Linear Technology Corporation (LTC) overriding commitment achieve exce
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QUALITY ASSURANCE PROGRAM QUALITY ASSURANCE PROGRAM
Linear Technology Corporation (LTC) overriding commitment achieve excellence Quality, Reliability Service (QRS) total customer satisfaction. interpret word "excellence" mean delivering products that consistently exceed requirements expectations customers. commitment extends from president every employee, from design product qualification, from manufacturing shipping. meet this commitment, established comprehensive program called "Quality Nineties." This program divided into four separate, highly interrelated programs; Quality Environment, Total Quality Management System (TQMS), Vendor Participation, Focus Nineties. Quality Environment first program, Quality Environment, serves building block three other programs. entails establishing environment that conducive participation each every employee helping build quality into products. This program encourages every employee identify quality problem participate recommending solutions.
Quality '90s
comprehensive operator training certification program been established that covers every area manufacturing from incoming material inspection, wafer fabrication, assembly, test shipping. Emphasis placed compliance with specifications, statistical process control (SPC) performance quality goals, electrostatic discharge damage (ESD) awareness controls, encouraging operators think quality recommend quality improvement ideas. ensure compliance with specifications, Quality Audit Team performs systems audit manufacturing areas suppliers periodic intervals. Compliance with process specifications detailed programs Corporate ISO9001 Quality Policy verified, discrepancies reported quick resolution with special emphasis eliminate recurring problems. performance each area then rated, providing strong incentive each area excel. With philosophy that each department, starting from incoming materials, considered customer preceding department, every effort made working closely together meet exceed end-customer requirements goals.
Systems Quality Audit-Tracking Recurring Problems
NUMBER RECURRING PROBLEMS PERIOD
TOTAL QUALITY MANAGEMENT SYSTEM (TQMS) FOCUS '90s
VENDOR PARTICIPATION
QUALITY ENVIRONMENT
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QUALITY ASSURANCE PROGRAM
Total Quality Management System (TQMS) second program starts with incorporation innovative conservative design layout rules achieve best performance without sacrificing quality reliability. During design development cycle, design, product, package, manufacturing, quality reliability engineering groups participate design reviews ensure that program aspects covered, ranging from product performance objectives ensuring reproducibility repeatability wafer fabrication assembly. Special emphasis placed devising input protection circuitry minimize susceptibility voltage spikes ESD, optimizing thermal layout minimize parametric drift, optimizing bond layout maximize assembly electrical test yields, same time allowing assembled wide selection packages. Once design approved, stringent manufacturing qualification test plan conducted initial engineering runs. test plan selected bring weaknesses design manufacturability problems, includes reliability stress tests such high
Material Controls
VENDOR QUALIFICATIONMINIMUM MANUFACTURING LOTS
temperature Operational Life HAST (Highly Accelerated Stress Testing) plastic packages, MIL-STD883 method 5005 qualification testing hermetic packages. Product performance these tests must equal better than similar products within same generic group considered qualified. Major design, package, material process changes also subjected these same stringent qualification requirements. addition achieving required reliability performance, engineering change must also achieve manufacturing yield quality performance levels equal better than original product considered qualified. major change control procedure place notify customers major changes approval prior implementation when required. manufacturing, process controls start with vendor qualification material piece parts. Qualified Vendor List maintained performance each vendor continuously monitored Vendor Rating Program. dimensional, visual, functional and, where applicable, compositional analysis performed each direct material lot. Automated state-of-the-art wafer fabrication, assembly test equipment, cassette-to-cassette handling wafer fabrication automated handling assembly utilized, where possible, maintain manufacturing consistency quality. Only fully trained certified operators allowed work production material. Stringent statistical process controls, typically beyond industry standards, established each critical manufacturing step wafer fabrication, wafer test, assembly,
Monitor Metallization Quality
QUALIFIED VENDOR LISTADDITION NEWLY QUALIFIED VENDOR LIST
STRINGENT INCOMING INSPECTION EVERY LOT: DIMENSIONAL VISUAL EXAMINATION FUNCTIONAL TESTING SIMULATE ACTUAL MANUFACTURING CONDITIONS PLATING THICKNESS MEASUREMENTS COMPOSITIONAL ANALYSIS CHEMICAL ANALYSIS CONTAMINANTS CRITICAL PARAMETERS
ACCEPT-RELEASE MATERIAL STORES
REJECT-VENDOR CORRECTIVE ACTION
VENDOR PERFORMANCE TRACKINGTO DETERMINE VENDOR QUALIFICATION/ DISQUALIFICATION STATUS
VENDOR SELECTIONFOR PREFERRED VENDOR LISTING SHIP-TO-STOCK PROGRAM
