Technical Brief September 2008 TB477.1 Optical Dual-in-line Flat

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Technical Brief September 2008 TB477.1 Optical Dual-in-line Flat

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Surface Mount Assembly Guidelines Optical Dual Flat Pack Lead (ODFN) Package
Technical Brief September 2008 TB477.1
Optical Dual-in-line Flat No-lead (ODFN) packages developed light sensor applications. mechanical structure ODFN similar that conventional DFN, except molding compound transparent material rather than conventional black compound. Transparent molding compound allows transmission ambient light through molding compound reach sensor area. This package Lead-free, with pre-plated Nickel-Palladium-Gold (NiPdAu) finish terminals. Figure shows lead ODFN illustration. seen from left image, package finish transparent allow light transmission same time, protects device from environment.
This package follows conventional DFN/QFN guidelines land pattern design surface mount processing. Some additional recommendations made accommodate special clear mold compound, which lower glass transition temperature (Tg) higher coefficient thermal expansion (CTE) compared conventional molding compounds. This document provides guidelines assembly handling during board mount process.
Board Mounting Guidelines
package board mounting process similar that conventional DFN/QFN packages. However, there some differences materials used, therefore recommended that users account these differences their application method. Specific guidelines this document meant accommodate differences materials.
Product Packing
ODFN products have been qualified under JEDEC MSL-4 test criteria, shipped either tube tape-and-reel format. packing quantity varies depending application purchasing options. moisture protection seal should broken until board mounting process ready. seal broken, please follow standard instructions baking Jedec standard criteria MSL-4 products.
FIGURE ODFN PACKAGE VIEW
2.10 0.65 1.35 2.00 1.30 INDEX AREA
INDEX AREA
(4X)
0.10 VIEW (0.65)
0.30 ±0.05
0.65 0.35 ±0.05 BOTTOM VIEW DETAIL 0.10 0.10
(0.65)
(1.35) 0.30)
0.75 BASE PLANE SIDE VIEW 0.55) 0.00 0.05 DETAIL
SEATING PLANE 0.08
(1.95) TYPICAL RECOMMENDED LAND PATTERN
FIGURE ODFN PACKAGE DIMENSIONS
CAUTION: These devices sensitive electrostatic discharge; follow proper Handling Procedures. 1-888-INTERSIL 1-888-468-3774 Intersil (and design) registered trademark Intersil Americas Inc. Copyright Intersil Americas Inc. 2008. Rights Reserved other trademarks mentioned property their respective owners.
Technical Brief
Package Construction
ODFN packages have 0.65mm lead pitch nominal package thickness 0.7mm. Figure shows package outline drawing ODFN family with dimensions tolerances. important design land patterns that correspond lead dimension explained subsequent section. Similar packages, ODFN exposed paddle/pad part package construction. shown Figure chamfered corner exposed thermal indicates location product. Similar QFN, exposed provides robustness overall solder joint strength after board mounting. ODFN packages assembled pre-plated Copper lead-frames, individual units singulated sawing process. occasional presence slight oxide layer sawn surface Copper leads concern solder joint quality. Poor wetting this exposed side edge does impact solder joint quality reliability. outline drawings also included product datasheets. example land pattern recommendation shown Figure (ODFN 6L). main features summarized follows: match with exposed area case ODFN 0.65mm 1.35mm) match with width case ODFN 0.3mm) Land length length 0.2mm (extending from package edge) Figure shows reference solder joint shape after ODFN package mounting PCB. Solder joint under exposed intended provide package stand-off height robust assembly definition board recommended non-solder-mask-defined (NSMD), though solder-mask-defined (SMD) pads same effective able dimension acceptable well. Nickel/Gold surface finish with micron maximum gold thicknesses recommended good solder wettability shelf-life process. surface finish also acceptable, requires appropriate controls shelf life exposure environment. HASL solder plated finishes (preplated solder) should used these products.
Land Pattern Design
Intersil Technical Brief 389; provides detailed information design, DFN, packages, applicable ODFN packages. Additionally, package specific land pattern information available package outline drawings which located following website: package
INDEX AREA
(0.65)
0.65 1.35 1.30
(0.65)
(1.35) 0.30
0.30 ±0.05
0.35 ±0.05 0.10 (1.95)
0.55
BOTTOM VIEW
TYPICAL RECOMMENDED
LAND PATTERN
FIGURE ODFN FOOTPRINT (LEFT) CORRESPONDING LAND PATTERN DESIGN (RIGHT)
TB477.1 September 2008
Technical Brief
ODFN PACKAGE
FILET FORM TRIMMED EDGE SENSORDie Sensor SOLDER JOINTS Leadframe LEADFRAME
LAND LAND FORExposed Land EXPOSED Land Pins PINS
PRINTED CIRCUIT BOARD Printed Circuit Board
FIGURE SCHEMATIC SHOWING ODFN PACKAGE MOUNTED
Solder Stencil
