QUALITY ASSURANCE SEMICONDUCTOR DEVICES QUALITY ASSURANCE SYSTEM
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QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE SYSTEM SEMICONDUCTOR DEVICES QUALITY ASSURANCE DEVELOPMENT STAGE QUALITY ASSURANCE MASS PRODUCTION STAGE FAILURE AFTER SHIPPING CORRECTIVE ACTIONS QUALITY ASSURANCE MATERIALS PARTS EQUIPMENT, CALIBRATION, ENVIRONMENT CONTROL DOCUMENT CONTROL, SMALL GROUP ACTIVITIES, QUALITY CONTROL/ RELIABILITY EDUCATION SYSTEM
STANDARDIZATION DOCUMENT CONTROL Small Group Activities Quality Control/Reliability Education
9000 SERIES
GENERAL CONTENTS QUALITY SYSTEM REQUIREMENTS DESCRIBED 9001 9003
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE SYSTEM SEMICONDUCTOR DEVICES
Figure II-1 shows quality assurance system that covers products' life cycle from development design mass production, shipping field use. TOTAL QUALITY ASSURANCE SYSTEM
QUALITY CONTROL QUALITY CONTROL SMALL GROUP AUDIT EDUCATION ACTIVITIES
QUALITY CONTROL DESIGN RELIABILITY DESIGN
STRUCTURE MATERIALS
QUALITY CONTROL PRODUCTION
TESTING DOCUMENT CONTROL ENVIRONMENTAL CONTROL
QUALITY ASSURANCE PRODUCTS QUALITY ASSURANCE INSPECTION NON-DEFECTIVE UNIT ANALYSIS
CIRCUIT MASK PACKAGE
PRODUCTION PROCESS
DESIGN REVIEW
DEVELOPMENT REVIEW
EQUIPMENT CALIBRATION CONTROL
PROCESS/ STRUCTURE
PRODUCT LOGICAL SPECIFICATIONS CIRCUIT
MATERIALS CONTROL
PATTERN
QUALITY DATA ANALYSIS
MANAGEMENT STORAGE SHIPPING
DESIGN VERIFICATION
ELECTRIC CHARACTERISTICS EVALUATION
IMPROVEMENT QUALITY YIELDS
QUALIFICATION TEST (LIFE, ENVIRONMENTAL, MECHANICAL, MAXIMUM RATINGS, ETC.) INITIAL PERIOD MANAGEMENT FAILURE ANALYSIS
AUTO-MATION
PREPRODUCTION MASS PRODUCTION TRANSITION MEETING
PRODUCTION CONTROL
CHANGE CONTROL
PRODUCTION PROCESS
DEVELOPMENT PROTOTYPING DEVELOPMENT
ACCEPTANCE MANAGEMENT
IN-PROCESS MANAGEMENT
WAREHOUSING
DESIGN
VERIFICATION
MARKET RESEARCH
PROTOTYPING
MATERIAL S/PARTS
WAFER PROCESS
ASSEMBLY PROCESS
INSPECTION PROCESS
STORAGE SHIPPING
CUSTOMER
IMPROVEMENT QUALITY RELIABILITY CORRECTIVE/ PREVENTIVE ACTIONS
CUSTOMER SUPPORT
RETURN PRODUCT CONTROL
FAILURE ANALYSIS IMPROVEMENT ACTIONS
DATA COLLECTION
QUALITY MEETING
DEVELOPMENT-TO-SHIPPING FLOW
INFORMATION FLOW
ACTIVITY
Figure II-1 Quality Assurance System Semiconductor Devices
quality control design builds specifications quality product. focuses optimization review structure, materials, circuit design, packaging production process. each device product type, prototype fabricated verify characteristics reliability before mass production begins. quality control production builds quality during production process. controls quality manufacturing equipment, tools, water cleanliness, gases, manufacturing conditions, product finish. have established total quality control system with processing quality control information. quality control product includes activities. first activity in-house testing inspection individual device, lot, samples check whether product meet prescribed functionality reliability. second activity customer support through accepting returned products providing quality control information. quality control information collected development design, production, shipping, field stages. back each stage improve quality. Figure II-2 shows flowchart quality assurance program. quality control system built based 9000 Series Standard.
