)
Type Ball Pitch count Metal TBGA 1.27 1.27 Condition -40°C/125°C -65°C/125°C -40°C/125°C -65°C/125°C -40°C/125°C samples Temp. Cycling (cyc) 1000
PBGA
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11.3 Destructive Test Result
Cumulative Failure Rate(%) -65°C 125°C
-40°C
125°C
1000
2000
3000
5000 cycles
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Process Flow
PBGA Wafer Dicing
ABGA Wafer Dicing Attach
Metal/2 Metal TBGA Wafer Dicing
(Inner Lead Bonding)
Attach Wire Bonding
Wire Bonding
Tape Singulation Stiffener Attach
Encapsulation Solder Ball Attach/Reflow Singulation
Encapsulation Apply Solder Ball Attched Singulation
Encapsulation Solder Ball Attach/Reflow Singulation Heat Spreader Attch
Marking
Marking
Marking
Electrical Test Visual Inspeciton Packing Warehouse Shipping
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Marking
PBGA logo Country Origin Product Name
ABGA
No.1 Metal TBGA
No.1 Metal TBGA
No.1
No.1
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Packing
14.1 Packing Style
generally uses JEDEC type tray aluminum laminated pack shipment BGAs.
Tray Orientation
Procedure
stacks must have empty lid. Place desiccant bags humidity indicator stacked tray, secure bands around stack. Insert tray stack into moisture barrier bag. Seal bag. Attach Labels bag. Place into Box.
indicator
Bands
empty tray lid.
Desiccant Humidity Indicator
Stacked trays
14.2 Notes Exercise care handling packing
excessive shock vibration applied device during transportation, balls deformed, itself damaged. special attention after BGAs removed from box.
Storage
storage environment exceptionally poor, solderability degraded, device appear deformed, characteristics degraded. Recommended storage conditions follows: -Temperature: 5~30 (25°C below after opening pack) -Moisture: 20~70%RH (65%RH less after opening pack) -Atmosphere: Must free from contaminants such sulfur dioxide dust -Others: Must from vibration shock that deform packing container. pile many containers. Visual inspection recommended verification solderability absence ball corrosion packages stored over years.
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Tray Handling
-Secure packages trays before moving them. -When replacing products tray, exercise care that balls BGAs damaged (use vacuum forceps absorber recommended). -Make sure that products stored correct positions tray. -When stacking trays, apply shock trays.
Packing Materials
-Exercise care handling pack, that excessive shock applied pack, that pack damaged object with sharp edge. desiccating pack humidity indicator enclosed pack. When humidity indicator absorbs moisture, blue part indicator turns pink. Therefore, indicator pink transparent after pack opened, chances that either pack been damaged packages contained have absorbed moisture. this case, please bake BGAs 125±5°C 72hours.
Baking
After pack opened assemble package within specified storage period labeled pack. storage period expired, products must baked 125±5°C hours.
<Heat resistance tray>
JEDEC tray heat resistive. maximum temperature level heat resistive 135°C.
Packing density
Type PBGA count Size (mm2) units/tray units/box
Metal TBGA Metal TBGA
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(Frequently Asked Questions)
Questions
Package solder balls dislodged during transportation handling?
possible reball BGAs? Does offer reball service? What recommended method measuring package surface temperature?
Answers
solder balls firmly connected accordance with JIS-Z0202. not. Reworking will guarantee same level solderability joint reliability. does offer reball service. While reflowing, thermocouple(s) should used measure resin temperature. thermocouple should fixed onto with heat-conducting adhesive.
Package Solder ball Adhesive
Thermocouple
What solder ball composition? possible mount additional heat sink package heart spreader? should additional heat sink attached package? does Metal TBGA have holes package surface? possible close holes metal TBGA package surface? What voltage condition heat speader? (Commercial sample) (Mass production) different Metal TBGA?
63%, possible mount heat sink package's heart spreader after soldering. Mechanically applying adhesive. Please consult with heat sink supplier choose appropriate attaching method. holes allow release pressure from inside device during reflow soldering. After soldering, possible close holes package will further heated. heat spreader tied ground.
marking (Engineering Sample), marking, uses laser marking.
