Ceramic Chip Capacitors Chip Capacitors General Description Order
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Multilayer Ceramic Chip Capacitor
Ceramic Chip Capacitors
Chip Capacitors General Description Order Part Number Explanation (NP0) Dielectric General Specifications Typical Characteristic Curves Capacitance Range Dielectric General Specifications Typical Characteristic Curves Capacitance Range Dielectric General Specifications Typical Characteristic Curves Capacitance Range Dielectric General Specifications Typical Characteristic Curves Capacitance Range Profile Chips Dielectric High Voltage Chips 500V 5000V Applications General Specifications Mechanical Environmental MIL-C-55681/Chips Part Number Example Military Part Number Identification (CDR01 thru CDR06) Military Part Number Identification (CDR31 thru CDR35) Military Part Number Identification (CDR31) Military Part Number Identification (CDR32) Military Part Number Identification (CDR33/34/35) European Version CECC 101-801 Chips Packaging Chip Components Automatic Insertion Packaging Embossed Carrier Configuration 12mm Tape 12mm Tape Punched Carrier Configuration 12mm Tape 12mm Tape Bulk Case Packaging Surface Mounting Guide
General Description
Basic Construction multilayer ceramic (MLC) capacitor monolithic block ceramic containing sets offset, interleaved planar electrodes that extend opposite surfaces ceramic dielectric. This simple structure requires considerable amount sophistication, both material manufacture, produce quality quantities needed today's electronic equipment.
Ceramic Layer
Electrode Terminations
Terminated Edge
Terminated Edge
Margin
Electrodes
Formulations Multilayer ceramic capacitors available both Class Class formulations. Temperature compensating formulation Class temperature stable general application formulations classified Class Class Class capacitors temperature compensating capacitors usually made from mixtures titanates where barium titanate normally major part mix. They have predictable temperature coefficients general, have aging characteristic. Thus they most stable capacitor available. Normally T.C.s multilayer ceramic capacitors Class temperature compensating capacitors (negative-positive ppm/°C).
Class Class capacitors "ferro electric" vary capacitance value under influence environmental electrical operating conditions. Class capacitors affected temperature, voltage (both DC), frequency time. Temperature effects Class ceramic capacitors exhibited non-linear capacitance changes with temperature. most common temperature stable formulation MLCs while most common general application formulations. additional information performance changes with operating conditions consult AVX's software, SpiCap.
General Description
Capacitance Change Percent
Effects Voltage Variations voltage have little affect Class dielectric does effect capacitance dissipation factor Class dielectrics. application voltage reduces both capacitance dissipation factor while application voltage within reasonable range tends increase both capacitance dissipation factor readings. high enough voltage applied, eventually will reduce capacitance just voltage will. Figure shows effects voltage.
Cap. Change D.C. Volts T.C.
-2.5 -7.5 Percent Rated Volts 100%
Cap. Change A.C. Volts T.C.
Capacitance Change Percent
Figure
Capacitance Change Percent
Typical Cap. Change Temperature T.C.
OVDC +105 +125 RVDC
12.5 37.5 Volts
Figure
Capacitor specifications specify voltage which measure (normally VAC) application wrong voltage cause spurious readings. Figure gives voltage coefficient dissipation factor various voltages kilohertz. Applications different frequencies will affect percentage changes versus voltages.
Temperature Degrees Centigrade
Figure
D.F. A.C. Measurement Volts T.C.
10.0
Curve Rated Capacitor Curve Rated Capacitor Curve Rated Capacitor
Curve Curve
Curve
Measurement Volts
Figure
effect application voltage shown Figure voltage coefficient more pronounced higher dielectrics. These figures shown room temperature conditions. combination characteristic known voltage temperature limits which shows effects rated voltage over operating temperature range shown Figure military characteristic.
Effects Time Class ceramic capacitors change capacitance dissipation factor with time well temperature, voltage frequency. This change with time known aging. Aging caused gradual re-alignment crystalline structure ceramic produces exponential loss capacitance decrease dissipation factor versus time. typical curve aging rate semistable ceramics shown Figure Class ceramic capacitor that been sitting shelf period time, heated above curie point, (125°C hours 150°C hour will suffice) part will de-age return initial capacitance dissipation factor readings. Because capacitance changes rapidly, immediately after de-aging, basic capacitance measurements normally referred time period sometime after de-aging process. Various manufacturers different time bases most popular twenty-four hours after "last heat." Change aging curve caused application voltage other stresses. possible changes capacitance deaging heating unit explain capacitance changes allowed after test, such temperature cycling, moisture resistance, etc., specs. application high voltages such dielectric withstanding voltages also tends
Dissipation Factor Percent
General Description
de-age capacitors re-reading capacitance after hours allowed military specifications after dielectric strength tests have been performed. Effects Mechanical Stress High dielectric ceramic capacitors exhibit some level piezoelectric reactions under mechanical stress. general statement, piezoelectric output higher, higher dielectric constant ceramic. desirable investigate this effect before using high dielectrics coupling capacitors extremely level applications. Reliability Historically ceramic capacitors have been most reliable types capacitors today. approximate formula reliability ceramic capacitor
Typical Curve Aging Rate Dielectric
+1.5
Capacitance Change Percent
-1.5
-3.0 -4.5
-6.0 -7.5 1000 10,000 100,000 Hours
where operating life test life test voltage operating voltage
test temperature operating temperature text
Figure
Characteristic
Max. Aging Rate %/Decade None
Historically ceramic capacitors exponent been considered exponent temperature effects typically tends about capacitor component which capable storing electrical energy. consists conductive plates (electrodes) separated insulating material which called dielectric. typical formula determining capacitance
Effects Frequency Frequency affects capacitance impedance characteristics capacitors. This effect much more pronounced high dielectric constant ceramic formulation that formulations. AVX's SpiCap software generates impedance, ESR, series inductance, series resonant frequency capacitance functions frequency, temperature bias standard chip sizes styles. available free from AVX.
