TABLE PLAN TABLE DESIGN VERIFICATION PLAN REPORT ENGINEERING EVALUATIO

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TABLE PLAN TABLE DESIGN VERIFICATION PLAN REPORT ENGINEERING EVALUATIO

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RESISTOR ARRAY DESIGN VALIDATION TEST PLAN DESIGN VERIFICATION PLAN REPORT ASSEMBLY PROCESS COMPONENTCLASSIFICATION.5 THERMAL CYCLE TESTING.6 DEVICE DETAILS TEST BOARD DETAILS Solder Paste Type Stencil Thickness Aperture Opening.7 Measured paste dimensions.7 Board assembly steps Reflow Profile used.8 TEST DETAILS FAILURE CRITERIA TEST RESULTS 1.00 pitch Groups.9 1.27 pitch Groups. BOARD FLEX TESTING. BALL-SHEAR TESTING. BALL CO-PLANARITY TESTING
TABLE PLAN TABLE DESIGN VERIFICATION PLAN REPORT ENGINEERING EVALUATIONS TABLE TEST BOARD MEASURED CTE.6 TABLE STENCIL THICKNESS APERTURE OPENING TABLE 1.0MM MEASURED PASTE TEST RESULTS TABLE 1.27MM MEASURED PASTE TEST RESULTS TABLE SHAPE CHARACTERISTIC LIFE PITCH GROUPS.9 TABLE SHAPE CHARACTERISTIC LIFE 1.27 PITCH GROUPS TABLE BOARD FLEX TEST DATA.
CORP 2001, RIGHTS RESERVED.
PAGE
REV. 2/21/02
RELIABILITY TEST DATA
Table below lists tests performed part Design Validation Test Plan. Table Plan
Test Name Thermal Cycling (Joint Integrity) Thermal Cycling (Resistors) Resistance Change 0.50% Standard Method JESD22A104-B MIL-STD202F, Method 107G MIL-STD202F, Method 106F 1862 MIL-STD202F, Method 108A MIL-STD202, Method 210D MIL-STD202F, Method 213B MIL-STD202F, Method MIL-STD202F, Method 215J Test Condition Soak Mode Minute Dwell cycles, -65° +125° Test Description >66% part failure rate cycles, +100°
Short Time Overload Moisture Resistance
0.50% 0.50%
rated voltage, sec,(50V Max.) watt max. package, 0.06watt/resistor hours, rated load, -10° watt max. package, 0.04watt @70C
Load Humidity High Temp Exposure Load Life
1.00% 1.00% 1.00%
1,000 hours, rated load, 85-92% hours, load 2,000 hours rated load with forced circulation.
Resistance Solder Heat
0.25%
seconds dwell 218°
Mechanical Shock
0.25%
100g, msec., shocks each plane
Temp Storage Temperature Operation
0.25% 0.25% ppm/°
hours -65° load hours -65° full load -55° +125°
Flammability Resistance Solvents
94V-0
CORP 2001, RIGHTS RESERVED.
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RELIABILITY TEST DATA
Table DESIGN VERIFICATION PLAN REPORT ENGINEERING EVALUATIONS
SYSTEM: ASSEMBY TEST REPORT RESISTANCE WORK SHEET RESISTORS/PART TEST NAME/SOURCE Thermal Shock/ Thermal Cycle (Resistors) Short Time Overload Moisture Resistance Load Humidity ACCEPT. CRITERIA Max. Delta 0.5% Max. Delta 0.5% Delta =0.5% Min. -0.009% Avg. 0.004% Max. 0.014% Min. -0.043% Avg. -0.014% Max. 0.006% Min. -0.035% Avg. -0.009% Max. 0.029% Min. -0.017% Avg. -0.008% Max. 0.082% Min. -0.007% Avg. -0.019% Max. 0.082% Min. 0.008% Avg. 0.038% Max. 0.104% Min. -0.015% Avg. 0.002% Max. 0.023% Min. 0.002% Avg. 0.024% Max. 0.058% Min. -0.007% Avg. 0.027% Max. 0.086% Min. -0.030% Avg. -0.007% Max. 0.018% Min. -0.049% Avg. -0.029% Max. 0.005% Min. -0.044% Avg. -0.024% Max. 0.014% Min. -0.041% Avg. -0.014% Max. 0.025% Min. -0.043% Avg. -0.018% Max. 0.030% Min. -0.039% Avg. -0.024% TEST RESULTS PROGRAM: BL21705 4M-757-4090E-11D DATE OPEN: 9/6/00 SAMPLE SIZE REQ'D parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors PART N1-N10 START DATE 8/23/00 COMP. DATE 8/24/00 PASS/ FAIL Pass REMARKS DESIGN ENG.: Cooper
N1-N10
8/24/00
9/8/00
Pass
8/23/00
9/5/00
Pass
(0.9V Resistor) Delta =1.0% Delta =1.0% Delta =1.0% 8/23/00 9/5/00 Pass
8/23/00
9/15/00
Pass
1000
8/23/00
10/6/00
Pass
Load Humidity BL21731 (0.9V Resistor) Delta =1.0% Delta =1.0% Delta =1.0% Delta =1.0% N11N20 8/23/00 9/5/00 Pass
8/23/00
10/11/00
Pass
1000
8/23/00
11/1/00
Pass
High Temp Exposure Load Life
8/23/00
9/26/00
Pass
Delta =1.0% Delta =1.0% Delta =1.0% Delta =1.0% Delta =0.25%
N61N70 N61N70 N61N70 N61N70 N11N20
8/23/00
9/18/00
Pass
8/23/00
9/29/00
Pass
1000
8/23/00
10/20/00
Pass
2000
8/23/00
12/1/00
Pass
Resistance Solder Process
9/28/00
10/2/00
Pass
CORP 2001, RIGHTS RESERVED.