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QUALITY ASSURANCE PROGRAM
package finishing, mark pack shipping depicted Wafer Fabrication, Assembly,Test Endof-Line flowcharts. process controls include monitors critical assembly processes acceptance inspection operations requiring 100% production inspection. Preseal visual inspection performed MIL-STD-883 Method 2010 Test Condition Statistical process control techniques employed optimizing process parameters, monitoring process performance through control charts with action limits upper lower control limits, parametric distribution analysis electrical test. Electrical quality guaranteed conservative guardbanding production test programs minimum three machine guardbands, using state-of-the-art test equipment 0.04% acceptance testing 25°C military commercial lots. Additional tests, like rack burn-in, beyond data sheet specifications regulator products performed exercising parts thermal shutdown mode. These tests incorporated into test flow improve reliability weed infant mortality failures. Visual mechanical quality optimized minimizing handling parts assembly, test
Actual Chart Aluminum Sputter Deposition Using Sensor Number Control
end-of-line operations. Lead finish processes have been selected that minimize solderability problems lots subjected stringent major visual/mechanical inspection. Administrative errors mixed wrong parts minimized strictly adhering station policy, double-checking orders order entry shipping. Before shipment customer each inspected ensure that meets internal customer specifications purchase order requirements. level attention paid each unit demonstrated fact that each unit traceable wafer fabrication number side back mark both commercial products packages, except where there physical constraint. Through automated equipment, strict process controls (utilizing proven statistical process control techniques), periodic systems quality audits (conducted Quality Audit Team), stringent facilities environmental controls monitors, able ensure that quality built into product guarantee consistently high quality level. manufacturing quality controls complimented reliability audit program designed weed design, fabrication, packaging assembly deficiencies. Additionally, controls supported comprehensive failure analysis corrective action program designed provide timely feedback findings operating groups resolution. analysis customer returns, corrective action taken, completes closed loop Total Quality Management System.
Military Commerical Products Share Same Stringent Inspections Controls
WAFER FABRICATION PROCESS CONTROLS CLASS PROCESSING. REGULAR MONITORS. PRE-SEAL VISUAL INSPECTION MIL-STD-883 METHOD 2010. TEST CONDITION SHEAR TEST MIL-STD-883 METHOD 2019. BOND PULL TEST MIL-STD-883 METHOD 2011. SOLDERABILITY TEST MIL-STD-883 METHOD 2003. MARK PERMANENCY TEST MIL-STD-883 METHOD 2015. HERMETICITY TESTING MIL-STD-883 METHOD 1014. ELECTRICAL TEST 0.04% 25°C, TEMPERATURE TESTING. EXTERNAL VISUAL MIL-STD-883 METHOD 2009.
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QUALITY ASSURANCE PROGRAM
Bond Strength Histogram
1400 1.25 BOND PULL DATA 1200 ASSY 1.25 TO-5 BOND PULL DATA 1000
FREQUENCY
BOND STRENGTH (GRAMS)
Failure Analysis Photomicrographs
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QUALITY ASSURANCE PROGRAM
Vendor Participation requirements high quality materials integrated circuit manufacture range from (parts billion) impurity levels electronic grade chemicals (parts million) defective levels lead frame packaging materials. only essential, critical semiconductor manufacturer work closely with vendors attain high quality levels needed materials. program been established implemented allow vendor participation formulating specifications establishing percentage defective rejection rate goals. This vendor participation ensures that direct material quality levels received consistent with manufacturing end-product quality goals. Clearly, achieving optimum quality product requires best possible materials available with continuous communication feedback from vendors improve this area. Preferred Vendor Program helps drive vendors manufacturing excellence. Focus '90s following quality improvements programs have been established meet quality requirements '90s. Goals demand quality semiconductor components becomes increasingly more stringent, percentage goals from 1970s have given goals '80s '90s. quality goals established every major operation, from incoming inspection customer returns. Performance goals reviewed quarterly and, where goals met, quality improvement programs defined implemented. Quality goals updated tightened annual basis, quality programs redefined achieve goals established. early benefits this program demonstrated excellent average outgoing electrical quality (AOQ). Statistical Process Control (SPC) increased reliance automated manufacturing test equipment underlines need strict process control techniques. valuable tool realize importance these methods. Engineering analysis performed regularly using techniques establish process capability. Various variable attribute control charts used ensure that processes within normal limits action shutdown limits established critical operations. process capability processes calculated using capability index ongoing basis ensure program continuous quality improvement.