Material
What recommended composition
solder paste?
recommended solder paste composition 63/Pb recommends recommends using flux mount surface. does recommend using gold plate surface, because solder joint reliability reduced. case 2.54mm, 1.5mm 1.27mm pitch: 0.6±0.1mm case 1.0mm pitch: 0.5±0.1mm
What recommended screen thickness? What recommended condition
mount surface?
What recommended mount size?
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Questions
BGAs mounted
package edge scanning ball scanning)?
Answers
possible BGAs mounted package edge scanning, recommends ball scanning method. specifies reflow condition each individual product. Please inquire with sales your specific device. could used hold rigid prevent warpage. does recommend wave soldering possibility flow through through-holes which create shorts between balls.
What recommended
soldering conditions BGA?
What good prevent
warping during reflow?
Does Recommend wave soldering
other through-hole devices,after soldering packages?
Packing
What style packing used BGA?
Rework
Normally trays. Please contact specific request.
What recommended rework
equipment manufacturers?
HG7900 Products. damage, such line delamination breakage. warpage. Yes, solder paste should screen printed. Space required package outline plus 1.5mm. there guarantee concerning re-mounting solder balls. recommends that package replace removed.
What factors consider
reworking? necessary print solder paste before mounting?
reasonable space between parts? removed BGAs reused? Does
guarantee removed devices?
Socket
What sockets manufacutures?
Other
Please inquire with these socket manufactures specific information:Sumitomo3M, Yamaich Denki, Enplas.
possible produce simulation
data?
simulate using SPICE model parameters. Please inquire with sales details information.
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Attachment Drawings
119pin PBGA unit:mm, Weight:1.1g
ITEM
MILLIMETERS 22.0±0.2 19.5 12.0 14.0±0.2 0.84 1.27 (T.P.) 0.6±0.1 0.56 1.46±0.1 2.30 MAX. 0.15
INCHES 0.866±0.008 0.768 0.472 0.551±0.008 0.033 0.05 (T.P.) 0.024 +0.004 -0.005 0.022 0.057 +0.005 -0.004 0.091 0.006
0.78±0.1
C0.7 1.25
0.031 +0.004 -0.005
C0.028 0.049 0.039 P119S1-R4
225pin PBGA unit: Weight: 2.2g
ITEM
MILLIMETERS 27.00±0.20 24.0 24.0 27.00±0.20 (T.P.) 0.6±0.1 0.36 1.53±0.15 2.13±0.25 0.15
INCHES 1.063±0.008 0.945 0.945 1.063±0.008 0.118 0.059 (T.P.) 0.024 +0.004 -0.005 0.014 0.060 +0.007 -0.006 0.084±0.01 0.006
Index mark
0.75±0.15
0.30 0.10 C3.95
0.030 +0.006 -0.007
0.012 0.004 C0.156 0.059 Y225S1-B1
detail part
NOTES
Each lead centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition. Each lead centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
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256pin PBGA unit: Weight: 2.4g
ITEM
MILLIMETERS 27.00±0.20 24.0 24.0 27.00±0.20 1.44 1.27 (T.P.) 0.6±0.1 0.36 1.53±0.15 2.13±0.25 0.15
INCHES 1.063±0.008 0.945 0.945 1.063±0.008 0.057 0.050 (T.P.) 0.024 +0.004 -0.005 0.014 0.060 +0.007 -0.006 0.084±0.01 0.006
Index mark
0.75±0.15
0.30 0.10 C3.95
0.030 +0.006 -0.007
0.012 0.004 C0.156 0.059 Y256S1-B6
detail part
NOTES
Each lead centerline located within 0.30 0.012 inch)
true position (T.P.) maximum material condition.
Each lead centerline located within 0.10 0.004 inch)
true position (T.P.) maximum material condition.
272pin ABGA unit: Weight: 4.1g
ITEM
MILLIMETERS 29.00±0.20 29.00±0.20 1.80 1.27 (T.P.) 0.60±0.10 0.90 1.50±0.20 0.15
INCHES 1.142 +0.008 -0.009 1.142 +0.008 -0.009 0.071 0.050 (T.P.) 0.024 +0.004 -0.005 0.035 0.059±0.008 0.006
Index mark
detail part
0.75±0.15
0.30 0.25 MIN. 0.10 C1.5 C0.5
0.030 +0.006 -0.007
0.012 0.009 MIN. 0.004 0.059 0.020 S272S2-C6-2
NOTES
Controlling dimension millimeter. Each ball centerline located within 0.30 true position (T.P.) maximum material condition. Each ball centerline located within 0.10 true position (T.P.) maximum material condition.
