Technical Brief March 2008 TB466.1 Optical Dual-in-line Flat No-l

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Technical Brief March 2008 TB466.1 Optical Dual-in-line Flat No-l

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Surface Mount Assembly Guidelines Optical Dual FlatPack Lead (ODFN) Package
Technical Brief March 2008 TB466.1
Optical Dual-in-line Flat No-lead (ODFN) packages developed light sensor applications. mechanical structure ODFN similar that conventional DFN, except molding compound transparent material rather than conventional black compound. Transparent molding compound allows transmission ambient light through molding compound reach sensor area. ODFN Pb-free package, with 100% matte finish terminals. Figure shows bottom views ODFN illustration. seen from left image, package finish translucent allow light transmission same time, protects device itself.
Part ODFN Board Mounting Guidelines
ODFN package board mounting process similar that conventional DFN/QFN packages. However, there some differences materials used, therefore recommended that users account these differences their application method. Specific guidelines this document meant accommodate differences materials.
Product Packing
ODFN products have been qualified under JEDEC MSL-4 test criteria, shipped either tube tape-and-reel format. packing quantity varies depending application purchasing options. moisture protection seal should broken until board mounting process ready. seal broken, please follow standard instructions proper baking Jedec standard criteria MSL-4 products.
Package Construction
ODFN packages have 0.65mm lead pitch nominal package thickness 0.7mm. Figure shows detailed package outline drawing ODFN family with dimensions tolerances. important design land patterns that correspond lead dimension explained subsequent section. Similar packages, ODFN exposed under package. shown Figure chamfered corner exposed thermal indicates location product. Similar QFN's exposed provides robustness during board mount process.
FIGURE ODFN VIEW (TOP) BOTTOM VIEW (BOTTOM)
ODFN follows conventional DFN/QFN guidelines land pattern design surface mount processing. Some additional recommendations made accommodate special clear mold compound, which lower glass transition temperature (Tg) higher coefficient thermal expansion (CTE) compared conventional molding compounds. Currently, ODFN packages available counts. This document provides guidelines assembly handling ODFN during board mount process.
ODFN packages assembled plated Copper lead-frames, individual units singulated sawing process. occasional presence slight oxide layer sawn surface Copper leads concern solder joint quality. Poor wetting this exposed side edge does impact solder joint quality reliability.
CAUTION: These devices sensitive electrostatic discharge; follow proper Handling Procedures. 1-888-INTERSIL 1-888-468-3774 Intersil (and design) registered trademark Intersil Americas Inc. Copyright Intersil Americas Inc. 2007, 2008. Rights Reserved other trademarks mentioned property their respective owners.
Technical Brief Optical Dual Flat No-Lead Family (ODFN)
0.10 0.10
MDP0052
OPTICAL DUAL FLAT NO-LEAD FAMILY SYMBOL ODFN5 0.70 0.02 0.30 0.20 2.00 1.35 2.10 0.65 0.65 1.30 0.35 ODFN6 0.70 0.02 0.30 0.20 2.00 1.35 2.10 0.65 0.65 1.30 0.35 ODFN8 0.70 0.02 0.30 0.20 3.00 2.29 3.00 1.40 0.65 1.95 0.40 TOLERANCE ±0.05 +0.03/-0.02 ±0.05 Reference Basic Reference Basic Reference Basic Basic ±0.05 Rev. 5/06 NOTE
VIEW
(D2) TYP. (E2) I.D. 0.10 BOTTOM VIEW ODFN (2.0x2.1 BODY) (D2)
NOTES:
Dimensioning tolerancing ASME Y14.5M-1994. Exposed lead side package non-functional feature. Dimension define size exposed pad. ODFN version center lead (shown dashed line).
TYP.
(D2)
TYP.
(E2) I.D. 0.10 BOTTOM VIEW ODFN (2.0x2.1 BODY)
(E2) I.D.
0.10
BOTTOM VIEW ODFN (3.0x3.0 BODY)
0.10 SEATING PLANE 0.08 (ALL LEADS EXPOSED PAD) DETAIL
DETAIL
SIDE VIEW
FIGURE ODFN, ODFN ODFN PACKAGE DIMENSIONS TOLERANCES
TB466.1 March 2008
Technical Brief
INDEX AREA
0.65
0.10
BOTTOM VIEW
TYPICAL RECOMMENDED LAND PATTERN
FIGURE ODFN FOOTPRINT (LEFT) CORRESPONDING LAND PATTERN DESIGN (RIGHT)
Land Pattern Design
Intersil Technical Brief provides detailed information design package, this applicable ODFN packages. Additionally, package specific land pattern information available package outline drawings which located following website: package outline drawings also found product datasheets. example land pattern recommendation shown Figure ODFN). main features summarized follows: match with exposed area ODFN case, 0.65mmx1.35mm) match with width ODFN case, 0.3mm) Land length length 0.2mm (extended from package edge) Figure shows reference solder joint shape after ODFN package mounting PCB. Solder joint under exposed intended provide package stand-off height robust assembly.
definition board recommended non-solder-mask-defined (NSMD), though solder-mask-defined (SMD) pads same effective wettable dimension acceptable well. Nickel/Gold surface finish with micron maximum gold thicknesses recommended good solder wettability shelf-life process. surface finish also acceptable, requires appropriate controls shelf life exposure environment. HASL solder plated finishes must used these products.
Solder Stencil
Either 0.100mm 0.125mm thick stainless steel stencil recommended. stencil should laser-cut followed electro-polish (chemical finishing recommended), alternatively additive build-up stencil used. Higher reliability board obtained increased solder paste volumes. However, this needs controlled, solder bridging occur when solder paste excessive. highly recommended solder exposed package corresponding landing PCB. same time, excessive solder under exposed area lead open solder joints under functional pins excess
SENSOR