Actual Normalized Moving Chart Epitaxial Growth Reactor Controlling Resistivity Deposition Rate
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QUALITY ASSURANCE PROGRAM
Control comprehensive control program been established which encompasses design, handling, testing, storage final packaging shipment. program includes grounded table tops, floor mats, wrist straps heel straps, topical antistatic treatment floor coverings, banning static bearing materials from manufacturing environment, ionizers, conductive antistatic materials handling final packaging. Areas where control must enforced designated Protected areas. awareness training programs help increase operator's awareness successful implementation this program. Every effort made stamp this silent chip killer. benefits this program improved quality reliability customer.
Quality System Surveys MIL-Q-9858 MIL-I-45208 Approval
Customer Ship-To-Stock Program working hand-in-hand with customers consistently supply high quality products achieve ship-tostock program eliminating need incoming inspection. recognize benefits customers ship-to-stock program, namely, savings need purchase maintain incoming test equipment, savings need maintain safety stock case incoming rejections, reduction board failures rework costs because higher component quality.
Ship-To-Stock Program Flow
NUMBER MAJOR OEMs
100% INCOMING INSPECTION
CALENDAR QUARTER (FOR CY1983-1992
Based foregoing quality programs, Linear Technology Corporation positioned continuously improve product quality exceed demands customers '90s beyond. 9001 Certification Realizing importance 9000 international standard quality management, received 9001 certification 1993 covering company's design, manufacturing service organizations. This also helped solidify customer confidence that they dealing with manufacturer with proven international quality system.
ESTABLISH GOAL WITH CUSTOMER
FAILURE RATE EXCEEDED
CUSTOMER MEASURES (AVERAGE INCOMING QUALITY) ELIMINATE 100% INCOMING INSPECTION START SHIP-TO-STOCK WHEN GOAL PROVIDES CUSTOMER WITH (AVERAGE OUTGOING QUALITY) DATA CUSTOMER TRACKS BOARD/SUBSYSTEM/SYSTEM TEST DATA SHIP-TO-STOCK PARTS
CUSTOMER RETURN FAILED PARTS FAILURE ANALYSIS
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QUALITY ASSURANCE PROGRAM
WAFER FABRICATION FLOWCHART Generic Bipolar Process
Vendor: Package: Location Wafer Fab: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: Linear Technology Corporation Plastic SOIC/DIP Linear Technology Corporation, Milpitas, Carsem Unisem Penang Malaysia, ASAT Hong Kong Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Manager, LTC, Milpitas, (408) 432-1900
PROCESS STEP Incoming Material Inspection INSPECTION/ TEST CRITERIA Visual: Scratches, Pits, Haze, Craters, Dimples, Contamination, Oxygen/Carbon Measurement Resistivity/ Conductivity Dimensional Thickness Taper/Bow Orientation Verification Against "MPS" Requirements Visual C.D. Measurement METHOD EQUIPMENT Inspection
INCOMING QUALITY INSPECTION GATE MANUFACTURING PROCESS QUALITY MONITOR/SURVEILLANCE REWORK
FLOWCHART INCOMING REWORK
DESCRIPTION Wafers
SAMPLING PLAN 1.0% 2.5% Level
TECHNIQUE Trend Chart Defective Trend Chart Moving Chart
Infrared Spectrometer Magnetron Meter Calipers Dial Thickness Gauge Break Test
2.5% AQL, Level 2.5% AQL, Level Each Batch
Photo Mask Plates
AMS-100 Calipers Comparator Lamp
Each Plate
Logbook
Chemicals
Verification Against "MPS" Requirements Plus Yearly Analysis Verification Visual Lamp (100%) Microscope Nanospec Optical Microscope 100X Outside
Each Batch
Logbook
Gases Targets Initial Oxidation Oxidation Furnace