.224
capacitance (picofarads) dielectric constant (Vacuum area square inches separation between plates inches (thickness dielectric) .224 conversion constant (.0884 metric system Capacitance standard unit capacitance farad. capacitor capacitance farad when coulomb charges volt. farad very large unit most capacitors have values micro (10-6), nano (10-9) pico (10-12) farad level. Dielectric Constant formula capacitance given above dielectric constant vacuum arbitrarily chosen number Dielectric constants other materials then compared dielectric constant vacuum. Dielectric Thickness Capacitance indirectly proportional separation between electrodes. Lower voltage requirements mean thinner dielectrics greater capacitance volume. Area Capacitance directly proportional area electrodes. Since other variables equation usually performance desired, area easiest parameter modify obtain specific capacitance within material group.
General Description
Energy Stored energy which stored capacitor given formula:
(Ideal) (Actual)
1/2CV2
energy joules (watts-sec) applied voltage capacitance farads Potential Change capacitor reactive component which reacts against change potential across This shown equation linear charge capacitor:
Loss Angle Phase Angle
ideal
where
practice current leads voltage some other phase angle series resistance complement this angle called loss angle and: Power Factor (P.F.) Sine Dissipation Factor (D.F.) small values sine essentially equal which common interchangeability terms industry. Equivalent Series Resistance term E.S.R. Equivalent Series Resistance combines losses both series parallel capacitor given frequency that equivalent circuit reduced simple series connection.
Current Capacitance dV/dt Slope voltage transition across capacitor Thus infinite current would required instantly change potential across capacitor. amount current capacitor "sink" determined above equation. Equivalent Circuit capacitor, practical device, exhibits only capacitance also resistance inductance. simplified schematic equivalent circuit Capacitance Inductance Parallel Resistance Series Resistance
E.S.R.
Reactance Since insulation resistance (Rp) normally very high, total impedance capacitor where Total Impedance
Dissipation Factor DF/PF capacitor tells what percent apparent power input will turn heat capacitor. Dissipation Factor E.S.R. (E.S.R.) watts loss are: Watts loss fCV2 (D.F.) Very values dissipation factor expressed their reciprocal convenience. These called Quality factor capacitors. Parasitic Inductance parasitic inductance capacitors becoming more more important decoupling today's high speed digital systems. relationship between inductance ripple voltage induced voltage line seen from simple inductance equation:
Series Resistance Capacitive Reactance Inductive Reactance
variation capacitor's impedance with frequency determines effectiveness many applications. Phase Angle Power Factor Dissipation Factor often confused since they both measures loss capacitor under application often almost identical value. "perfect" capacitor current capacitor will lead voltage 90°.
General Description
seen current microprocessors high A/ns, 10A/ns. A/ns, 100pH parasitic inductance cause voltage spike 30mV. While this does sound very drastic, with microprocessors decreasing current rate, this fairly large percentage. Another important, often overlooked, reason knowing parasitic inductance calculation resonant frequency. This important high frequency, bypass capacitors, resonant point will give most signal attenuation. resonant frequency calculated from simple equation: fres Insulation Resistance Insulation Resistance resistance measured across terminals capacitor consists principally parallel resistance shown equivalent circuit. capacitance values hence area dielectric increases, I.R. decreases hence product often specified farads more commonly megohm-microfarads. Leakage current
determined dividing rated voltage (Ohm's Law). Dielectric Strength Dielectric Strength expression ability material withstand electrical stress. Although dielectric strength ordinarily expressed volts, actually dependent thickness dielectric thus also more generically function volts/mil. Dielectric Absorption capacitor does discharge instantaneously upon application short circuit, drains gradually after capacitance proper been discharged. common practice measure dielectric absorption determining "reappearing voltage" which appears across capacitor some point time after been fully discharged under short circuit conditions. Corona Corona ionization other vapors which causes them conduct current. especially prevalent high voltage units occur with voltages well where high voltage gradients occur. energy discharged degrades performance capacitor time cause catastrophic failures.
General Description
BASIC CAPACITOR FORMULAS
Capacitance (farads) English: .224 Metric: .0884 Energy stored capacitors (Joules, watt sec) III. Linear charge capacitor (Amperes) Total Impedance capacitor (ohms) Capacitive Reactance (ohms)
Equivalent Series Resistance (ohms) E.S.R. (D.F.) (Xc) (D.F.) XII. Power Loss (watts) Power Loss fCV2) (D.F.) XIII. (Kilowatts) fCV2 XIV. Temperature Characteristic (ppm/°C) T.C. Drift C.D.
XVI. Reliability Ceramic Capacitors
Inductive Reactance (ohms) VII. Phase Angles: Ideal Capacitors: Current leads voltage Ideal Inductors: Current lags voltage Ideal Resistors: Current phase with voltage VIII. Dissipation Factor (loss angle) E.S.R. (E.S.R.) Power Factor P.F. Sine (loss angle) (phase angle) P.F. (when less than 10%) D.F.= Quality Factor (dimensionless) Cotan (loss angle) D.F.