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
STAGE MARKET
SALES
DESIGN ENGINEERING
MANUFACTURING
QUALITY ASSURANCE
PRODUCTION CONTROL/ PURCHASING GENERAL AFFAIRS
CUSTOMER
MARKET/TECHNOLOGICAL RESEARCH CONCLUSION DEVELOPMENT CONTRACT DEVELOPMENT PRODUCTION PLANNING DEVELOPMENT DESIGN DESIGN REVIEW QUALIFICATION MATERIALS PARTS PROTOTYPING DESIGN VERIFICATION (EVALUATION ELECTRICAL CHARACTERISTICS STRUCTURE) ESTABLISHMENT PRODUCTION STANDARD QUALIFICATION TEST
DEVELOPMENT DESIGN
TRANSITION PREPRODUCTION MASS PRODUCTION CUSTOMER RECEIPT ORDERS PRODUCTION PRODUCTION ORDER
PRODUCTION QUALITY CONTROL PLANNING
PURCHASE MATERIALS PARTS
PREPRODUCTION/MASS PRODUCTION
IN-PROCESS QUALITY CONTROL
ACCEPTANCE MATERIALS PARTS
WAFER PROCESS ASSEMBLY EQUIPMENT CALIBRATION CONTROL
ENVIRONMENTAL CONTROL
FINAL INSPECTION QUALITY ASSURANCE INSPECTION
RECEIPT ORDERS SHIPPING INSTRUCTIONS
FAILURE ANALYSIS (INVESTIGATION CAUSES, CORRECTIVE/PREVENTIVE ACTIONS QUALITY CONTROL INFORMATION) QUALITY/YIELD IMPROVEMENT, FAILURE ANALYSIS, DATA COLLECTION
SHIPPING
TRANSPORTATION PRODUCT CONTROL CUSTOMER
PACKAGING
PACKING SHIPPING
INSTALLATION
RETURN QUALITY PRODUCTS CONTROL INFORMATION
CHANGE CONTROL INSTRUCTIONS
RETURN PRODUCT CONTROL
CORRECTIVE PREVENTIVE ACTIONS (RESEARCH, ANALYSIS, COUNTERMEASURES)
REPORTING PRODUCTS/MATERIALS/PARTS FLOW INFORMATION FLOW
Figure II-2 Quality Assurance Program Flowchart
TRAINING
CHANGE CONTROL ISTRUCTIONS
SMALL GROUP ACTIVITY
DOCUMENT CONTROL
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE DEVELOPMENT STAGE
following procedure ensure target quality reliability product development.Using demand estimate based market research, plan development considering required levels quality, functionality, reliability production issues.Then theories, technology ideas adopted design development.For this purpose, have defined three development levels.