Logbook Each Target Wafers/Run Defects/Field View Wafers/Cycle Pattern Scan 100% Wafers Production Logbook Logbook Logbook
Oxide Thickness Collector Mask Collector Implant Resist Mask Etchant Bath Implant Final Inspection
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP Collector Diffusion DESCRIPTION Oxidation Diffusion Furnace INSPECTION/ TEST CRITERIA Visual Oxide Thickness Deposit Gemini Reactor Visual METHOD EQUIPMENT Lamp (100%) Microscope Nanospec Point Probe Philtec Groove Lamp SAMPLING PLAN Wafers/Run Defects/Field Wafers/Run Test Wafer/Run Test Wafer/Cycle 100% Spike More Than Wafers Reject More Than Slip Stacking Fault Reject Reading/Pass Reading/Pass 100% Wafers/Run Defects/Field View Wafers/Run Pattern Scan. 100% Wafers 100% Defects/ Wafer Wafers/Run Defects/Field View Test Wafers/Run 100% Defects/ Wafer Wafers/Run Defects/Field View Test Wafers/Run Test Chip/Run Product Wafers/ Pattern Scan 100% Wafers 100% Defects/ Wafer Test Wafers/Run 100% Defects/Field View Test Wafers/Run Test Wafers/Run Logbook Trend Chart Production Logbook Logbook Production Trend Chart Moving Chart Logbook TECHNIQUE Logbook
Interference Contrast Microscope Thickness Re-Ox Oxidation Furnace Visual Point Probe Nicolet Lamp Microscope
Oxide Thickness Isolation Mask Isolation Predeposition Resist Mask Etchant Bath Final Inspection
Nanospec Optical Microscope 100X Lamp Microscope
Boron Deposition Visual Furnace
Isolation Diffusion Diffusion Furnace Visual
Point Probe Lamp Microscope
Sinker Mask Resist Mask Etchant Bath Deposition Furnace Diffusion Furnace Final Inspection
Point Probe Philtec Groove Nanospec Optical Microscope 100X Lamp Point Probe Lamp Microscope
Sinker Predeposition Sinker Diffusion
Visual Visual
Point Probe Nanospec
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP Base Mask Diode Check Base Predeposition DESCRIPTION Resist Mask Etchant Bath Curve Tracer BVCSO Deposition Furnace INSPECTION/ TEST CRITERIA Final Inspection BVCSO METHOD EQUIPMENT Optical Microscope 100X Curve Tracer SAMPLING PLAN Pattern Scan 100% Wafers Wafers/Run Readings Fail 100% Defects/ Wafer Wafers/Run Defects/Field View Test Wafers/Run 100% Defects/ Wafer Wafers/Run Defects/Field View Test Wafers/Run Product Wafers/ Pattern Scan 100% Wafers Readings Fail Test Chip/Cycle Sites/Wafer Every Fourth Wafer Readings Spec Pattern Scan 100% Wafers Critical Dimension Measure. Wafers/ Lot, Accept Failures Defects/Wafer 100% Readings/Pass Pattern Scan 100% Wafers Critical Dimension Measure. Wafers/ Lot, Accept Failures Production Logbook Production Trend Chart Production Logbook Logbook Trend Chart TECHNIQUE Logbook
Visual
Lamp Microscope
Base Diffusion Diffusion Furnace Visual
Point Probe Lamp Microscope
Emitter Mask Diode Check Emitter Diffusion Resist Mask Etchant Bath Curve Tracer Deposition Furnace Final Inspection BVCBO Beta/LV
Point Probe Nanospec Optical Microscope 100X Curve Tracer Point Probe Curve Tracer
Contact Mask
Resist Mask Etchant Bath
Final Inspection
Optical Microscope 100X Optical Microscope 1000X
Metal Deposition Metal Mask
Deposition Sputter Machine Resist Mask Etchant Bath
Visual /Thickness Final Inspection
Lamp Point Probe Optical Microscope 200X Optical Microscope 1000X
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP Alloy Electrical Test DESCRIPTION Anneal Furnace Evaluate Electrical Parameters LOMAC Passivation LPCVD Furnace Visual Lamp Microscope INSPECTION/ TEST CRITERIA Visual METHOD EQUIPMENT Lamp SAMPLING PLAN 100% Defects/ Wafer Wafers/Run TECHNIQUE Logbook Logbook
LPOM