XVII. Capacitors Series (current same) Number: Two:
XVIII. Capacitors Parallel (voltage same) XIX. Aging Rate A.R.
Decibels
C/decade time
METRIC PREFIXES
Pico Nano Micro Milli Deci Deca Kilo Mega Giga Tera 10-12 10-9 10-6 10-3 10-1 10+1 10+3 10+6 10+9 10+12
SYMBOLS
Dielectric Constant Area Dielectric thickness Voltage time Series Resistance frequency Inductance Loss angle Test life Test voltage Operating voltage Test temperature Operating temperature
Phase angle exponent effect voltage temp. Operating life
Order
Part Number Explanation EXAMPLE: 08055A101JAT2A
0805
Size 0402 0504 0603 0805 1005 0907 1206 1210 1505 1805 1808 1812 1825 2225 3640
Dielectric (NP0)
Capacitance Tolerance ±.25 ±.50 ±10% ±20% +80%, -20% +100%,
Terminations
Special Code Standard Product Profile Chips Only Max. Thickness .66mm (.026") .56mm (.022") .46mm (.018") .38mm (.015") Standard Dimension
Standard:
Plated Others: Plated Gold Plated Pd/Ag
Voltage 100V 200V 250V 500V 600V 1000V 1500V 2000V 2500V 3000V 4000V 5000V
Capacitance Code significant digits zeros) Examples: 1,000 22,000 220,000 values below place decimal point, e.g., 9R1.
Failure Rate Applicable
Packaging**
Recommended:
Reel Embossed Tape Reel Paper Tape =13" Reel Embossed Tape =13" Reel Paper Tape
Others: Waffle Bulk Cassette Bulk
tolerances values. pages 36-39. Note: Unmarked product standard. Marked product available special request, please contact AVX.
(NP0) Dielectric
General Specifications
(NP0) most popular formulation "temperature-compensating," Class ceramic materials. Modern formulations contain neodymium, samarium other rare earth oxides. ceramics offer most stable capacitor dielectrics available. Capacitance change with temperature ±30ppm/°C which less than ±0.3% from -55°C +125°C. Capacitance drift hysteresis ceramics negligible less than ±0.05% versus films. Typical capacitance change with life less than ±0.1% NP0s, one-fifth that shown most other dielectrics. formulations show aging characteristics. formulation usually excess 1000 shows little capacitance changes with frequency. Their dielectric absorption typically less than 0.6% which similar mica most films.
PART NUMBER (see page complete information options)
0805
Size
Voltage 100V 200V
Dielectric (NP0)
Capacitance Code
Capacitance Tolerance Preferred ±10%
Failure Rate Applicable
Special Code Std. Product
Terminations Packaging Plated Reel Solder Paper/Unmarked
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances .068 (1.0 ±0.2 Vrms, 1kHz, MHz) Preferred ±5%, ±10% others available: ±.25 (25pF), ±2%(13pF), ±20% values preferred tolerance also available ±.25 -55°C +125°C ppm/°C (EIA C0G) (+125°C) values 0.1% max. (+25°C +125°C) values 100,000 megohms min. 1000 min., whichever less 10,000 megohms min. min., whichever less 250% rated voltage seconds mamp max. current Vrms values values >100
Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor Insulation Resistance (+25°C, RVDC) Insulation Resistance (+125°C, RVDC) Dielectric Strength Test Voltage Test Frequency
(NP0) Dielectric
Typical Characteristic Curves
Temperature Coefficient
Typical Capacitance Change Envelope: ppm/°C
Variation Impedance with Value Impedance Frequency 0805 1000
100,000
Capacitance
+0.5 -0.5
10,000
Impedance,
1,000
10.0
+105 +125
Temperature
1000 1000
Capacitance Frequency
Frequency,
Capacitance
Variation Impedance with Chip Size Impedance Frequency 1000
1206 0805 1812 1210
1KHz
Frequency
Impedance,
Insulation Resistance (Ohm-Farads)
Insulation Resistance Temperature
10,000
1000
Frequency,
1,000
Variation Impedance with Ceramic Formulation Impedance Frequency 1000 0805
10.00
Impedance,
1.00
0.10
+100
Temperature
0.01 1000
Frequency,
SUMMARY CAPACITANCE RANGES CHIP SIZE
Style 0402* 0504 0603* 0805* 1206* 1210* 1505 1808 1812* 1825* 2220 2225 0.5pF 220pF 0.5pF 330pF 0.5pF 0.5pF 4.7nF 0.5pF 10nF 560pF 10nF 15nF 0.5pF 120pF 0.5pF 150pF 0.5pF 0.5pF 2.2nF 0.5pF 4.7nF 560pF 10nF 10pF 1.5nF 4.7nF 10nF 22nF 4.7nF 47nF 68nF 100V 0.5pF 68pF 0.5pF 330pF 0.5pF 0.5pF 2.2nF 560pF 3.9nF 10pF 820pF 3.9nF 4.7nF 12nF 4.7nF 39nF 39nF 200V 0.5pF 470pF 0.5pF 560pF 1.5nF 10pF 560pF 2.2nF 3.3nF 6.8nF 3.3nF 27nF 39nF
Standard Sizes **For additional information performance changes with operating conditions consult AVX's software SpiCap.
(NP0) Dielectric
Capacitance Range
PREFERRED SIZES SHADED
SIZE
Length Width (in.) (in.)
0402*
1.00 (.040 .004) (.020 .004) (.024) (.010 .006)
0504*
1.27 (.050 .010) 1.02 (.040 .010) 1.02 (.040) (.015 .005)
0603*
1.60 (.063 .006) (.032 .006) (.035) (.014 .006)
0805
2.01 (.079 .008) 1.25 (.049 .008) 1.30 (.051) (.020 .010)
1206
3.20 (.126 .008) 1.60 (.063 .008) 1.50 (.059) (.020 .010)
1505
3.81 (.150 .010) 1.27 (.050 .010) 1.27 (.050) (.020 .010)
Max. Thickness (in.) Terminal WVDC (pF) (in.)