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REV. 2/21/02
RELIABILITY TEST DATA
Table DESIGN VERIFICATION PLAN REPORT ENGINEERING EVALUATIONS
SYSTEM: ASSEMBY TEST REPORT RESISTANCE WORK SHEET RESISTORS/PART TEST NAME/SOURCE Heat Mechanical Shock Delta =0.25% Delta =0.25% Delta =0.25% Delta =200 Delta =200 ACCEPT. CRITERIA Max. -0.110% Min. -0.038% Avg. -0.014% Max. 0.005% Min. -0.014% Avg. 0.000% Max. 0.020% Min. -0.018% Avg. -0.004% Max. 0.012% Min. PPM/C Avg. PPM/C Max. PPM/C Min. PPM/C Avg. PPM/C Max. PPM/C TEST RESULTS PROGRAM: BL21705 4M-757-4090E-11D DATE OPEN: 9/6/00 SAMPLE SIZE REQ'D part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part parts with resistors part N21N30 N11N20 N1-N10 8/23/00 9/11/00 Pass PART START DATE COMP. DATE PASS/ FAIL REMARKS DESIGN ENG.: Cooper
Temp Storage Temp Operation Cold
9/26/00
9/28/00
Pass
9/11/00
9/14/00
Pass
N1-N10
9/11/00
9/11/00
Pass
N1-N10
9/11/00
9/11/00
Pass
Flammability
N31N40 N31N40
9/27/00
9/27/00
Pass
Solvent Resistance
physical damage
9/22/00
9/22/00
Pass
These components have been evaluated IPC-9504 (June 1998) component classification 111. Moisture Sensitivity, LEVEL unlimited Soldering Process, LEVEL1 IR/Convection Reflow 10-40 seconds. Chemical Compatibility, LEVEL1.
CORP 2001, RIGHTS RESERVED.
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REV. 2/21/02
RELIABILITY TEST DATA
device Ceramic package. Solder ball alloy 10/90 Sn/Pb; ball diameter 0.030" 1.27 pitch packages 0.025" diameter pitch packages. package substrate alumina solid ceramic with filled vias. Package properties: package 10-6 in/in/° direction package 10-6 in/in/° direction Young's Modulus
Material board with 3/8-ounce copper. Thickness 0.062 inch. Number layers one. Size inch inch. Solder designed size, 1.00mm 0.020 inch diameter (actual 0.018 inch diameter) 1.27mm 0.025 inch diameter (actual 0.022 inch diameter) type groups non-solder mask defined style (NSMD) Designed solder mask clearance 0.001 inch. Measured clearance -0.001 0.002 inch. supplier applied solder mask over exposed trace. Trace designed width 0.010 inch space 0.029 inch. Measured width space 0.010 inch width 0.028 inch spaces. Surface finish Solder Level (HASL) 1-ounce copper. Measured (above below
Table Test Board Measured
Sample Orientation
below (mm/mm 14.1 10-6 10-5
above (mm/mm 12.0 10-6 25.0 10-5
135.7 135.2 135.2
thermo-mechanical analyzer (TMA) used perform analysis.
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REV. 2/21/02
RELIABILITY TEST DATA
Water soluble paste, mildly activated. Indium WMA-SMQ paste solids version using -325 +500 mesh size spherical powder 63/37 Sn/Pb alloy. Type
Table Stencil Thickness Aperture Opening
Pitch 1.27mm 1.00mm Stencil Thickness .006" .006" Aperture Opening with land (.025") with land (.020")
Note: Stencil aperture dependent solids loading printing conditions including squeegee type squeegee speed.