100%, Color Changes Fail Wafers/Cycle Defects/Field View Wafers/Cycle Wafers/Cycle 100%, Color Changes Fail Wafers/Run, Defects/Field View Wafers/Cycle Wafers/Cycle Pattern Scan. 100% Wafers
Phosphorous Concentration PECVD Nitride Deposition Furnace Visual
Nanospec 10:1 Etch Rate Lamp Microscope
Trend Chart
Thickness Index Refraction Mask Resist Mask Plasma Etch Oxide Etchant Bath Evaluate Electrical Parameters Disco. Backside Metallization Step Coverage General Metallization Visual Photos Photo Final Inspection
Nanospec Elipsometer Optical Microscope 100X
Production
Electrical Test
100%
Logbook
Backlap Backside Metal
Unaided Scanning Electron Microscope
100% Wafer/Week
Logbook Logbook Logbook
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QUALITY ASSURANCE PROGRAM
WAFER FABRICATION FLOWCHART Generic CMOS Process
Vendor: Package: Location Wafer Fab: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: Linear Technology Corporation Plastic SOIC/DIP Linear Technology Corporation, Milpitas, Carsem Unisem Penang Malaysia, ASAT Hong Kong Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Manager, LTC, Milpitas, (408) 432-1900
PROCESS STEP Incoming Material Inspection INSPECTION/ TEST CRITERIA Visual: Scratches, Pits, Haze, Craters, Dimples, Contamination, Oxygen/Carbon Measurement Resistivity/ Conductivity Dimensional Thickness Taper/Bow Orientation Verification Against "MPS" Requirements Visual C.D. Measurement METHOD EQUIPMENT Inspection
INCOMING QUALITY INSPECTION GATE MANUFACTURING PROCESS QUALITY MONITOR/SURVEILLANCE REWORK
FLOWCHART INCOMING REWORK
DESCRIPTION Wafers
SAMPLING PLAN 1.0% 2.5% Level
TECHNIQUE Trend Chart Defective Trend Chart
Infrared Spectrometer Magnetron Meter Calipers Dial Thickness Gauge Break Test
2.5% AQL, Level 2.5% AQL, Level Each Batch
Photo Mask Plates
AMS-100 Calipers Comparator Lamp
Each Plate
Logbook
Each Batch
Logbook
Chemicals
Verification Against "MPS" Requirements Plus Yearly Analysis Verification Visual Lamp (100%) Microscope Nanospec Optical Microscope 100X Lamp (100%) Microscope Nanospec Wafers/Run Defects/ Field View Wafers/Cycle Pattern Scan 100% Wafers Wafers/Run Defects/ Field View Wafer/Cycle Production Logbook Logbook Outside Each Target Logbook
Gases Targets Initial Oxidation Oxidation Furnace
Oxide Thickness P-Well Mask Pre-Implant Oxidation Resist Mask Etchant Bath Oxidation Furnace Visual Visual
Oxide Thickness
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP P-Well Implant P-Well Drive DESCRIPTION Implant Furnace Visual Lamp (100%) Microscope Nanospec Lamp (100%) Microscope Nanospec Lamp (100%) Microscope Nanospec Microscope 400X Microscope 400X Wafers/Run Defects/Field View Wafers/Cycle Logbook Visual Wafers/Run Defects/Field View Wafers/Cycle Wafers/Run Defects/Field View Wafers/Cycle Pattern Scan 100% Wafers Pattern Scan 100% Wafers Production Production Logbook Visual Inspection Visual Microscope 100X Lamp (100%) Microscope Microscope 100X Pattern Scan 100% Wafers Wafers/Run Defects/Field View Pattern Scan 100% Wafers Logbook Visual Inspection Visual Microscope 100X Lamp (100%) Microscope Nanospec Lamp (100%) Microscope Optical Microscope 100X Microscope 100X Pattern Scan 100% Wafers Wafers/Run Defects/Field View Wafers/Cycle Wafers/Run Defects/Field View Pattern Scan 100% Wafers Pattern Scan 100% Wafers Logbook Logbook Logbook Logbook Production Logbook Logbook INSPECTION/ TEST CRITERIA METHOD EQUIPMENT SAMPLING PLAN TECHNIQUE Logbook Logbook
Oxide Thickness Strip Oxide Oxidation Etchant Bath Oxidation Furnace
Oxide Thickness Nitride Deposition Nitride Furnace Visual
Nitride Thickness Active Mask Field Implant Mask Boron Field Implant CMOS Strip Resist N-Field Implant Mask Plasma Etch Resist Mask Etchant Bath Implant Plasma Sulfuric Acid Resist Mask Etchant Bath Visual Inspection Critical Dimensions Visual Inspection