1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000
vapor phase soldering only recommended.
NOTES: higher voltage chips, pages
(NP0) Dielectric
Capacitance Range
PREFERRED SIZES SHADED
SIZE
Length Width Max. Thickness Terminal WVDC (pF) 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 Cap. (µF) .010 .012 .015 .018 .022 .027 .033 .039 .047 .068 (in.) (in.) (in.) (in.)
1210
3.20 (.126 .008) 2.50 (.098 .008) 1.70 (.067) (.020 .010)
1808*
4.57 (.180 .010) 2.03 (.080 .010) 1.52 (.060) (.025 .015)
1812*
4.50 (.177 .012) 3.20 (.126 .008) 1.70 (.067) (.024 .014)
1825*
4.50 (.177 .012) 6.40 (.252 .016) 1.70 (.067) (.024 .014)
2220
(.225 .016) (.197 .016) 2.30 (.090) (.025 .015)
2225*
5.72 (.225 .010) 6.35 (.250 .010) 1.70 (.067) (.025 .015)
vapor phase soldering only recommended.
NOTES: higher voltage chips, pages
Dielectric
General Specifications
formulations called "temperature-stable" ceramics fall into Class materials. most popular these intermediate dielectric-constant materials. temperature variation capacitance within ±15% from -55°C +125°C. This capacitance change non-linear. Capacitance varies under influence electrical operating conditions such voltage frequency. also varies with time, approximately decade time, representing about change years. dielectric chip usage covers broad spectrum industrial applications where known changes capacitance applied voltages acceptable.
PART NUMBER (see page complete information options)
0805
Size
Voltage 100V
Dielectric
Capacitance Code
Capacitance Tolerance Preferred ±10%
Failure Rate Applicable
Special Code Std. Product
Terminations Packaging Plated Reel Solder Paper/Unmarked
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor (1.0 ±0.2 Vrms, 1kHz) Preferred ±10%, ±20% others available: ±5%, -20% -55°C +125°C ±15% VDC) (+125°C) volts volts: 2.5% max. volts: 3.0% max. volts: 3.5% max. volts: max. 100,000 megohms min. 1000 min., whichever less 10,000 megohms min. min., whichever less decade hour 250% rated voltage seconds mamp max. current Vrms
Insulation Resistance (+25°C, RVDC) Insulation Resistance (+125°C, RVDC) Aging Rate Dielectric Strength Test Voltage Test Frequency
Dielectric
Typical Characteristic Curves**
Temperature Coefficient
Variation Impedance with Value Impedance Frequency 1,000 10,000 0805
10.00 1,000 10,000
Capacitance
+100 +125
Impedance,
Temperature
1.00
0.10
0.01
1000
Frequency,
Capacitance Frequency
Variation Impedance with Chip Size Impedance Frequency 10,000
1206 0805 1210
Capacitance
Impedance,
1KHz
1,000
Frequency
Frequency,
Insulation Resistance (Ohm-Farads)
Insulation Resistance Temperature
10,000
Variation Impedance with Chip Size Impedance Frequency 100,000
1206 0805 1210
1,000
Impedance,
+100
Temperature
1,000
Frequency,
SUMMARY CAPACITANCE RANGES CHIP SIZE
Style 0402* 0504 0603* 0805* 1206* 1210* 1505 1808 1812* 1825* 2220 2225 100pF 0.22µF 100pF 1.5µF 2.2µF 100pF 47nF 100pF 0.1µF 100pF 0.47µF 1.8µF 100pF 6.8nF 100pF 47nF 100pF 0.22µF 0.47µF 10nF 0.33µF 100pF 3.9nF 100pF .01µF 100pF 15nF 100pF 0.1µF 0.22µF 0.22µF 0.1µF 10nF 0.33µF 10nF 10nF 10nF 1.5µF 10nF 2.2µF 100V 100pF 3.3nF 100pF 4.7nF 100pF 22nF 0.1µF 0.1µF 27nF 10nF 0.1µF 10nF 0.47µF 10nF 0.47µF 10nF 1.2µF 10nF 1.5µF
Standard Sizes **For additional information performance changes with operating conditions consult AVX's software SpiCap.
Dielectric
Capacitance Range
PREFERRED SIZES SHADED
SIZE
Length Width (in.) (in.)
0402*
1.00 (.040 .004) (.020 .004) (.024) (.010 .006)
0504*
1.27 (.050 .010) 1.02 (.040 .010) 1.02 (.040) (.015 .005)
0603*
1.60 (.063 .006) (.032 .006) (.035) (.014 .006)
0805
2.01 (.079 .008) 1.25 (.049 .008) 1.30 (.051) (.020 .010)
1206
3.20 (.126 .008) 1.60 (.063 .008) 1.50 (.059) (.020 .010)
1505
3.81 (.150 .010) 1.27 (.050 .010) 1.27 (.050) (.020 .010)
Max. Thickness (in.) Terminal WVDC (pF) (in.)
1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 Cap. (µF) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082
vapor phase soldering only recommended.
NOTES: higher voltage chips, pages
Dielectric
Capacitance Range
PREFERRED SIZES SHADED
SIZE
Length Width Max. Thickness Terminal WVDC (pF) 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 Cap. (µF) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 (in.) (in.) (in.) (in.)