Level Developing products with design rules, materials, process technology Level Modifying design mass-produced products, partially modifying processes, packages, materials, equipment Level III: Using current processes packages those similar slightly modified quality levels
Fault three analysis (FTA), failure mode effect analysis (FMEA), another method used review design.A prototype fabricated. Then prototype undergoes qualification test that checks whether their electrical characteristics, maximum ratings, liability meet quality target. .Figure II-3 flowchart qualification test.When develop Level device, test element groups (TEGs) evaluate design, materials, process technology.If potential problems detected, improvements made (A).TEGs circuit patterns grouped into related functionality.They used evaluate process technology design. .The reliability evaluated using monitoring LSIs detect problems arising from large scale integration.We often one-generation technology fabricate monitoring LSIs.For example, make DRAMs evaluate DRAM technology.When evaluate technology logic device, large scale reliability TEGs that have similar scale real device.Electrical characteristics including various parameters, temperature dependency, pattern sensitivity (B).Then reliability testing carried out.This includes types tests.The long-term life test estimate device life (D).The initial failure rate test performed large number devices estimate early failure rate (E).Finally assemble testing sometimes detect unknown failure modes that revealed above evaluations. .For Level development, only perform steps (B), (D), and.(E).For Level development, only perform (D). .The Design Engineering Department Quality Assurance Department carefully review results qualification test.When they find inconsistencies, they investigate causes using failure analyses improve prototype.When device passes qualification test, preproduction meeting held check problems concerning design, production, quality.After problems have been resolved, device ready preproduction. preproduction stage, initial period management carried check quality manufactured products.The initial period man-agement refers special management system that applies certain period after production starts.An increased quantity infor-mation collected during this period.Immediate corrective actions then taken failures detected results checked.Also this stage, prepare standard forms mass production train workers.And materials parts supply system provide equipment tools required production.The device ready enter mass production stage.
TEST MANUFACTURED DEVICE LONG-TERM RELIABILITY TEST INITIAL FAILURE RATE TEST ANALYZE INSPECT STRUCTURE EVALUATE ELECTRICAL CHARACTERISTICS (E.G. SAMPLE DISTRIBUTION) EVALUATE RELIABILITY USING MONITORING LSIS INSPECT RELIABILITY USING CIRCUIT SIMULATION EVALUATE RELIABILITY PROCESSES USING TEGS
Figure III-3 Flowchart Qualification Test
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE MASS PRODUCTION STAGE
mass production stage, device into continuous production based production plan.The Manufacturing Department controls materials, parts, production process, environment equipment conditions.They also perform in-process inspections, final inspection quality assurance test both semimanufactured manufactured products check quality levels.Figure II-4 shows quality assurance system mass-produced products. .Building quality this stage very important manufacturing high quality products economically.To this, Manufacturing/Engineering Department provides operating instructions defines control items critical production conditions. Operation proceeds accordance with instructions.Check sheets used control manufacturing conditions that affect quality some specific product/process data controlled maintain improve quality level. .Periodical inspections accuracy adjustments performed early detection abnormalities preventive maintenance. .The in-process quality control performs control with product finish measurement values.The quality control information back earlier processes improve quality levels. final inspection, products undergo electrical characteristic testing.For detecting defective products rejecting marginal products, screening performed.The resulting data used improving quality. .Completed products that have passed final inspection subjected quality assurance tests check whether they meet customer's requirements.The quality assurance test consists lot-by-lot test periodical test.The lot-by-lot test judges whether should accepted rejected.It includes visual, electrical characteristics, thermal mechanical environment, maximum rating tests.The periodical test checks reliability sampling regular interval.It includes electrical characteristics, thermal, mechanical, operating life tests.The test results immediately back relevant departments improve quality.They also used estimate reliability field use.
Quality control materials parts
Acceptance inspection Controls material/part manufactures Material/parts quality assurance agreement
Production quality control
Document control Equipment calibration control Environmental control
Product quality control
Quality assurance inspection Periodical test Group
control Change control
Non-defective product analysis
Quality control data analysis
Improvement quality yield
Storage shipping analysis
Purchased materials parts
Wafer process
Wafer inspection
Assembly process
Final inspection
Quality assurance test (Lot-by-lot test Groups
Storage
Customer
In-process quality control
Quality reliability improvement
Data collection Failure analysis Corrective preventive measures
Customer support
Return products control Quality control meeting
Figure II-4 Quality Assurance System Mass Production Stage
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
quality information from purchasing materials parts production, inspection, shipping, field controlled using system. .The information sent host computer where analyzed using statistical quality control methods.The result analysis back Manufacturing/Engineering Departments other departments maintain improve quality levels increased yields. failure occurs during production process product itself, failure information sheet issued.Then relevant departments investigate cause failure take corrective actions.Figure II-5 flowchart corrective action. .When design, materials parts, production methods, equipment, such changed, prototype made check quality levels evaluate reliability.If problem detected, change implemented after customer given approval. .Quality control audits performed members departments such Design Engineering, Manufacturing, Sales, Administration, Supplies regularly.They enable problems identified corrected.They also increase awareness quality control departmental level.The result more comprehensive quality control system.