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313pin PBGA unit: Weight: 4.0g
ITEM
MILLIMETERS 35.00±0.20 30.0 30.0 35.00±0.20 2.26 2.54 (T.P.) 0.6±0.1 0.56 1.73±0.15 2.33±0.25 0.15
INCHES 1.378±0.008 1.181 1.181 1.378±0.008 0.089 0.100 (T.P.) 0.024 +0.004 -0.005 0.022 0.068±0.006 0.092 +0.010 -0.011 0.006
Index mark
detail part
0.75±0.15
0.30 0.10 C4.0 1.27 (T.P.)
0.030 +0.006 -0.007
0.012 0.004 C0.157 0.098 0.05 (T.P.) Y313S1-F5
NOTES
Each lead centerline located within 0.30 0.012 inch)
true position (T.P.) maximum material condition. Each lead centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
352pin PBGA unit: Weight: 4.4g
ITEM
MILLIMETERS 35.00±0.20 30.0 30.0 35.00±0.20 1.62 1.27 (T.P.) 0.6±0.1 0.56 1.73±0.15 2.33±0.25 0.15
INCHES 1.378±0.008 1.181 1.181 1.378±0.008 0.064 0.050 0.024 +0.004 -0.005 0.022 0.068±0.006 0.092 +0.010 -0.011 0.006
Index mark
0.75±0.15
0.30 0.10 C4.0
0.030+0.006 -0.007
0.012 0.004 C0.157 0.098 Y352S1-F6-1
NOTES
Controlling dimension millimeter. Each ball centerline located within 0.30 true position (T.P.) maximum material condition. Each ball centerline located within 0.10 true position (T.P.) maximum material condition.
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256pin Metal TBGA unit: Weight: 2.3g
ITEM
MILLIMETERS 27.00±0.20 15.50 MAX. 15.50 MAX. 26.60±0.15 26.60±0.15 27.00±0.20 1.435 1.27 (T.P.) 0.60±0.10 0.80+0.20 -0.10 1.40+0.30 -0.20 0.15
0.75±0.15
INCHES 1.063±0.008 0.611 MAX. 0.611 MAX. 1.047 +0.007 -0.006 1.047 +0.007 -0.006 1.063±0.008 0.056 0.050 (T.P.) 0.024+0.004 -0.005 0.031+0.009 -0.004 0.055+0.012 -0.008 0.006
0.030+0.006 -0.007
Index mark
detail part detail part
0.30 0.25MIN. 0.10 15.11 15.11 0.20
0.012 0.009 MIN. 0.004 0.118 0.079 0.079 0.118 0.595 0.595 0.016 0.008 S256N7-B6
NOTES
Each ball centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition. Each ball centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
352pin Metal TBGA unit: Weight: 3.7g
ITEM
MILLIMETERS 35.00±0.20 23.00 MAX. 23.00 MAX. 34.60±0.15 34.60±0.15 35.00±0.20 1.625 1.27 (T.P.) 0.60±0.10 0.80 +0.20 -0.10 1.40 +0.30 -0.20 0.15
INCHES 1.378±0.008 0.906 MAX. 0.906 MAX. 1.362 +0.007 -0.006 1.362 +0.007 -0.006 1.378±0.008 0.064 0.050 (T.P.) 0.024 +0.004 -0.005 0.031+0.009 -0.004 0.055 +0.012 -0.008 0.006 0.030 +0.006 -0.007 0.012 0.009 MIN. 0.004 0.118 0.079 0.079 0.118 0.795 0.795 C0.016 0.008 S352N7-F6-1
Index mark
detail part
detail part
0.75±0.15
0.30 0.25 MIN. 0.10 20.19 20.19 C0.4 0.20
NOTE
Each ball centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition. Each ball centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
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420pin Metal TBGA unit: Weight: 6.0g
ITEM