Table 1.0mm Measured Paste Test Results
Measured Paste Dimensions Theoretical Avg. Range Thickness (mils) 4.08 3.28 4.57 1.29 0.27 Volume (mils^3) 1,884 1,141 1,347 Area (mils^2)
Table 1.27mm Measured Paste Test Results
Measured Paste Dimensions Theoretical Avg. Range Thickness (mils) 3.83 3.33 4.28 0.95 0.20 Volume (mils^3) 2,944 1,380 1,062 1,695 Area (mils^2)
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REV. 2/21/02
RELIABILITY TEST DATA
Reflow Profile (per IPC-9504, Level
device '240
Batch clean (resistivity requirement: Mohm)
Stencil solder paste Place parts placement machine Load part into nozzle Place Reflow IPC-9504, Level profile.
Time
Sample size: 32-piece minimum group (1mm 1.27mm) tested. Temperature cycle condition temperature profile plot measured board surface Extended thermal cycle test conditions: temperature: +0/-5 High temperature: -0/+5 Dwell time High temperature: minutes Environment transition time 10-15 seconds, transition time minutes. Dwell time temperature: minutes.
Temperature Time (minutes) T-device T-environment
Threshold resistance nominal plus 10%. resistance readings were monitored with Cable Scan Series Each part monitored every minute seconds. testing done double zone chamber.
Open circuit (i.e. resistance reading >100 Ohm) instance measured resistance value exceeding threshold resistance value (R>100 Ohm) shall considered OPEN. OPEN followed additional OPENS within time OPEN shall considered FAILURE TIME FAILURE shall time which OPEN occurred. This avoid measurement anomaly noise. case multiple resistors device, failure resistor within device shall considered device failure.
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PAGE
REV. 2/21/02
RELIABILITY TEST DATA
Table Shape Characteristic Life pitch groups
Array/ Rank Notes: "+10K" units which passed 10,000 cycles were taken test. This data contains premature failures caused improper assembly construction process attaching part PCB. result, data indicates worse result than attributed construction. Some failure analysis been performed these parts been completed. 7,747 9,970 +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K 5,251 6,110 6,447 6,534 6,598 6,669 6,686 7,089 7,099 7,112 7,146 7,294 7,304 7,322 7,393 7,496 7,508 7,553 7,554 7,625 7,722 8,051 +10K +10K +10K +10K +10K +10K +10K +10K +10K +10K 3,466 4,776 5,091 5,234 5,815 5,928 6,280 6,609 6,784 6,817 6,895 7,203 7,383 7,864 7,961 8,209 8,423 8,575 9,111 9,225 9,352 9,522 9,761 9,914 9,937 10,069 10,070 +10K +10K +10K +10K +10K 3,453 3,457 4,296 4,297 4,297 4,300 4,495 4,775 4,776 5,386 5,479 5,491 5,611 5,820 6,078 6,086 6,192 6,200 6,296 6,347 6,588 6,668 6,678 6,774 6,875 7,037 7,109 7,513 +10K +10K +10K +10K 4,952 4,991 6,241 6,764 7,096 7,438 7,462 7,735 7,825 7,835 7,988 8,008 8,044 8,063 8,263 8,287 8,454 8,738 8,804 8,807 8,822 8,997 9,092 9,307 9,354 9,400 +10K +10K +10K +10K +10K +10K 4,403 5,216 5,366 5,930 5,979 6,477 6,899 6,935 7,016 7,327 7,357 7,554 7,567 7,690 7,706 7,849 8,008 8,115 8,200 8,330 8,363 8,787 8,808 +10K +10K +10K +10K +10K +10K +10K +10K +10K 3,449 3,772 3,792 4,296 4,296 4,296 4,296 4,296 4,296 4,297 4,297 4,297 4,297 4,337 4,452 4,474 4,553 4,776 4,783 4,789 5,073 5,225 6,070 6,506 6,934 6,934 +10K +10K +10K +10K +10K +10K 3x12 3x15 4x10 4x16
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RELIABILITY TEST DATA
4x16 Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
4x10 Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
-0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5
(1/(1-MR)))
-1.0 -2.0 -3.0 -4.0 -5.0
Characteristic Life (alpha) 5559 Beta (slope) 4.98
(Cycles)
(1/(1-MR)))
8.00
8.20
8.40
8.60
8.80
9.00
8.30
8.40
8.50