Visual Inspection Photo Field Implant CMOS Strip Resist LOCOS Oxide Implant Plasma Sulfuric Acid Oxidation Furnace
Oxide Thickness Plasma Nitride Strip CMOS Mask Implant CMOS Strip Resist Etch Oxide Plasma Etch Resist Mask Etchant Bath Implant Plasma Sulfuric Acid Etchant Bath Visual Inspection Visual
Critical Dimensions
Production Logbook Logbook Logbook
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP Gate Oxide DESCRIPTION Oxidation Furnace INSPECTION/ TEST CRITERIA Visual METHOD EQUIPMENT Lamp (100%) Microscope Nanospec Lamp (100%) Microscope Nanospec Optical Microscope 100X SAMPLING PLAN Wafers/Run Defects/Field View Wafers/Cycle Wafers/Run Defects/Field View Wafers/Cycle Pattern Scan 100% Wafers Production Logbook Visual Inspection Poly Thickness Visual Lamp (100%) Microscope Lamp (100%) Microscope Point Probe Optical Microscope 100X Optical Microscope 100X Wafers/Run Defects/Field View 100% Defects/ Wafer Test Wafers/Run Pattern Scan 100% Wafers Pattern Scan 100% Wafers Production Production Logbook Visual Inspection Visual Inspection Microscope 100X Microscope 100X Pattern Scan 100% Wafers Pattern Scan 100% Wafers Production Logbook Logbook Visual Inspection Visual Microscope 100X Lamp (100%) Microscope Nanospec Lamp (100%) Microscope Nanospec Pattern Scan 100% Wafers Wafers/Run Defects/Field View Wafers/Cycle Wafers/Run Defects/Field View Wafers/Cycle Logbook Logbook Microscope 100X Pattern Scan 100% Wafers Logbook Logbook Logbook TECHNIQUE Logbook
P-Channel Oxide Thickness Visual
N-Channel Oxide Thickness Implant Mask Boron Implant CMOS Strip Resist Poly Deposition Back Etch Mask Sinker PreDesposition CMOS Gate Mask Implant Mask Implant CMOS Strip Resist Implant Mask Implant CMOS Strip Resist Source Drain Re-Ox Resist Mask Etchant Bath Implant Plasma Sulfuric Acid Furnace Resist Mask Plasma Etchant Bath Deposition Furnace Resist Mask Plasma Etchant Bath Resist Mask Implant Plasma Sulfuric Acid Resist Mask Implant Plasma Sulfuric Acid Oxidation Furnace Visual
Visual (/sq) Visual Inspection
Trend Chart
Visual Inspection
Oxide Thickness Visual
Oxide Thickness
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP LPOE DESCRIPTION LPOE LPCVD Furnace INSPECTION/ TEST CRITERIA Visual METHOD EQUIPMENT Lamp (100%) Microscope Nanospec Point Probe Lamp (100%) Microscope Microscope 100X Lamp Point Probe Optical Microscope 200X Optical Microscope 1000X Alloy Electrical Test Anneal Furnace LOMAC Parametric Analyzer Passivation LPCVD Furnace Visual Lamp Visual Lamp SAMPLING PLAN Wafers/Run Defects/Field View Wafers/Cycle Test Wafers/Run Wafers/Run Defects/Field View Pattern Scan 100% Wafers Defects/Wafer 100% Test Chip/Cycle Pattern Scan 100% Wafers Critical Dimension Measure Wafers/ Lot, Accept Failures 100% Defects/ Wafer Wafers/Run Logbook Logbook Production Logbook Trend Chart Production TECHNIQUE Logbook
LPOE Thickness CMOS Getter CMOS Contact Mask Furnace Resist Mask Etchant Bath (/sq) Visual
Visual Inspection Aluminum Desposition CMOS Metal Mask Deposition Sputter Machine Resist Mask Metal Etchant Bath Visual (/sq) Final Inspection Critical Dimensions
LPOM
100%, More Than Color Change Fail Wafers/Cycle Defects/Field View Wafers/Cycle Wafers/Cycle 100%, More Than Color Change Fail Wafers/Cycle Defects/Field View Wafers/Cycle Wafers/Cycle Pattern Scan 100% Wafers
Trend Chart
Microscope
LPOM Thickness Phosphorous Concentration PECVD Nitride Deposition Furnace Visual
Nanospec 10:1 Etch Rate Lamp
Trend Chart
Microscope