MILLIMETERS 35.00±0.20 20.50 MAX. 20.50 MAX. 34.60±0.15 34.60±0.15 35.00±0.20 1.625 1.27 (T.P.) 0.60±0.10 0.80+0.20 -0.10 1.40+0.30 -0.20 0.15
INCHES 1.378±0.008 0.807 MAX. 0.807 MAX. 1.362+0.007 -0.006 1.362+0.007 -0.006 1.378±0.008 0.064 0.050 (T.P.) 0.024+0.004 -0.005 0.031+0.009 -0.004 0.055+0.012 -0.008 0.006
Index mark
0.75±0.15
0.30 0.25 MIN. 0.10 20.19 20.19 0.40 0.20
detail part
detail part
0.030+0.006 -0.007
0.012 0.009 MIN. 0.004 0.118 0.079 0.079 0.118 0.795 0.795 0.016 0.008 S420N7-F6
NOTES
Each ball centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition. Each ball centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
500pin Metal TBGA unit: Weight: 8.2g
ITEM
MILLIMETERS 40.00±0.20 23.00 MAX. 23.00 MAX. 39.60±0.15 39.60±0.15 40.00±0.20 1.585 1.27 (T.P.) 0.60±0.10 0.80+0.20 -0.10 1.40+0.30 -0.20 0.15
0.75±0.15
INCHES 1.575±0.008 0.906 MAX. 0.906 MAX. 1.559±0.006 1.559±0.006 1.575±0.008 0.062 0.050 (T.P.) 0.024 +0.004 -0.005 0.031 +0.009 -0.004 0.055 +0.012 -0.008 0.006
0.030+0.006 -0.007
Index mark detail part detail part
0.30 0.25 MIN. 0.10 22.73 22.73 0.40 0.20
0.012 0.009 MIN. 0.004 0.118 0.079 0.079 0.118 0.895 0.895 0.016 0.008 S500N7-H6
NOTES
Each ball centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition. Each ball centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
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576pin Metal TBGA unit: Weight: 8.2g
ITEM
MILLIMETERS 40.00±0.20 23.00 MAX. 23.00 MAX. 39.60±0.15 39.60±0.15 40.00±0.20 1.585 1.27 (T.P.) 0.60±0.10 0.80+0.20 -0.10 1.40+0.30 -0.20 0.15
0.75±0.15
INCHES 1.575±0.008 0.906 MAX. 0.906 MAX. 1.559±0.006 1.559±0.006 1.575±0.008 0.062 0.050 (T.P.) 0.024 +0.004 -0.005 0.031 +0.009 -0.004 0.055 +0.012 -0.008 0.006
0.030+0.006 -0.007
Index mark
detail part
detail part
0.30 0.25 MIN. 0.10 22.73 22.73 0.40 0.20
0.012 0.009 MIN. 0.004 0.118 0.079 0.079 0.118 0.895 0.895 0.016 0.008 S576N7-H6
NOTES
Each ball centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition. Each ball centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
696pin Metal TBGA unit: Weight: 7.4g
ITEM
MILLIMETERS 40.00±0.20 23.00 MAX. 23.00 MAX. 39.60±0.15 39.60±0.15 40.00±0.20 1.50 1.00 (T.P.) 0.50±0.10 0.90 +0.20 -0.10 1.40 +0.30 -0.20 0.15
INCHES 1.575±0.008 0.906 MAX. 0.906 MAX. 1.559±0.006 1.559±0.006 1.575±0.008 0.059 0.039 (T.P.) 0.020 +0.004 -0.005 0.035 +0.009 -0.004 0.055 +0.012 -0.008 0.006
Index mark
0.60±0.10
0.30 0.25 MIN. 0.10 33.00±0.20 33.00±0.20 22.73 22.73 0.20
0.024 +0.004 -0.005
0.012 0.009 MIN. 0.004 0.118 0.079 0.079 0.118 1.300 +0.007 -0.009 1.300 +0.007 -0.009 0.895 0.895 0.008 S696N7-H9
detail part
detail part
NOTE
Each ball centerline located within 0.30 0.012 inch) true position (T.P.) maximum material condition.