1210
3.20 (.126 .008) 2.50 (.098 .008) 1.70 (.067) (.020 .010)
1808*
4.57 (.180 .010) 2.03 (.080 .010) 1.52 (.060) (.025 .015)
1812*
4.50 (.177 .012) 3.20 (.126 .008) 1.70 (.067) (.024 .014)
1825*
4.50 (.177 .012) 6.40 (.252 .016) 1.70 (.067) (.024 .014)
2220
(.225 .016) (.197 .016) 2.30 (.090) (.025 .015)
2225*
5.72 (.225 .010) 6.35 (.250 .010) 1.70 (.067) (.025 .015)
vapor phase soldering only recommended.
NOTES: higher voltage chips, pages
Dielectric
General Specifications
formulations "general-purpose" ceramics which meant primarily limited temperature applications where small size cost important. They provide highest capacitance possible given size three most popular ceramic formulations. They show wide variations capacitance under influence environmental electrical operating conditions. Their aging rate approximately decade drop years. Despite their capacitance instability, formulations very popular because their small size, ESL, excellent frequency response. These features particularly important decoupling application where only minimum capacitance value required.
PART NUMBER (see page complete information options)
0805
Size
Voltage
Dielectric
Capacitance Code
Capacitance Tolerance Preferred +80% -20% ±20%
Failure Rate Applicable
Special Code Std. Product
Terminations Packaging Plated Reel Solder Paper/Unmarked
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor Insulation Resistance (+25°C, RVDC) Dielectric Strength Test Voltage Test Frequency 0.01 Preferred -20% others available: ±20%, +100 +10°C +85°C +22% -56% max. 50VDC (+85°C) max. 10,000 megohms min. 1000 min., whichever less 250% rated voltage seconds mamp max. current Vrms
Dielectric
Typical Characteristic Curves**
Temperature Coefficient
Capacitance
Variation Impedance with Value Impedance Frequency 1206 -Z5U
100.00
10.00
Impedance,
10,000 1.00 100,000 0.10
Temperature
0.01
1,000
Frequency,
Capacitance Frequency
Capacitance
1000
1KHz
Variation Impedance with Chip Size Impedance Frequency
1206 1210 1812
(ohms)
Frequency
0.001
0.01
1,000
Frequency,
Insulation Resistance (Ohm-Farads)
ation Resistance Temperature
100,000
Variation Impedance with Ceramic Formulation Impedance Frequency 0805
10000 1000 0805 0805
10,000
(ohms)
1,000
0.01 0.001 0.01 1,000
Temperature
Frequency,
SUMMARY CAPACITANCE RANGES CHIP SIZE
Style 0603* 0805* 1206* 1210* 1808 1812* 1825* 2225 .01µF .047µF .01µF .12µF .01µF .33µF .01µF .56µF .01µF .56µF .01µF 1.0µF .01µF 1.0µF .01µF 1.0µF .01µF .027µF .01µF 0.1µF .01µF .33µF .01µF .47µF .01µF .47µF .01µF 1.0µF .01µF 1.0µF .01µF 1.0µF
Standard Sizes **For additional information performance changes with operating conditions consult AVX's software SpiCap.
Dielectric
Capacitance Range
PREFERRED SIZES SHADED
SIZE Length Width Max. Thickness Terminal WVDC (µF) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 (in.) (in.) (in.) (in.)
0603* 1.60 (.063 .006) (.032 .006) (.035) (.014 .006)
0805 2.01 (.079 .008) 1.25 (.049 .008) 1.30 (.051) (.020 .010)
1206 3.20 (.126 .008) 1.60 (.063 .008) 1.50 (.059) (.020 .010)
1210 3.20 (.126 .008) 2.50 (.098 .008) 1.70 (.067) (.020 .010)
vapor phase soldering only recommended.
NOTES: profile chips, page
Dielectric
Capacitance Range
PREFERRED SIZES SHADES
SIZE Length Width Max. Thickness Terminal WVDC (µF) .010 .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 (in.) (in.) (in.) (in.)
1808* 04.57 (.180 .010) 2.03 (.080 .010) 1.52 (.060) (.025 .015)
1812* 4.50 (.177 .012) 3.20 (.126 .008) 1.70 (.067) (.024 .014)
1825* 4.50 (.177 .012) 6.40 (.252 .016) 1.70 (.067) (.024 .014)
2225* 5.72 (.225 .010) 6.35 (.250 .010) 1.70 (.067) (.025 .015)
vapor phase soldering only recommended.
NOTES: profile chips, page
Dielectric
General Specifications
formulations general-purpose limited temperature range. They have wide temperature characteristic +22% -82% capacitance change over operating temperature range -30°C +85°C. Y5V's high dielectric constant allows manufacture very high capacitance values small physical sizes.