FILLET FORM DEPENDING OXIDATION TRIMMED EDGE.
FIGURE ODFN PACKAGE WITH REFERENCE SOLDER JOINT SHAPE
TB466.1 March 2008
Technical Brief
stand-off created central pad. Therefore, important balance openings pins opening exposed area. optimal value center considered solder paste coverage under exposed area.
Sensor Location Optics Design
general, package body center does coincide with center light sensor. shown Figure (top), sensor location (green area part offset from geometric center location sensor itself specific product question, therefore should obtained from product datasheet. Figure shows example sensor location description. this example, sensor area 0.43mmx0.61mm, offset from center 0.25mm. application set-up should designed lead light center sensor area center package. other hand, sensor surface height always located 0.28 ±0.10mm below surface package. Solder joint package height (0.7mm) should also considered calculating sensor surface height from surface.
ISL29001 ODFN) VIEW
Solder Paste
package itself lead-free, compatible with both eutectic tin/lead lead-free tin/silver/copper solders. These packages have been qualified +240°C maximum temperature reflow profile eutectic solder, +260°C maximum temperature reflow profile lead-free solder. Solder paste with "no-clean" flux "type "type solder particle size distribution recommended.
Reflow Profile
Direct infrared (IR) heating these packages should done damage part. Pure convection reflow these parts recommended. Typical reflow profiles Jedec criteria recommended eutectic Sn/Pb lead-free Sn/Ag/Cu solders. Peak temperature eutectic Sn/Pb profile exceed +235°C lead-free profile exceed +260°C respectively. ODFN packages have been qualified maximum reflow temperature +260°C ODFN packages have been qualified maximum reflow temperature +260°C.
0.25mm CENTER PHOTODIODE
Visual Inspection
0.61mm
Visual inspection solder joints should done verify that there solder bridging between pads, that solder joint "bright-and-shiny" (lead-free appears 'dull' compared SnPb), that package tilted off-center with respect land pattern. solder fillet edge package leads requirement, fact form all. Hand solder touch-up recommended excessive heat from nozzle soldering irons damage transparent mold compound.
REXT
0.43mm
FIGURE SENSOR LOCATION DESCRIPTION EXAMPLE ISL29001 WITH ODFN
Moisture Sensitivity Bake Conditions
ODFN Lead packages have been qualified JEDEC moisture sensitivity level (MSL4) both +240°C +260°C solder reflow profiles. properties clear mold compound such that moisture saturation occurs less than hours. Therefore, important control exposure time once moisture protection seal broken. Figure recommended that ODFN components baked exposure time exceeds hours prior board mounting. recommended baking condition +110°C hours. lower than typical usual +125°C bake condition should used. bake temperature higher than +110°C result discoloration clear molding compound. Figure
Part ODFN Specific Application Guidelines
primary function ambient light sensor package allow transmission light from exterior light sensing while same time serving mechanical protection transparency requirement does allow conventional filler loadings means controlling mechanical properties mold compound (such coefficient thermal expansion (CTE), modulus, glass transition temperature (Tg), moisture absorption, moisture sensitivity). such, clear epoxy higher than conventional black epoxy with fillers, lower modulus, lower following sections outline important features ODFN product, that need understood proper application product.
TB466.1 March 2008
Technical Brief
0.35 0.30 MOISTURE GAIN 0.25 0.24 0.24 0.20 0.15 0.10 0.08 0.05 0.00 0.00 0.11 0.17 0.18 0.20 0.27 0.25 MOISTURE LOSS 0.30 0.29 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 PRECOND HOURS BAKE HOURS
0.28 0.28
FIGURE MOISTURE ABSORPTION CURVE UNDER +30°C/60% RELATIVE HUMIDITY CONDITIONS
FIGURE MOISTURE DESORPTION CURVE +110°C
FIGURE ODFN MOUNTED WITH PREFERRED REFLOW CONDITION (LEFT), PART THAT EXCESSIVE TEMPERATURE EXPOSURE (RIGHT)
Pick-and-Place With Clear Package
These optically clear packages suitable vision-based placement machines. machines without "auto vision recognition", necessary manually adjust machine sensitivity avoid recognition errors. These packages recommended placed with mechanical centering placement machines.
Marking Traceability
ODFN products have conventional product marking package, since marking characters package affect impede light transmittance light sensor. However, Intersil able keep product traceability marking matrix exposed area under plating using markings made bottom package (one both methods used tracked Intersil). case returned product, Intersil process part trace assembly information. case failure, failed parts should shipped Intersil preferably without removing parts from PCB. Parts that still assembled during failure analysis best achieving good results.
Rework Associated Risks
Applications with ODFN products reworked using reflow profile that closely matches production reflow profile described earlier section. ODFN packages should exposed >+260°C during rework operation. reuse same ODFN product upon removal from PCB. Excessive heating clear mold compound result change color mold compound shown Figure also compromise wire bond integrity high coefficient thermal expansion mold compound material.
Intersil Corporation reserves right make changes circuit design, software and/or specifications time without notice. Accordingly, reader cautioned verify that Application Note Technical Brief current before proceeding.
information regarding Intersil Corporation products, www.intersil.com
TB466.1 March 2008

Technical Brief March 2008 TB466.1 Optical Dual-in-line Flat No-l

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