PACKAGE CLASSIFICATION following pages classify Mitsubishi Packag
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PACKAGE CLASSIFICATION
PACKAGE CLASSIFICATION
following pages classify Mitsubishi Packages sealing method mounting method. conventions shown here used throughout this DATA BOOK, suggest take time review them.
Mar.'98
PACKAGE CLASSIFICATION
PLASTIC PACKAGES [Mounting Method] pinout side [Type] (Single Inline Package) Single side HSIP (SIP with Heatsink) (Zig-zag Inline Package) (Dual Inline Package) SDIP (Shrink Dual Inline Package) (Small Outline Package) SSOP (Shrink Small Outline Package) TSOP (Thin Small Outline Package) (Small Outline J-leaded package) (Quad Flat Package) LQFP (Low profile Quad Flat Package) TQFP (Thin Quad Flat Package) (Quad Flat J-leaded package) [Outline]
Through-hole mount
Dual sides
Dual sides
Surface mount
Quadruple sides
Mar.'98
PACKAGE CLASSIFICATION
PACKAGE [Mounting Method] pinout side [Type] [Outline]
Surface mount
Bottom
BGA(Ball Grid Array)
BGA(Cavity Down Type)
FBGA(Fine pitch BGA)
PACKAGE
M-CSP(MoldChip Scale Package)
Surface mount
Quadruple sides
(Quad Tape carrier Package)
Mar.'98
PACKAGE CLASSIFICATION
METAL-SEALED PACKAGES [Mounting Method] pinout sides [Type] [Outline]
TYPE Dual sides
PIGGY BACK Through-hole mount Bottom (Pin Grid Array)
TYPE (Quad Flat Non-leaded package)
Surface mount
Quadruple sides
PIGGY BACK MODULES Plug-in
Mar.'98
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