This data book organized accordance with coding conventions package ty
|
|
|
Top Searches for this datasheet
PACKAGE CODING CONVENTIONS PACKAGE CODING CONVENTIONS
This data book organized accordance with coding conventions package type. This simple system detailed below. Package codes provided EIAJ explained Chapter
Example Number pins This standard number pins that package designed support. devices have some pins removed joined together, actual number pins will smaller. Package Code Clear plastic molded Ceramic chip carrier Glass epoxy substrate type Glass-sealed ceramic package Glass-epoxy substrate (memory modules) Plastic molded Metal-sealed ceramic Tape carrier Primary Outline Code TSOP SIP, Special outline QFN, QFJ, TQFP TSOP Secondary Outline Code(1) Special-purpose secondary codes describing package size, Iead pitch other information included needed. Secondary Outline Code Special-purpose secondary codes describing lead shape such lead bend included needed. Since common rule these secondary outline code (1),(2) exists, contact your sales representative detail.
Example
pins Plastic-molded package Secondary outline code indicating (1.778 lead pitch
Example
pins Plastic-molded package Secondary outline code added discriminate from other 80-pin Secondary outline code indicating that shape bent leads type
Mar.'98
Other recent searches
TISP61089AS - TISP61089AS TISP61089AS Datasheet
NMA2218-A1T - NMA2218-A1T NMA2218-A1T Datasheet
MAAPSM0008 - MAAPSM0008 MAAPSM0008 Datasheet
HLB122I - HLB122I HLB122I Datasheet
DS4477-5 - DS4477-5 DS4477-5 Datasheet
DS4477-6 - DS4477-6 DS4477-6 Datasheet
AN2149 - AN2149 AN2149 Datasheet
AM2N-NZ - AM2N-NZ AM2N-NZ Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
