Quality assurance reliability Quality Assurance Measures (Japan I

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Quality assurance reliability Quality Assurance Measures (Japan I

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Quality assurance reliability
Quality assurance reliability
Quality Assurance Measures (Japan Industrial Standards) defines reliability "the ability item perform required function under given conditions specified time". This expressed quantitatively failure rate reliability level. failure rate electronic components generally takes form bathtub curve (Fig.1). However, nature semiconductor devices such transistors experience wear, therefore failure rate takes form curve below, with reliability determined rate initial failures random failures. Initial failures manifestation hidden defects manufacturing line. ROHM endeavors hold down rate initial failures means quality control line control, well 100% screening. Random failures regarded indicative characteristic reliability product, largely affected derating level, usage environment, circuit conditions other usage conditions.
Failure rate Initial failure rate Random failure rate
Overview quality assurance measures Rohm's quality assurance measures implemented primarily Quality Control Department quality control groups each manufacturing department. members take part controlling, maintaining, improving manufacturing lines centering long short term themes. addition, quality assurance carried each line members that line, with successive line being regarded their "customer". Internal standardization pursued company-wide basis, work performed strictly according written standards. Line performance determined statistical process control method line managed accordingly. important eliminate initial failures that reliability determined only random failure rate. ROHM carries 100% screening products. Control testing performed long term reliability assurance, measures carried improve understanding reliability levels. require suppliers ensure quality materials they deliver. have each supplier sign quality assurance contract stating that materials purchase must have passed authorized inspection, with supplier testing materials based standards.
Reception materials Diffusion Post-diffusion inspection Depositing Post-depositing inspection Inspection characteristics surface Scribing Pellet surface inspection wire bonding Bonding inspection Molding Measurement pieces Packaging Outgoing inspection Shipment Control temperature, pressure time Control temperature, pressure strength Control dimensions appearance Control film thickness, dimensions, appearance thickness resistance
Wear failure period
Time
Fig.
Control film thickness, dimensions appearance
Quality assurance testing
Fig.2
Rev.B
Quality assurance reliability
Overview manufacturing process Reliability primary concerns manufacturing semiconductor devices. perform multiple quality authorization tests from beginning development through beginning mass production, only bring those products which have passed tests into mass production. After mass production begins, continue carry aforementioned quality assurance measures. Reliability assurance testing Reliability testing conducted examine quality manufactured products, their durability over time, their physical chemical durability. Reliability testing also conducted ascertain design levels failure limit levels. variety external stresses affect reliability, Including functional stresses such electrical mechanical stresses, environmental stresses such temperature, humidity vibration, skill user, service systems. conduct life environmental tests involving simulations determine stress resulting from practical use. Furthermore, sufficient reliability testing simply determine standard acceptance rejection, also must examine evaluate changes characteristics over time characteristic distributions. order improve assure reliability products, ROHM conducts reliability forecasts performs following quality assurance tests based Japanese Industrial Standards.
Reliability design process technology ROHM made significant advances toward higher reliability areas transistor design, process technology assembly technology. These advances have been made though control technology, improvement equipment precision, introduction technology. Stabilization element surfaces type transistor failure deterioration surface element leading lowered isolation voltage hFE. ROHM carries following measures prevent this problem. Over-passivation protect aluminum wires prevent external contamination. This over-passivation uses nitride layer which achieves reliability surpassing that previous phosphorus glass processes. Clean processes carry measures increase material purity, enhance cleaning techniques, improve wafer handling, prevent dust stages including assembly process. Process control automated measurement protective layer control, including such factors film thickness, refractive indices, control mobile ions based method. Improved reliability assembly process wire bonding processes fully automated, pattern recognition positioning. develop high-performance equipment which superb precision stability. molds based reliability analysis resin materials mold manufacturing, designed attain ideal conditions match material. addition measurement normal temperatures, have also introduced special measurements screen line-break defects surface defects, thereby attaining higher reliability.
Rev.B
Quality assurance reliability