PROCEDURE DESCRIPTION
DETECTION QUALITY PROBLEM
DEPARTMENT CONCERNED
DEPARTMENT DETECTED
ISSUE FAILURE INFORMATION SHEET
FAILURE ANALYSIS
QUALITY ASSURANCE, DESIGN/ENGINEERING, MANUFACTURING
INVESTIGATE PROCESS RECORD
DESIGN/ENGINEERING MANUFACTURING
CORRECTIVE ACTION MEETING
QUALITY ASSURANCE, DESIGN/ENGINEERING, MANUFACTURING
CORRECTIVE ACTIONS DISPOSITION DEFECTIVE PRODUCTS
DESIGN/ENGINEERING MANUFACTURING
QUALITY ASSURANCE
CONFIRMATION CORRECTIVE ACTIONS
Figure II-5 Flowchart Corrective Action
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
FAILURE AFTER SHIPPING CORRECTIVE ACTIONS
When failure found acceptance inspection, assembly, field customer, Quality Assurance Department plays major role identifying cause failure implementing corrective actions.Based analysis request issued Sales Department, Quality Assurance Department investigate failure analyze using various testing equipment. .Based analysis result, Design Engineering, Manufacturing, other related departments hold meeting.Then corrective action taken required, report issued customer. Figure II-6 shows flowchart returned product control.
CUSTOMER
SALES DEPARTMENT DEALER
SALES DEPARTMENT
QUALITY ASSURANCE DEPARTMENT
RELEVANT DEPARTMENTS
WORKS FACTORIES
ANALYSIS REQUEST
FAILURE ANALYSIS VISUAL INSPECTION
ELECTRICAL CHARACTERISTICS TEST
CLASSIFICATION FAILURE MODE ACCEPTED REJECTED SIMULATION TEST
ACCEPTED
INTERNAL INSPECTION
ELECTRICAL CHARACTERISTICS TEST
CHIP ANALYSIS
REJECTED INVESTIGATE CAUSE
SURVEY PROCESS RECORDS
COUNTERMEASURES MEETING
PRELIMINARY CORRECTIVE ACTION
ACTION EFFECTIVE?
REPORT
(DEPARTMENTS CONCERNED) FINAL CORRECTIVE ACTION
Figure II-6 Returned Product Control Flowchart
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY ASSURANCE MATERIALS PARTS
levels performance, integrity, mounting density semiconductor devices increase, requirements purity materials precision parts have been becoming severer.Semiconductor chips manufactured from various materials (e.g. silicon wafers, compound semiconductor wafers, target materials, photo-resists, process chemicals, gases, D.I. water) assembly/packaging materials parts (e.g. lead frames, metal paths, bonding materials, packages, resins).Each material part requires highest levels specifications quality. .When developing semiconductor device, Mitsubishi Electric compiles purchase specifications diagrams each material part, then purchase them from specialty suppliers.We carrying following quality assurance activities maintain improve quality materials parts. selection materials parts, joint development with specialty suppliers meet purchase specifications control audit suppliers' factories, approval suppliers factories test evaluation each material part type inspection materials parts, conclusion non-defective materials/parts delivery assurance agreement with suppliers degradation causing storage handling materials parts quality data materials parts, control abnormalities control materials parts quality assurance surveys materials parts suppliers, quality meetings with them Figure II-7 shows relationship between these activities.