Each ball centerline located within 0.10 0.004 inch) true position (T.P.) maximum material condition.
family
Attachment Daisy Chain Layout
(Package, PCB: View)
119pin PBGA
225pin PBGA
family
(Package, PCB: View) 256pin PBGA, Metal TBGA
313pin PBGA
family
(Package, PCB: View) 352pin PBGA, Metal TBGA
272pin ABGA
family
(Package, PCB: View) 420pin Metal TBGA
500pin Metal TBGA
family
(Package, PCB: View) 576pin Metal TBGA
696pin Metal TBGA
family
Attachment Socket
PBGA Count ABGA Count Metal TBGA Count Metal TBGA Count Product Name Vendor Product Name 2256-1382-NH-1902 2352-1382-NH-1902 2420-1382-NH-1902 IC274-432124 2500-1383-NH-1902 2576-1383-NH-1902 IC280-69605 Vendor SUMITOMO SUMITOMO SUMITOMO YAMAICHI SUMITOMO SUMITOMO YAMAICHI Product Name Vendor Product Name BGA-225-1.5-01A 2-0225-08172-200-019-02 BGA-256-(441)-1.27-01 2-0256-08313-250-019-002 BGA-313-(841)-1.27-02 2-0313-08202-255-019-002 BGA-352-(841)-1.27-01 2-0352-0834-200-019-200 Vendor Enplas SUMITOMO Enplas SUMITOMO Enplas SUMITOMO Enplas SUMITOMO
part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others.
96.10
further information, please contact:
Corporation Building 7-1, Shiba 5-chome, Minato-ku Tokyo 108-8001, Japan Tel: 03-3454-1111 Fax: 03-3798-6059 [North South America] Electronics Inc. 2880 Scott Blvd. Santa Clara, 95050-2554, U.S.A. Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 [Regional Sales Offices] Central Region Greenpoint Tower 2800 West Higgins Road Suite Hoffman Estates, 60195, U.S.A. Tel: 847-839-6300 Fax: 847-519-9329 Norcal Region 3033 Scott Blvd. Santa Clara, 95054, U.S.A. Tel: 408-588-5100 Fax: 408-588-5134 Eastern Region Lake Destiny Drive Suite Maitland, 32751, U.S.A. Tel: 407-875-1145 Fax: 407-875-0962 Western Region Embassy Centre 9020 S.W. Washington Square Road Suite Tigard, 97223, U.S.A. Tel: 503-672-4500 Fax: 503-643-5911 Brasil S.A. Eletron Devices Division Rodovia Presidente Dutra, Guarulhos-SP-Brasil 07210-902 Tel: 011-6465-6810 Fax: 011-6465-6829 Document C13550EJ1V0PF00(1st edition) Date Published July 1998 CP(K) [Europe] Electronics (Germany) GmbH Kanzlerstr. 40472 Germany Tel: 0211-650302 Fax: 0211-6503490 Munich Office Arabellastr. 81925 Germany Tel: 089-921003-0 Fax: 089-92100315 Stuttgart Office Industriestr. 70507 Stuttgart, Germany Tel: 0711-99010-0 Fax: 0711-99010-19 Hannover Office 30175 Hannover, Germany Tel: 0511-33402-0 Fax: 0511-33402-34 Benelux Office Boschdijk 187a 5612 Eindhoven, Netherlands Tel: 040-2445845 Fax: 040-2444580 Scandinavia Office P.O. 18322 Taeby, Sweden Tel: 08-6380820 Fax: 08-6380388 Electronics (UK) Limited Cygnus House, Sunrise Park Way, Milton Keynes, MK14 6NP, U.K. Tel: 01908-691-133 Fax: 01908-670-290
Electronics (France) S.A. Paul Dautier-BP 78142 Velizy-Villacoublay France Tel: 01-30-67-58-00 Fax: 01-30675899 Madrid Office Juan Esplandiu, 28007 Madrid, Spain Tel: 01-504-2787 Fax: 01-504-2860 Electronics Italiana s.r.l. Fabio Filzi, 25/A, 20124 Milano, Italy Tel: 02-667541 Fax: 02-66754299
[Asia Oceania] Electronics Hong Kong Limited 12/F., Cityplaza Taikoo Road, Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 Seoul Branch 10F, ILSONG Bldg., 157-37, Samsung-Dong, Kangnam-Ku Seoul, Republic Korea Tel: 02-528-0303 Fax: 02-528-4411 Electronics Taiwan Ltd. Shing North Road Taipei, Taiwan, Tel: 02-719-2377 Fax: 02-719-5951 Electronics Singapore Pte. Ltd. Thomson Road #04-02/05 United Square, Singapore 307591 Tel: 65-253-8311 Fax: 65-250-3583
G98.
Corporation 1998
Printed Japan
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