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Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Packages LQFP

Q48.7x7A (JEDEC MS-026BBC ISSUE B)

Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Packages (LQFP)
Q48.7x7A (JEDEC MS-026BBC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE INCHES SYMBOL A A1 A2 MIN 0.002 0.054 0.007 0.007 0.350 0.272 0.350 0.272 0.018 48 0.020 BSC MAX 0.062 0.005 0.057 0.010 0.009 0.358 0.280 0.358 0.280 0.029 MILLIMETERS MIN 0.05 1.35 0.17 0.17 8.90 6.90 8.90 6.90 0.45 48 0.50 BSC MAX 1.60 0.15 1.45 0.27 0.23 9.10 7.10 9.10 7.10 0.75 NOTES 6 3 4, 5 3 4, 5 7 Rev. 2 1 / 99 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- .
0.08 A-B S 0.003 M C D S b b1 0.09 / 0.16 0.004 / 0.006 BASE METAL WITH PLATING
-AE E1
PIN 1 SEATING A PLANE 0.08 0.003 -C-
4. Dimensions D1 and E1 to be determined at datum plane -H- . 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). 7. "N" is the number of terminal positions.
11o-13o 0.020 0.008 MIN 0o MIN GAGE PLANE L 0o-7o 0.25 0.010 11o-13o A2 A1