0.100mm 0.125mm thick stainless steel stencil recommended. stencil should laser-cut followed electro-polish (chemical finishing recommended). Alternatively additive build-up stencil used. Solder Paste volume contributor solder joint reliability (higher solder volume leads greater reliability). However, this needs controlled, solder bridging occur when solder paste excessive. highly recommended solder exposed package corresponding landing PCB. Care should taken ensure there excessive solder under exposed area, this cause open solder joints excess stand-off created exposed pad. optimal value solder paste center solder paste coverage exposed area.
off-center with respect land pattern. solder fillet edge package leads requirement, fact form all. Hand solder touch-up recommended excess heat from nozzle soldering iron damage transparent mold compound.
ODFN Specific Application Guidelines
transparency requirement Ambient Light Sensing products (ALS) does allow conventional filler loading means controlling mechanical properties mold compound (such coefficient thermal expansion (CTE), modulus, glass transition temperature (Tg)). such, clear epoxy higher than conventional black epoxy with fillers, lower modulus, lower following sections outline features ODFN product proper application product.
Sensor Location Optics Design
general, package body center does always coincide with center light sensor. sensor location (green area part offset from geometric center location sensor itself specific product design question, therefore should obtained from product datasheet. Figure shows example sensor location description. this example, sensor area 0.43mmx0.61mm, offset from center 0.25mm. application set-up should designed lead light center sensor area center package. other hand, sensor surface height always located 0.28 ±0.10mm below surface package. Solder joint package height (0.7mm) should also considered calculating sensor surface height from surface.
Solder Paste
package itself lead-free, compatible with both eutectic Tin/Lead lead-free Tin/Silver/Copper solders. These packages have been qualified +235°C maximum temperature reflow profile eutectic solder, +260°C maximum temperature reflow profile lead-free solder. Solder paste with "no-clean" flux "Type "Type solder particle size distribution recommended.
Reflow Profile
Direct infrared (IR) heating these packages must done damage part. Pure convection reflow these parts recommended. Typical reflow profiles Jedec J-STD-020 criteria recommended eutectic Sn/Pb Lead-free Sn/Ag/Cu solders. Peak temperature eutectic Sn/Pb profile exceed +235°C. Lead-free profile exceed +260°C.
Visual Inspection
Visual inspection solder joints should done verify that there solder bridging between pads, that solder joint "bright-and-shiny" (lead-free appears 'dull' compared Sn/Pb). package tilted
TB477.1 September 2008
Technical Brief
2.10mm
29101
2.00mm SENSOR OFFSET 0.46mm
0.19mm
0.39mm
FIGURE EXAMPLE SENSOR LOCATION DESCRIPTION
Moisture Sensitivity Bake Conditions
ODFN packages have been qualified JEDEC moisture sensitivity levels MSL3 (product specific) both +235°C +260°C solder reflow profiles. properties clear mold compound such that moisture saturation occurs rapidly. Therefore, important control exposure time once moisture protection seal broken. recommended that ODFN components baked according moisture sensitivity level labeling reel exposure time exceeds recommended level label prior board mounting. recommended baking condition +110°C hours. bake temperature higher than +110°C result discoloration clear molding compound.
Rework Associated Risks
ODFN products reworked using reflow profile that closely matches production reflow profile described earlier. ODFN packages should exposed >260°C during rework operation. reuse same ODFN product upon removal from PCB. Replacement unit should used. Excessive heating clear mold compound result change color mold compound also compromise wire bond integrity high coefficient thermal expansion mold compound material.
Marking Traceability
ODFN products cannot marked side package need unobstructed transparency. bottom package, there 4-letter code laser-marking that used trace part details. addition, viewing from top, lead-frame special notch cut-out exposed next lead. This allows checking correct orientation after mounting PCB.
Pick-And-Place With Clear Packages
These optically clear packages fully compatible with vision-based placement machines. These packages recommended placed with mechanical centering placement machines Chip-shooters.
Intersil Corporation reserves right make changes circuit design, software and/or specifications time without notice. Accordingly, reader cautioned verify that Application Note Technical Brief current before proceeding.
information regarding Intersil Corporation products, www.intersil.com
TB477.1 September 2008

Technical Brief September 2008 TB477.1 Optical Dual-in-line Flat

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