PACKAGE STRUCTURE following diagrams show structure typical packa
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PACKAGE STRUCTURE
PACKAGE STRUCTURE
following diagrams show structure typical packages.
STRUCTURE METAL SEALED
CHIP WIRE PLATING)
SEALING MATERIAL (Au/Sn Pb/Sn)
CERAMIC BODY
LEAD (Pb/Sn PLATING) SOFT SOLDER (Pb/Sn)
STRUCTURE PLASTIC MOLDED
SILVER SPOT PLATING SOFT SOLDER (Pb/Sn) CHIP
EPOXY RESIN
LEAD (Pb/Sn PLATING) WIRE
STRUCTURE PLASTIC MOLDED
CHIP SOFT SOLDER ADHESIVE (Pb/Sn) SILVER SPOT PLATING EPOXY RESIN
WIRE
LEAD (Pb/Sn PLATING)
Mar.'98
PACKAGE STRUCTURE
STRUCTURE PLASTIC MOLDED
CHIP SILVER SPOT PLATING
EPOXY RESIN
WIRE
LEAD (Pb/Sn PLATING) SOFT SOLDER ADHESIVE (Pb/Sn)
STRUCTURE PLASTIC MOLDED
CHIP EPOXY RESIN
WIRE
SILVER SPOT PLATING
SOFT SOLDER (Pb/Sn)
LEAD (Pb/Sn PLATING)
Mar.'98
PACKAGE STRUCTURE
STRUCTURE
EPOXY RESIN CHIP
HEAT SPREADER LEAD(Pb/Sn PLATING)
TAPE (Polyimide)
TEST
STRUCTURE HQFP
EPOXY RESIN HEAT SPREADER SILVER SPOT PLATING WIRE CHIP
SOFT SOLDER ADHESIVE (Pb/Sn)
LEAD
Mar.'98
PACKAGE STRUCTURE
STRUCTURE TSOP (LOC)
EPOXY RESIN WIRE
INNER LEAD
SILVER SPOT PLATING
CHIP
OUTER LEAD (Pb/Sn PLATING)
CHIP
WIRE
INNER LEAD
ADHESIVE
Mar.'98
PACKAGE STRUCTURE
STRUCTURE (OVERMOLD TYPE)
CHIP EPOXY RESIN
WIRE
SUBSTRATE
SOLDER BALL
STRUCTURE (CAVITY DOWN TYPE)
CHIP
SOLDER BALL
SUBSTRATE
WIRE
SEALING RESIN
Mar.'98
PACKAGE STRUCTURE
STRUCTURE Flip-Chip type) Under Development
Solder Ball
Organic substrate
Epoxy resin
Chip
Inner Bump Electrode
STRUCTURE FBGA
wire Epoxy resin
Chip
Single layer substrate Solder ball Dielectric adhesive layer
Mar.'98
PACKAGE STRUCTURE
STRUCTURE M-CSP(Mold Chip Scale Package)
Solder Ball Single layer substrate
Epoxy resin
Inner Bump Electrode
Chip
STRUCTURE HSSOP
Epoxy Resin
Wire Inner Lead Chip
Outer Lead(Cu Alloy) Chip Epoxy Resin
Mar.'98
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