DEVELOPMENT PLAN DEVICE
PURCHASE SPECIFICATIONS DIAGRAMS
SELECTION DEVELOPMENT MATERIALS PARTS QUALIFICATION TEST EVALUATION MATERIALS PARTS AUDIT MATERIALS PARTS SUPPLIERS' FACTORIES
ORDERING MATERIALS PARTS
APPROVAL MATERIALS, PARTS, SUPPLIERS
ACCEPTANCE INSPECTION/NON-DEFECTIVE MATERIALS/ PARTS DELIVERY ASSURANCE AGREEMENT
PRODUCTION PROCESS/COLLECTION QUALITY DATA
CHANGE CONTROL
ABNORMALITY CONTROL QUALITY IMPROVEMENT ACTIVITIES
Figure II-7 Quality Assurance Activities Materials Parts
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
EQUIPMENT, CALIBRATION, ENVIRONMENT CONTROL
semiconductor industry production equipment intensive industry.That equipment, measuring instruments, other machinery must operate properly accurately maintain improve performance quality semiconductor devices. each piece equipment, maintenance standard established according effects performance quality.Then contents frequencies daily routine inspections defined based types equipment control standards.These inspections detect malfunction, abnormalities, change precision provide basis preventive maintenance system.Inspections checks carried in-house, suppliers, inspection laboratories.Automatic monitoring systems used critical equipment. calibration control involves acceptance inspections regular inspections check correct precision, prevent failure degradation precision.These inspections also establish preventive maintenance system. Figure II-8 shows calibration control flowchart.
NATIONAL/ PUBLIC LABORATORIES
ELECTRONIC TECHNOLOGY RESEARCH LABORATORY/SCALE LABORATORY
PRIVATE LABORATORIES
JAPAN ELECTRICAL INSTRUMENT EXAMINATION OFFICE/JAPAN QUALITY ASSURANCE ORGANIZATION
OTHER LABORATORIES
PRIVATE INSPECTION LABORATORIES
INSTRUMENT MANUFACTURERS
STANDARD/SECONDARY STANDARD INSTRUMENTS
STANDARD/SECONDARY STANDARD INSTRUMENTS
MITSUBISHI ELECTRIC CORP.
STANDARD SAMPLES GENERAL PURPOSE/ SMALL TESTERS
TESTERS
STANDARD SAMPLES SELF-DIAGNOSTICS TEST PROGRAMS
DEDICATED/LARGE TESTERS (INCLUDING PERIPHERAL CIRCUITS)
CUSTOMER
PRODUCTS
Figure II-8 Calibration Control Flowchart
production environment greats quality reliability semiconductor devices. select appropriate control items, methods, criteria factors such temperature, humidity, dust according fabrication process geometry. automatic monitoring system used control environment. D.I. water, gases, chemicals used production line constantly monitored maintain resistivity, purity, other quality levels.
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
DOCUMENT CONTROL, SMALL GROUP ACTIVITIES, QUALITY CONTROL/RELIABILITY EDUCATION SYSTEM
STANDARDIZATION DOCUMENT CONTROL
essence quality control standardization.We promote establishment appropriate standards based standard systems. rules regulations Rules organization, personnel, management, business defined applied. standards Standards outlines products, design, materials, packing, equipment maintenance, inspection, tasks defines.They centrally controlled. design handbooks/manuals Design standard procedure manuals published promote incorporation quality design stage.Standardization flowcharts prepared prevent errors resulting from carelessness.
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
Small Group Activities
part total quality control, Manufacturing Department self-development programs resolve problems, improve productivity safety, increase sales.People from same different workshops gather form small groups listen each other's wisdom.These voluntary continuous activities that everyone workshop participate.
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
Quality Control/Reliability Education
employee education system consists basic, intermediate, advanced courses.The basic courses departmental levels target employees.They include quality control, reliability basics, statistical quality control (SQC) courses, quality control seminars section department managers.The intermediate courses in-house.They consist specialized technology courses areas.The advanced courses consist seminars outside company.They also include quality control courses promote organized education in-house training (See Table II-1). addition, regular company events such quality improvement month, standardization promotion month, daily small-group activities carried promote awareness quality.