LPOM Thickness Index Refraction Mask Resist Mask Plasma Etch Etchant Bath Final Inspection
Nanospec Elipsometer Optical Microscope 100X
Production
15-59
QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING REWORK PROCESS STEP Electrical Test DESCRIPTION LOMAC Parametric Analyzer DISCO Backside Metallization Step Coverage General Metal Visual Photos Photo Unaided Scanning Electron Microscope INSPECTION/ TEST CRITERIA METHOD EQUIPMENT SAMPLING PLAN 100% TECHNIQUE Logbook
Backlap Backside Gold
100% CMOS Wafer/ Week N-Well P-Well Wafer Every
Logbook
Logbook
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QUALITY ASSURANCE PROGRAM
ASSEMBLY FLOWCHART Generic CMOS Bipolar Process
Vendor: Package: Location Wafer Fab: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: Linear Technology Corporation Plastic SOIC Linear Technology Corporation, Milpitas, Carsem/Unisem/Penang-Malaysia, ASAT-Hong Kong Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Manager, LTC, Milpitas, (408) 432-1900
PROCESS STEP Incoming Material Inspection INSPECTION/ TEST CRITERIA Visual; Scratches Pits, Haze, Craters Dimples, Contamination Oxygen/Carbon Measurement Resistivity/ Conductivity Dimentional Thickness Taper/Bow Orientation Verification Against "MPS" Requirements Plus yearly Analysis Wafer Prober METHOD EQUIPMENT Inspection
INCOMING QUALITY INSPECTION GATE MANUFACTURING PROCESS QUALITY MONITOR/SURVEILLANCE REWORK
FLOWCHART INCOMING ASSY REWORK
DESCRIPTION Wafers
SAMPLING PLAN 1.0% 2.5% Level
TECHNIQUE Trend Chart Defective Trend Chart
Infrared Spectrometer Magnetron Meter Calipers Dial Thickness Gauge Break Test
2.5% AQL, Level Each Bach Each Bath
Chemicals Gases Wafer Sort 100% Level Electrical Test Rejects Inked Monitor Probing Optical Quality Wafers Kitted with Bonding Diagram Assembly Traveler
Wafer Sort Monitor
Probe Defects Optical Defects
Microscope
Minimum Times/Shift
Defective Trend Chart
Overseas Assembly
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING ASSY REWORK PROCESS STEP Incoming Piece Parts Inspection DESCRIPTION Lead Frame INSPECTION/ TEST CRITERIA Visual METHOD EQUIPMENT Microscope Optical Comparator, Calipers, X-Ray Fluorescence SAMPLING PLAN AQL, Level TECHNIQUE Trend Chart
Mechanical
Functional (Assembly Process Simulation): Bond Pull Test Shear Test Wafer Mount Waver Mount Monitor Wafer Separation Alignment Accuracy Alignment Micro Automation Disco Microscope Microscope Equivalent Auto Bonder Every Wafer/ Machine, Cuts/ Wafer Target Once/Shift Cuts/Machine Target Strips/Mag Chart Preparation Separation Visual Inspection Unaided Wafers/Shift Target Go/No Inspection
Wafer Monitor Attach
KERF
Quality Accuracy Visual Inspection
Chart
Bonded Lead Frame with Epoxy
Chart
Attach Monitor Epoxy Cure Wire Bond Ball Bonds Gold 1.00 Wire
Visual Quality Shear Test Epoxy Cure Defects
Microscope Shear Tester Pyrometer/TC Auto Thermosonic Ball Bonder Microscope Bond Pull Tester
Units 1X/Machine/ Go/No Shift Customer Request) 1X/Machine/Shift Target
Wire Bond Monitor
Visual Bond Pull Strength Ball Shear
Strip/Mag Wires 1X/Machine/Shift Balls 1X/Machine/Shift Units/Day/Shift Wires 1X/Machine/Shift Every 0.04%
Chart Chart
Ball Shear Tester
Chart
Cratering Test Peel Test
Visual Visual
Go/No Go/No
Optical Inspection
Check Workmanship Quality Prior Molding
Die, Bond, Wire Bond Visual Quality
Microscope
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING ASSY REWORK PROCESS STEP Mold DESCRIPTION Encapsulation with Epoxy Novalac Molding Quality Visual: Chip, Void Cracks, Misalignment, etc. Mold Temperature Transfer Press Voids/Wire Sweep Visual Quality INSPECTION/ TEST CRITERIA METHOD EQUIPMENT Transfer Mold SAMPLING PLAN TECHNIQUE Chart