PART NUMBER (see page complete information options)
0805
Size
Voltage
Dielectric
Capacitance Code
Capacitance Tolerance -20%
Failure Rate Applicable
Special Code Std. Product
Terminations Packaging Plated Reel Solder Paper/Unmarked
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor 2200 -20% -30°C +85°C +22% -82% max. within operating temperature (+85°C) volts volts: 5.0% max. volts: max. volts: max. 10,000 megohms min. 1000 min., whichever less 250% rated voltage seconds mamp max. current Vrms Vrms
Insulation Resistance (+25°C, RVDC) Dielectric Strength Test Voltage Test Frequency
Dielectric
Typical Characteristic Curves**
Temperature Coefficient
+105 +125
0603 Impedance Frequency
10,000 1,000
Capacitance
(Ohms)
0.01 10,000
100,000
1,000,000
10,000,000
Temperature
Frequency (Hz)
Capacitance Change Bias Voltage
0.22 0805 Impedance Frequency
1,000
(Ohms)
-100
0.01 10,000
100,000
1,000,000
10,000,000
Bias Voltage
Frequency (Hz)
Insulation Resistance (Ohm-Farads)
Insulation Resistance Temperature
10,000
1,000
1206 Impedance Frequency
1,000
(Ohms)
Temperature
0.01 10,000
100,000
1,000,000
10,000,000
Frequency (Hz)
SUMMARY CAPACITANCE RANGES CHIP SIZE
Style 0402* 0603* 0805* 1206* 1210* 1812* 1825* 2220 2225 2.2nF 0.1µF 2.2nF 10nF 4.7µF 10nF 10µF 10nF 22µF 2.2nF 0.1µF 2.2nF 0.33µF 10nF 2.2µF 10nF 4.7µF 0.1µF 10µF 2.2nF 22nF 2.2nF 0.22µF 10nF 10nF 2.2µF 0.1µF 4.7µF 0.15µF 1.5µF 0.47µF 1.5µF 0.68µF 2.2µF 2.2nF 10nF 2.2nF 56nF 10nF 0.33µF 10nF 0.1µF 1.5nF 1.5µF 0.47µF 1.5µF 1.5µF 0.68µF 1.5µF
Standard Sizes **For additional information performance changes with operating conditions consult AVX's software SpiCap.
Dielectric
Capacitance Range
PREFERRED SIZES SHADES
SIZE
Length Width Max. Thickness Terminal WVDC (pF) 3900 4700 5600 6800 8200 (µF) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 10.0 12.0 15.0 18.0 22.0 2200 2700 3300 (in.) (in.) (in.) (in.)
0402*
1.00 (.040 .004) (.020 .004) (.024) (.010 .006)
0603*
1.60 (.063 .006) (.032 .006) (.035) (.014 .006)
0805
2.01 (.079 .008) 1.25 (.049 .008) 1.30 (.051) (.020 .010)
1206
3.20 (.126 .008) 1.60 (.063 .008) 1.50 (.059) (.020 .010)
1210
3.20 (.126 .008) 2.50 (.098 .008) 1.70 (.067) (.020 .010)
1812*
4.50 (.177 .012) 3.20 (.126 .008) 1.70 (.067) (.024 .014)
1825*
4.50 (.252 .016) 6.40 (.252 .016) 1.70 (.067) (.024 .014)
2220
(.225 .016) (.197 .016) 2.30 (.090) (.025 .015)
2225*
5.72 (.225 .010) 6.35 (.250 .010) 1.70 (.067) (.025 .015)
vapor phase soldering only recommended.
NOTES: profile product, page
Profile Chips
Dielectric PART NUMBER (see page complete information options)
1206
Size
Voltage
Dielectric
Capacitance Code
Capacitance Tolerance +80/-20%
Failure Rate Applicable
Terminations Packaging* Thickness Plated Reel .026" Max. Solder Paper/Unmarked .022" Max. .018" Max.
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor 25°C, Vrms, 1kHz Insulation Resistance Dielectric Strength seconds mamp max. current Test Voltage Test Frequency Z5U: .33µF; Y5V: .47µF +80, -20% Z5U: +10°C +85°C; Y5V: -30°C +85°C Z5U: +22%, -56%; Y5V: +22%, -82% Z5U: Y5V: 10,000 Megohms min. 1000 whichever less 250% Rated Z5U: Vrms Y5V: Vrms Vrms
CAPACITANCE VALUES VARIOUS THICKNESSES
SIZE
Length Width Terminal (in.) (in.) (in.)
1206 1210
(.126 .008) (.098 .008) (.020 .010) (.026) (.018) (.022) (.026)
0805
2.01 (.079 .008) 1.25 (.049 .008) (.020 .010) (.018) (.022) (.026)
SIZE
Length Width Terminal Thickness Max. (µF) (in.) (in.) (in.) (in.) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 (.018)
0805
2.01 (.079 .008) 1.25 (.049 .008) (.020 .010) (.022) (.026)
1206
(.126 .008) (.063 .008) (.020 .010) (.018) (.022) (.026)
1210
(.126 .008) (.098 .008) (.020 .010) (.018) (.022) (.026)
(.126 .008) (.063 .008) (.020 .010) (.018) (.022)
Thickness Max. (in.) (µF) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082
High Voltage Chips
500V 5000V Applications
High value, leakage small size difficult parameters obtain capacitors high voltage systems. special high voltage chips capacitors meet these performance characteristics designed applications such snubbers high frequency power converters, resonators SMPS, high voltage coupling/DC blocking. These high voltage chip designs exhibit ESRs high frequencies. Larger physical sizes than normally encountered chips used make high voltage chips. These larger sizes require that special precautions taken applying these chips surface mount assemblies. This differences coefficient thermal expansion (CTE) between substrate materials chip capacitors.