TABLE II-1 QUALITY CONTROL RELIABILITY EDUCATION SYSTEM
IN-HOUSE COURSES BASIC COURSES (WORKS FACTORY LEVELS) MANAGERS SUPERVISORS QUALITY CONTROL COURSE SUPERVISORS INTERMEDIATE COURSES (COMPANY WORKS LEVELS) QUALITY CONTROL SEMINAR SECTION DEPARTMENT MANAGERS QUALITY CONTROL COURSE SUPERVISORS RELIABILITY ENGINEERING COURSE DESIGN EXPERIMENTS (DE) COURSE ENGINEERING SCHOOL (RELIABILITY COURSE) COURSE SEVEN-TOOL COURSE EXTERNAL COURSES ADVANCED COURSES QUALITY CONTROL SEMINAR SECTION DEPARTMENT MANAGERS
SENIOR EMPLOYEES
QUALITY CONTROL COURSE ENGINEERS QUALITY CONTROL COURSE OPERATORS
BASIC QUALITY CONTROL SEMINAR RELIABILITY FMEA COURSE DESIGN REVIEW COURSE SEVEN-TOOL COURSE
PERSONS
BASIC QUALITY CONTROL COURSE BASIC RELIABILITY COURSE
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
9000 SERIES
GENERAL
9000 Series international standards quality assurance quality control.They were established 1987 International Organization Standardization (ISO).It based British BS5750 U.S. ANSI/ASQC Z1-15 standards.The 9000 have been adopted more than countries.In Japan, Japanese Industrial Standard (JIS) 9900 Series established October 1991.Mitsubishi Electric defined quality assurance system that confirms 9000 Series.
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
CONTENTS
9000 Series divided into 9000-1, 9001 9003, 9004-1. 9000-1: Guideline selecting applying quality control quality assurance standards Identifies major concepts quality describes usage each standard (ISO 9001 9003 9004-1). 9001 9003: Standard model quality system (requested customers suppliers) Provides framework 9000 Series. While 9000-1 9004-1 guidelines, these standards describe requirements.Different standards applied different quality systems. 9001: Quality assurance model design/development, production, final inspection/testing, field use, additional services 9002: Quality assurance model production, final inspection/testing, field 9003: Quality assurance model final inspection/testing 9004-1: Guideline quality control quality system elements guideline elements quality system their application that supplier should establish.
QUALITY ASSURANCE SEMICONDUCTOR DEVICES
QUALITY SYSTEM REQUIREMENTS DESCRIBED 9001 9003
9001 9003 divided into Range, Reference Standard, Definition, Quality System Requirements.(4) describes requirements.The following Tables shows comparison between requirements 9001, 9002, 9003.
REQUIREMENT Management responsibility Quality system Contract review Design control Document data control Purchasing Control customer-supplied product Product identification traceability Process control 4.10 Inspection testing 4.11 Control inspection, measuring test equipment 4.12 Inspection test status 4.13 Control nonconforming product 4.14 Corrective preventive action 4.15 Handling, storage, packaging, preservation delivery 4.16 Control quality records 4.17 Internal quality audits 4.18 Training 4.19 Servicing 4.20 Statistical techniques
ISO9001
ISO9002
ISO9003
LESS SEVERE THAN 9001 9002 LESS SEVERE THAN 9001 9002 LIMITED FINAL PRODUCTS, INSPECTIONS TESTING
LESS SEVERE THAN 9001 9002
LESS SEVERE THAN 9001 9002 LIMITED FINAL INSPECTIONS TESTING LIMITED FINAL INSPECTIONS TESTING LESS SEVERE THAN 9001 9002 LESS SEVERE THAN 9001 9002
LIMITED FINAL PRODUCTS
LESS SEVERE THAN 9001 9002 LESS SEVERE THAN 9001 9002 LESS SEVERE THAN 9001 9002
LESS SEVERE THAN 9001 9002
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