Mold Monitor
Unaided Pyrometer Hydr Load Cell X-Ray
7X/Shift/Machine 1X/Shift/Machine 1X/Month/Machine Strips (Min) 1X/Machine/Shift Change Device Change Compnd Strips (Min) 1X/Sublot/Machine Strips/4X/Shift/ Machine
Chart
Chart Go/No Chart
Mechanical Deflash Slurry Deflash Marking Marking Permanency Test Post Mold Cure Solder Plate
Remove Mold Flash from Package Remove Mold Flash from Package Visual Inspection
Heat Sink Must Free from Mold Flash Heat Sink Must Free from Mold Flash Visual
Microscope Unaided
Chart
Chart
Unaided Unaided Pyrometer Unaided Thermometer
100% Inspect Units/Sublot 1X/Machine/Shift Strips/4X/Shift Reading 2X/Shift Frames/Shift Units/Sublot Units/Day/ Different Type Package Readings/Sublot Tubes/Sublot Units Machine/Shift Units/Machine 1X/Shift
Go/No Go/No Chart Chart
Mold Quality Solder Plate Bath
Temperature Visual Inspection
Thickness Composition Solder Plate Inspection Solder Plate Quality Visual Inspection Steam Aging
Unaided Solderability Tester Microscope Unaided Microscope Microscope
Chart Go/No
Go/No
Thickness Composition Trim Form Singulation Visual Inspection Visual Lead Gap/ Microcrack Coplanarity
Go/No Chart Go/No
Chart
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QUALITY ASSURANCE PROGRAM
FLOWCHART INCOMING ASSY REWORK PROCESS STEP Final Visual DESCRIPTION Visual INSPECTION/ TEST CRITERIA Mark, Correct Mark, Marking Permanency Test Marked) Visual: Bent Leads Mold Flash, Solder Quality, Etc. Mark, Correct Mark, Marking Permanency Test Marked) Visual: Bent Leads Mold Flash, Solder Quality, Etc. METHOD EQUIPMENT Unaided SAMPLING PLAN 100% TECHNIQUE Go/No
Final Visual Inspection
Visual Quality
Unaided
Go/No
Pack
Packing Preparation Delivery
Antistatic Shipping Tube
Every 100% Basis
Ship
15-64
QUALITY ASSURANCE PROGRAM
(END-OF-LINE) FLOWCHART Generic CMOS Bipolar Process
Vendor: Package: Location Wafer Fab: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: Linear Technology Corporation Plastic SOIC Linear Technology Corporation, Milpitas, Carsem/Unisem/Penang-Malaysia, ASAT-Hong Kong Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Linear Technology Corporation, Milpitas, Singapore Manager, LTC, Milpitas, (408) 432-1900
PROCESS STEP Incoming Inspection INSPECTION/ TEST CRITERIA Package Dimension External Visual Mark Permanency Ink-Marked) Solderability Attach Quality Lead Fatigue Test Class Test Electrical Test Electrical Quality Electrical Quality Check Package Quality Package/ Pack Quality Inspection Test GuardBanded Data Sheet Test Limits Test GuardBanded Data Sheet Test Limits Test GuardBanded Data Sheet Test Limits Visual: Bent Leads, Lead Form Criteria, Mold Voids/Cracks, etc. Verify Correct Mark, Correct Pack Method, Correct Labeling, External Visual Inspection Paperwork Check, Verify Correct Part Number Correct Count METHOD EQUIPMENT Optical Comparator Calipers Microscope MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 Pliers Lead Fatigue Tester Integrated Circuit Test System Integrated Circuit Test System Integrated Circuit Test System Eyepiece
INCOMING QUALITY INSPECTION GATE MANUFACTURING PROCESS QUALITY MONITOR/SURVEILLANCE REWORK
FLOWCHART
DESCRIPTION Check Quality Incoming Assembled Material
SAMPLING PLAN 100%
TECHNIQUE Trend Chart
Electrical Test 25°C Electrical Test 70°C External Visual Inspection Post Pack Inspection
125,
Chart
125,
Chart
100%
Yield Chart
Microscope Inspection
125,
P.A. Chart
Shipbench Inspection
Plant Clearance Inspection
Unaided Inspection
LTPD 116,
Ship Customer
15-65
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