PART NUMBER (see page complete information options)
1808
Style 1206 1210 1808 1812 1825 2225 3640
Voltage 500V 600V 1000V 1500V 2000V 2500V 3000V 4000V 5000V
Temperature Capacitance Capacitance Coefficient Code Tolerance significant digits C0G: ±10% zeros) ±20% Examples: 10pF X7R: ±10% 100pF ±20% 1,000pF +80% 22,000pF 220,000pF
Failure Rate A=Not applicable
Termination Packaging Pd/Ag Reel Plated Embossed Solder Tape Reel Embossed Tape Bulk
Special Code Standard
High Voltage Chips
500V 5000V Applications
Dielectric
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25°C, VDC) Insulation Resistance (+125°C, VDC) Dielectric Strength Thickness
VOLTAGE 1000 1500 2000 2500 3000 4000 5000 1206 1210
.047 (25°C, ±0.2 Vrms 1kHz) ±5%, ±10%, ±20% 0.1% max. (+25°C, ±0.2 Vrms, 1kHz) -55°C +125°C ppm/°C VDC) 500, 600, 1000, 1500, 2000, 2500, 3000, 4000 5000 (+125°C) 100,000 megohms min. 1000 min., whichever less 10,000 megohms min. min., whichever less 120% rated voltage seconds mamp max. current Dependent upon size, voltage, capacitance value
1808 3300 3300 1500 1812 5600 5600 2200 1825 .012 .012 5600 1500 1200 2225 .018 .018 8200 1800 1500 3640 .047 .018 5600 4700 2700 2200 1000
(NP0) MAXIMUM CAPACITANCE VALUES
Dielectric
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25°C, VDC) Insulation Resistance (+125°C, VDC) Dielectric Strength Thickness 1000 0.56 (25°C, ±0.2 Vrms 1kHz) ±10%, ±20%, +80% -20% 2.5% max. (+25°C, ±0.2 Vrms, 1kHz) -55°C +125°C ±15% VDC) 500, 600, 1000, 1500, 2000, 2500, 3000 4000 (+125°C) 100,000 megohms min. 1000 min., whichever less 10,000 megohms min. min., whichever less 120% rated voltage seconds mamp max. current Dependent upon size, voltage, capacitance value
MAXIMUM CAPACITANCE VALUES
VOLTAGE 1000 1500 2000 2500 3000 4000 1206 6800 1210 .022 1808 .039 .015 2700 1500 1200 1812 .056 .068 .027 5600 2700 2200 1825 .068 .012 6800 5600 2225 .082 .018 .010 8200 4700 3640 .056 .027 .022 .018 5600
General Specifications
Mechanical TERMINATION ADHERENCE
Specification evidence peeling terminal Measuring Conditions After soldering devices circuit board apply (0.51kg seconds, please refer Figure
FORCE
BEND STRENGTH
Specification Appearance: visual defects Capacitance Variation NP0: .5pF, whichever larger X7R: Z5U: Y5V: Insulation Resistance NP0: Initial Value X7R: Initial Value Z5U: Initial Value Y5V: Initial Value Measuring Conditions Please refer Figure Deflection: Test Time: seconds
DEVICE UNDER TEST TEST BOARD
Figure Terminal Adhesion
RESISTANCE VIBRATION
Specification Appearance: visual defects Capacitance Within specified tolerance Delta meet initial requirement Insulation Resistance NP0, Initial Value Z5U, Initial Value Measuring Conditions Vibration Frequency 10-2000 Maximum Acceleration Swing Width 1.5mm Test Time axis hours each, total hours test
RESISTANCE SOLDER HEAT
Specification Appearance: serious defects, <25% leaching either terminal Capacitance Variation NP0: 2.5% 2.5pF, whichever greater X7R: 7.5% Z5U: Y5V: Delta meet initial requirement Insulation Resistance meet initial requirement Dielectric Strength problem observed Measuring Conditions device eutectic solder 260°C, minute. Store room temperature hours hours NP0) before measuring electrical parameters. Part sizes larger than 3.20mm 2.49mm preheated 150°C seconds before performing test.
SOLDERABILITY
Specification each termination should covered with fresh solder Measuring Conditions device eutectic solder seconds
Speed 1mm/sec Deflection
R340mm
45mm
45mm
Supports
Figure Bend Strength
General Specifications
Environmental THERMAL SHOCK
Specification Appearance visual defects Capacitance Variation NP0: 2.5% .25pF, whichever greater X7R: 7.5% Z5U: Y5V: Delta meet initial requirement Insulation Resistance NP0, X7R: meet initial requirement Z5U, Y5V: Initial Value Dielectric Strength problem observed Measuring Conditions Step Temperature Time (minutes) NP0, X7R: -55° Z5U: +10° Y5V: -30° Room Temperature NP0, X7R: +125° Z5U, Y5V: +85° Room Temperature Repeat cycles measure after hours hours hours NP0) room temperature.
MOISTURE RESISTANCE
Specification Appearance visual defects Capacitance Variation NP0: .5pF, whichever greater X7R: Z5U: Y5V: Delta NP0: 30pF 10pF, 30pF 275+5C/2 10pF 200+10C X7R: Initial requirement Z5U: Initial requirement Y5V: Initial requirement Insulation Resistance Initial Value Measuring Conditions Step Temp. Humidity Time (hrs) +25->+65 90-98 90-98 +65->+25 80-98 +25->+65 90-98 90-98 +65->+25 80-98 90-98 uncontrolled 90-98 Repeat cycles (1-7) store hours hours NP0) room temperature before measuring. Steps done first cycles.
IMMERSION
Specification Appearance visual defects Capacitance Variation NP0: 2.5% .25pF, whichever greater X7R: 7.5% Z5U: Y5V: Delta meet initial requirement Insulation Resistance NP0, X7R: meet initial requirement Z5U, Y5V: Initial Value Dielectric Strength problem observed Measuring Conditions Step Temperature Time (minutes) +5/-0 Pure Water NaCl solution Repeat cycle times wash with water dry. Store room temperature hours hours NP0) measure.