Table1 Quality assurance tests Test Soldering heat resistance Description Sn=4 (H63A) eutectic solder used. Immersed once 260±5°C solder bath point 1.5mm from base terminal 10±1 seconds (for mini-mold types entire product immersed). Left normal temperature least hours after immersion. Specified values mechanical damage. ICBO IEBO |hFE hFE| Darlington devices, Enlarge times verify that solder smoothly coats least immersed surface.
SOLDA Solderability
Sn=4 (H63A) eutectic solder used. Rosin dissolved isopropyl alcohol (25%) used flux. Immersed flux point from base terminal seconds, then immersed 230±5°C solder bath point 1.0mm from body 3±0.5 seconds (for mini-mold types entire product immersed). Left naturally after immersion, then cleaned isopropyl alcohol remove flux. Immersed 100+0 bath five minutes, then within seconds immersed bath five minutes. This repeated times. After final cycle, product left least hours room temperature.
Thermal shock
After leaving TstgMin. minutes, product kept room Temperature cycle temperature minutes, then left TstgMax. minutes. This repeated times. After final cycle, product left room temperature least hours. High-temperature, high-humidity reverse bias Ta=85±30°C RH=85 Voltage applied shown below.
Max.
(Example NPN)
Test time 1000 hours. After test, product left room temperature least hours. Pressure cooker Ta=121°C, 100%RH P=203kPa {2atm} Test time hours (100 hours mini-mold types). After test, product left normal temperature least hours. Apply PCMax. with Ta=25±5°C. above using following circuit.
(Example NPN)
Load life
mechanical damage. ICBO IEBO |hFE hFE| Darlington devices,
Test time 1000 hours. After test, product left normal temperature least hours. HTRB High-temperature reverse bias High temperature C-1TENS Terminal strength (tensile) Ta=125±2°C Test circuit same THB. Test time 1000 hours. After test, product left normal temperature least hours.
Ta=TstgMax. Test time 1000 hours. After test, product left normal temperature least hours. Body product being tested secured, 9.8N (1kgf) load displacement applied axial direction seconds (2.94N (300g) load terminal relative body, damage, looseness. mini-mold types).
Rev.B
Table2 Results transistor reliability tests
Temperature cycle Ta=150±2°C T=1000h (pcs)
Reliability level High-temperature, high-humidity Pressure cooker reverse bias Load life High-temperature reverse bias High temperature
Test
Soldering heat resistance
Thermal shock
Test conditions (pcs)
sec. immersion 260±5°C eutectic solder bath. Ta=85±2°C, RH=85±5% Apply T=1000h
100°C 5min. 5min. Transfer within sec. T=100Cycle (pcs)
Ta=55 25°C t=30 10min. T=200Cycle (pcs)
Ta=121°C, RH=100% P=203kPa {2atm} T=150h [100h] (pcs) 3.47 6.94 6.94 6.94 6.94
Ta=25±5°C Apply PCMax T=1000h (pcs) 6.94 3.47 3.47 6.94
Ta=150±2°C Apply T=1000h (pcs) (pcs) (pcs) 3.47
(pcs) (pcs) 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47
TYPE 2.64 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47
(pcs) 2.64 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47 3.47
(pcs) 3.47 8.49 8.49 8.49 8.49 8.49 8.49 8.49 8.49 8.49 8.49 8.49
3.47 3.47 3.47 8.49
(pcs)
(pcs) (pcs)
2SC4617
General purpose EMT3 2.64 2.64 2.64 2.64 2.64 2.64 2.64 2.64 2.64
2.08
2SA1774 2.64
General purpose EMT3
2.08
2SC4081
General purpose UMT3
2.08 3.47
2SA1576A
General purpose UMT3
3.47 6.94
3.47
3.47
2.08
2SC2412K
General purpose SMT3
2.08
2SA1037AK
General purpose SMT3
2.08
DTC124EKA
Built-in resistors SMT3
2.08
DTA124EKA
Built-in resistors SMT3
6.94
3.47
3.47 6.94
6.94
3.47
2.08 3.47
2SD1664
Mini-power MPT3
3.47
2.08
2SB1132
Mini-power MPT3
2.08 6.94
2SB1184
Power
3.47
6.94
3.47
3.47
2.08
2SD1760
Quality assurance reliability
Rev.B
Power
2.08
Appendix
Notes
technical content pages this document reproduced form transmitted means without prior permission ROHM CO.,LTD. contents described herein subject change without notice. specifications product described this document reference only. Upon actual use, therefore, please request that specifications separately delivered. Application circuit diagrams circuit constants contained herein shown examples standard operation. Please careful attention peripheral conditions when designing circuits deciding upon circuit constants set. data, including, limited application circuit diagrams information, described herein intended only illustrations such devices specifications such devices. ROHM CO.,LTD. disclaims warranty that such devices shall free from infringement third party's intellectual property rights other proprietary rights, further, assumes liability whatsoever nature event such infringement, arising from connected with related such devices. Upon sale such devices, other than buyer's right such devices itself, resell otherwise dispose same, express implied right license practice commercially exploit intellectual property rights other proprietary rights owned controlled ROHM CO., LTD. granted such buyer. Products listed this document antiradiation design.
products listed this document designed used with ordinary electronic equipment devices (such audio visual equipment, office-automation equipment, communications devices, electrical appliances electronic toys). Should intend these products with equipment devices which require extremely high level reliability malfunction with would directly endanger human life (such medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers other safety devices), please sure consult with sales representative advance. About Export Control Order Japan Products described herein objects controlled goods Annex (Item Export Trade Control Order Japan. case export from Japan, please confirm applies "objective" criteria "informed" MITI clause) basis "catch controls Non-Proliferation Weapons Mass Destruction.
Appendix1-Rev1.1

Quality assurance reliability Quality Assurance Measures (Japan I

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