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RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number
Top Searches for this datasheet90675D RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number IRHM7150 IRHM3150 IRHM4150 IRHM8150 Radiation Level 100K Rads (Si) 300K Rads (Si) 500K Rads (Si) 1000K Rads (Si) RDS(on) 0.065 0.065 0.065 0.065 IRHM7150 JANSR2N7268 100V, N-CHANNEL REF: MIL-PRF-19500/603 Hard HEXFET TECHNOLOGY Part Number JANSR2N7268 JANSF2N7268 JANSG2N7268 JANSH2N7268 TO-254AA International Rectifier's RADHard HEXFET technology provides high performance power MOSFETs space applications. This technology over decade proven performance reliability satellite applications. These devices have been characterized both Total Dose Single Event Effects (SEE). combination Rdson gate charge reduces power losses switching applications such converters motor control. These devices retain well established advantages MOSFETs such voltage control, fast switching, ease paralleling temperature stability electrical parameters. Features: Single Event Effect (SEE) Hardened RDS(on) Total Gate Charge Simple Drive Requirements Ease Paralleling Hermetically Sealed Ceramic Eyelets Light Weight Absolute Maximum Ratings Parameter 12V, 25°C 12V, 100°C 25°C dv/dt Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight footnotes refer last page Pre-Irradiation Units W/°C V/ns (0.063 (1.6mm) from case 10s) (Typical) www.irf.com 05/02/06 IRHM7150, JANSR2N7268 Pre-Irradiation Electrical Characteristics 25°C (Unless Otherwise Specified) Parameter BVDSS Drain-to-Source Breakdown Voltage DSS/T Temperature Coefficient Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage Forward Transconductance IDSS Zero Gate Voltage Drain Current Units 0.13 V/°C Test Conditions 1.0mA Reference 25°C, 1.0mA 12V, 12V, VGS, 1.0mA 15V, VDS= 80V,VGS=0V 125°C -20V 12V, 50V, 14A, 12V, 2.35 0.065 0.076 -100 IGSS IGSS td(on) td(off) Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance Measured from drain lead (6mm/0.25in. from package) source lead (6mm/0.25in. from package) Ciss Input Capacitance Output Capacitance Reverse Transfer Capacitance 4300 1200 1.0MHz Source-Drain Diode Ratings Characteristics Parameter Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Units Test Conditions 25°C, 34A, 25°C, 34A, di/dt 100A/µs Intrinsic turn-on time negligible. Turn-on speed substantially controlled Thermal Resistance Parameter RthJC RthCS RthJA Junction-to-Case Case-to-sink Junction-to-Ambient 0.83 0.21 Units °C/W Test Conditions Typical socket mount Note: Corresponding Spice Saber models available International Rectifier Website. footnotes refer last page www.irf.com Radiation Characteristics Pre-Irradiation IRHM7150, JANSR2N7268 International Rectifier Radiation Hardened MOSFETs tested verify their radiation hardness capability. hardness assurance program International Rectifier comprised radiation environments. Every manufacturing tested total ionizing dose (per notes using TO-3 package. Both pre- post-irradiation performance tested specified using same drive circuitry test conditions order provide direct comparison. Table Electrical Characteristics 25°C, Post Total Dose Irradiation Parameter BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-3) Static Drain-to-Source On-State Resistance (TO-254AA) Diode Forward Voltage 100K Rads(Si)1 1000K Rads (Si)2 Units Test Conditions 1.0mA 1.0mA VDS=80V, 12V, =21A 12V, =21A -100 0.065 0.065 1.25 -100 0.09 0.09 Part number IRHM7150 (JANSR2N7268) Part numbers IRHM3150 (JANSF2N7268), IRHM4150 (JANSG2N7268) IRHM8150 (JANSH2N7268) International Rectifier radiation hardened MOSFETs have been characterized heavy environment Single Event Effects (SEE). Single Event Effects characterization illustrated Fig. Table Table Single Event Effect Safe Operating Area (MeV/(mg/cm 36.8 Energy (MeV) Range (µm) VDS(V) @VGS=0V @VGS=-5V @VGS=-10V @VGS=-15V @VGS=-20V Single Event Effect, Safe Operating Area footnotes refer last page www.irf.com IRHM7150, JANSR2N7268 Post-Irradiation Pre-Irradiation Typical Response Gate Threshhold Voltage Total Dose Exposure Typical Response On-State Resistance Total Dose Exposure Typical Response Transconductance Total Dose Exposure Typical Response Drain Source Breakdown Total Dose Exposure www.irf.com Post-Irradiation Pre-Irradiation IRHM7150, JANSR2N7268 Typical Zero Gate Voltage Drain Current Total Dose Exposure Typical On-State Resistance Neutron Fluence Level Gate Stress VGSS Equals Volts During Radiation Typical Transient Response Hard HEXFET During 1x1012 (Si)/Sec Exposure VDSS Stress Equals BVDSS During Radiation www.irf.com IRHM7150, JANSR2N7268 Note: Bias Conditions during radiation: Vdc, RadiationPost-Irradiation Characteristics Pre-Irradiation Typical Output Characteristics Pre-Irradiation Typical Output Characteristics Post-Irradiation 100K Rads (Si) Typical Output Characteristics Post-Irradiation 300K Rads (Si) Typical Output Characteristics Post-Irradiation Mega Rads(Si) www.irf.com Radiation Characteristics Pre-Irradiation Note: Bias Conditions during radiation: Vdc, IRHM7150, JANSR2N7268 Typical Output Characteristics Pre-Irradiation Typical Output Characteristics Post-Irradiation 100K Rads (Si) Typical Output Characteristics Post-Irradiation 300K Rads (Si) Typical Output Characteristics Post-Irradiation Mega Rads(Si) www.irf.com IRHM7150, JANSR2N7268 Pre-Irradiation Typical Output Characteristics Typical Output Characteristics Typical Transfer Characteristics Normalized On-Resistance Temperature www.irf.com Pre-Irradiation IRHM7150, JANSR2N7268 Typical CapacitanceVs. Drain-to-Source Voltage Typical Gate Charge Gate-to-Source Voltage Typical Source-Drain Diode Forward Voltage Maximum Safe Operating Area www.irf.com IRHM7150, JANSR2N7268 Pre-Irradiation D.U.T. Pulse Width Duty Factor 26a. Switching Time Test Circuit Maximum Drain Current Case Temperature td(on) d(off) 26b. Switching Time Waveforms Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com Pre-Irradiation IRHM7150, JANSR2N7268 DRIVER D.U.T 0.01 28a. Unclamped Inductive Test Circuit V(BR)DSS 28c. Maximum Avalanche Energy Drain Current 28b. Unclamped Inductive Waveforms Current Regulator Same Type D.U.T. .2µF .3µF D.U.T. Charge Current Sampling Resistors 29a. Basic Gate Charge Waveform 29b. Gate Charge Test Circuit www.irf.com IRHM7150, JANSR2N7268 Pre-Irradiation Pulse width Duty Cycle Total Dose Irradiation with Bias. volt applied during irradiation MIL-STD-750, method 1019, condition Total Dose Irradiation with Bias. volt applied during irradiation MlL-STD-750, method 1019, condition Foot Notes: Repetitive Rating; Pulse width limited maximum junction temperature. 25V, starting 25°C, 0.86mH Peak 26A, 26A, di/dt 190A/µs, 100V, 150°C Case Outline Dimensions Low-Ohmic TO-254AA 0.12 [.005] 3.78 [.149] 3.53 [.139] 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040] 17.40 [.685] 16.89 [.665] 20.32 [.800] 20.07 [.790] 13.84 [.545] 13.59 [.535] 3.81 [.150] 1.14 [.045] 0.89 [.035] 0.36 [.014] 3.81 [.150] 127(6 DIMENSIONING TOLERANCING ASME Y14.5M-1994. DIMENSIONS SHOWN MILLIMETERS [INCHES]. CONTROLLING DIMENSION: INCH. CONFORMS JEDEC OUTLINE TO-254AA. ASSIGNMENTS DRAIN SOURCE GATE CAUTION BERYLLIA WARNING MIL-PRF-19500 Packages containing beryllia shall ground, sandblasted, machined have other operations performed them which will produce beryllia beryllium dust. Furthermore, beryllium oxide packages shall placed acids that will produce fumes containing beryllium. WORLD HEADQUARTERS: Kansas St., Segundo, California 90245, Tel: (310) 252-7105 LEOMINSTER Crawford St., Leominster, Massachusetts 01453, Tel: (978) 534-5776 Fax: (310) 252-7903 Visit www.irf.com sales contact information. 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