8.60
Characteristic Life (alpha) 8532 Beta (slope) 5.75
(Cycles)
8.70
8.80
Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
3x15 Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
8.10
8.20
8.30
8.40
8.50
8.60
8.70
8.80
8.90
-0.5
(1/(1-MR)))
-1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5
(1/(1-MR)))
-1.0
-2.0
-3.0
Characteristic Life (alpha) 9055 Beta (slope) 6.23
(Cycles)
-4.0
Characteristic Life (alpha) 6471 Beta (slope) 5.00
(Cycles)
-5.0
Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
8.90
8.95
9.00
9.05
9.10
9.15
9.20
-2.2
8.50 8.55 8.60 8.65 8.70 8.75 8.80 8.85 8.90 8.95 9.00 9.05
-2.4 -2.6 -2.8 -3.0 -3.2 -3.4
(1/(1-MR)))
-1.0
-2.0
-3.0
(1/(1-MR)))
Characteristic Life (alpha) 22541 Beta (slope) 3.58
-4.0
Characteristic Life (alpha) 7814 Beta (slope) 10.64
(Cycles)
-3.6 -3.8 -4.0
(Cycles)
-5.0
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9.25
-2.0
9.00
8.90
9.00
9.10
9.20
RELIABILITY TEST DATA
Table Shape Characteristic Life 1.27 pitch groups
Array Notes: "+6K" units which passed 6,000 cycles were taken test Same 1.0mm Pitch Note 3x12 4,711 4,711 4,927 5,410 4x16 4,495 4,495 4,783 4,855 5,059 5,194 5,330 5,482 5,626 5,626 5,698
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REV. 2/21/02
RELIABILITY TEST DATA
4x16 1.27mm Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
3x12 1.27mm Weibull Line
(1/(1-MR))) Predicted (1/(1-MR)))
8.35 8.40 8.45 8.50 8.55 8.60 8.65 8.70 -0.5 -1.0
-1.5 8.44 8.46 8.48 8.50 8.52 8.54 8.56 8.58 8.60 8.62
-2.0
(1/(1-MR)))
(1/(1-MR)))
-1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5
-2.5
-3.0
Characteristic Life (alpha) 6386 Beta (slope) 9.57
(Cycles)
Characteristic Life (alpha) 6730 Beta (slope) 9.09
-3.5
(Cycles)
-4.0
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REV. 2/21/02
RELIABILITY TEST DATA
Board Flex Testing JISC 5202-1990 Failures occurred unit deflected point where audible snap heard. Visual examination confirmed ceramic failure.
10.00 9.00 8.00 Deflection (mm) 7.00 6.00 5.00 4.00 3.00 2.00 1.00 3.00 6.00 9.00 12.00 15.00 18.00 21.00
Array Size (Length
Table Board Flex Test Data
Ceramic Length 3.81 7.62 8.00 8.00 9.00 10.16 11.42 12.00 15.24 16.00 20.32 1.27 1.27 1.27 1.27 1.27 1.27 3x12 3x12 4x16 4x16 Pitch Array Size 10.00 4.93 5.08 4.17 3.68 3.63 2.79 2.41 2.03 2.54 1.75 3.56 3.30 2.79 2.79 2.79 2.79 2.54 3.30 5.08 4.95 3.68 4.45 4.57 3.91 5.00 4.57 3.81 4.57 3.81 3.68 Deflection point audible snap
Note: Data Sorted Ceramic Length (all dimensions
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REV. 2/21/02
RELIABILITY TEST DATA
Ball-Shear Testing JEDEC JESD22-B117 Shear (ram) speed 100um/second. Shear height ball diameter.
1.00m Pitch naged
requency
1019 1040 1061 1082 1104
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REV. 2/21/02
RELIABILITY TEST DATA
Ball Co-Planarity JEDEC Standards 0.10mm (0.004 inches) Instrument Nikon Note Limits one-sided, therefore 2.062
Vanguard Coplanarity Data
Coplanarity Quantiles maximum 100.0% 99.5% 97.5% 90.0% quartile median quartile 75.0% 50.0% 25.0% 10.0% 2.5% minimum 0.5% 0.0% 0.06350 0.06350 0.05618 0.05370 0.04305 0.03645 0.02980 0.02571 0.02081 0.01420 0.01420 Moments Mean Error Mean Upper Mean Lower Mean Weights Variance Skewness Kurtosis 0.03757 0.01009 0.00113 0.03981 0.03532 80.00000 80.00000 3.00540 0.00010 0.30012 -0.34628 26.87030 Capabilit Analy Specif ication Lower Spec Limit Upper Spec Limit Spec Target Sigma Capabilit Index 2.062 2.062 0.010094 Value Percent %Below %Abov Actual 0.000 Normal 0.000
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TABLE PLAN TABLE DESIGN VERIFICATION PLAN REPORT ENGINEERING EVALUATIO

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