General Specifications
Environmental STEADY STATE HUMIDITY Load)
Specification Appearance visual defects Capacitance Variation NP0: .5pF, whichever greater X7R: Z5U: Y5V: Delta NP0: 30pF 10pF, 30pF 275+5C/2 10pF 200+10C X7R: Initial requirement Z5U: Initial requirement Y5V: Initial requirement Insulation Resistance Initial Value Measuring Conditions Store relative humidity 85°C 1000 hours, without voltage. Remove from test chamber stabilize room temperature humidity hours hours NP0) before measuring. Charge discharge currents must less than 50ma. Insulation Resistance NP0, X7R: meet initial value Z5U, Y5V: Initial Value Charge devices with rated voltage test chamber relative humidity 85°C 1000 (+48,-0) hours. Remove from test chamber stabilize room temperature humidity hours hours NP0) before measuring. Charge discharge currents must less than 50ma.
LOAD LIFE
Specification Appearance visual defects Capacitance Variation NP0: .3pF, whichever greater X7R: Z5U: Y5V: Delta NP0: 30pF 10pF, 30pF 275+5C/2 10pF 200+10C X7R: Initial requirement Z5U: Initial requirement Y5V: Initial requirement Insulation Resistance NP0, X7R: meet initial value Z5U, Y5V: Initial Value Charge devices with twice rated voltage test chamber +125°C X7R, +85° Z5U, 1000 (+48,-0) hours. Remove from test chamber stabilize room temperature hours hours NP0) before measuring. Charge discharge currents must less than 50ma.
LOAD HUMIDITY
Specification Appearance visual defects Capacitance Variation NP0: .5pF, whichever greater X7R: Z5U: Y5V: Delta NP0: 30pF 10pF, 30pF 275+5C/2 10pF 200+10C X7R: Initial requirement Z5U: Initial requirement Y5V: Initial requirement
MIL-C-55681/Chips
Part Number Example
Military Designation MIL-C-55681
Part Number Example (example)
CDR01
Style Voltage-temperature Limits Capacitance
Rated Voltage Capacitance Tolerance Termination Finish Failure Rate
Style: CDR01, CDR02, CDR03, CDR04, CDR05, CDR06 Voltage Temperature Limits: ppm/°C without voltage; ppm/°C with rated voltage from -55°C +125°C without voltage; -25% with rated voltage from -55°C +125°C Capacitance: digit figures followed multiplier (number zeros added) e.g., Rated Voltage: 50V, 100V Capacitance Tolerance: ±5%, ±10%, ±20%
Termination Finish: Palladium Silver Silver Nickel Gold Solder-coated
Base Metallization/Barrier Metal/Solder Coated* Base Metallization/Barrier Metal/Tinned (Tin Tin/ Lead Alloy)
Failure Rate Level: 1.0%, .1%, .01%, .001% Packaging: Bulk standard packaging. Tape reel RS481 available upon request. *Solder shall have melting point 200°C less.
CROSS REFERENCE: AVX/MIL-C-55681/CDR01 THRU CDR06*
MIL-C-55681 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 Style 0805 1805 1808 1812 1825 2225 Length .080 .015 .180 .015 .180 .015 .180 .015 .180 +.020 -.015 .225 .020 Width .050 .015 .050 .015 .080 .018 .125 .015 .250 +.020 -.015 .250 .020 Thickness Max. Min. .055 .020 .055 .020 .080 .020 .080 .020 .080 .080 .020 .020 Max. Min. .030 Termination Band Max. Min. .010 .030 .010 .030 .010 .030 .010 .030 .030 .010 .010
*For CDR11, Microwave Chip Capacitor Catalog
MIL-C-55681/Chips
Military Part Number Identification CDR01 thru CDR06
CDR01 thru CDR06 MIL-C-55681
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 0805/CDR01
1000 1200 1500 1800 2200 2700 3300 3900 4700 BP,BX BP,BX BP,BX
Style 1808/CDR03
1000 12,000 15,000 18,000 22,000 27,000 33,000 39,000 47,000 56,000 68,000
Style 1812/CDR04
1500 1800 2200 2700 3300 39,000 47,000 56,000 82,000 100,000 120,000 150,000 180,000
Style 1805/CDR02
3900 4700 5600 6800 8200 10,000 12,000 15,000 18,000 22,000
Style 1825/CDR05
4700 5600 68,000 82,000 100,000 120,000 150,000 220,000 270,000 330,000
appropriate failure rate appropriate termination finish Capacitance Tolerance
Style 2225/CDR06
8200 10,000 390,000 470,000
appropriate failure rate appropriate termination finish Capacitance Tolerance
MIL-C-55681/Chips
Military Part Number Identification CDR31 thru CDR35
Military Designation MIL-C-55681
Part Number Example (example)
CDR31
Style Voltage-temperature Limits Capacitance
Rated Voltage Capacitance Tolerance Termination Finish Failure Rate
Style: CDR31, CDR32, CDR33, CDR34, CDR35 Voltage Temperature Limits: ppm/°C without voltage; ppm/°C with rated voltage from -55°C +125°C without voltage; -25% with rated voltage from -55°C +125°C Capacitance: digit figures followed multiplier (number zeros added) e.g., Rated Voltage: 50V, 100V Capacitance Tolerance: ±.25 ±5%, ±10%, ±20%
Termination Finish: Palladium Silver Silver Nickel Gold Solder-coated
Base Metallization/Barrier Metal/Solder Coated* Base Metallization/Barrier Metal/Tinned (Tin Tin/ Lead Alloy)
*Solder shall have melting point 200°C less. Failure Rate Level: 1.0%, .1%, .01%, .001% Packaging: Bulk standard packaging. Tape reel RS481 available upon request.
CROSS REFERENCE: AVX/MIL-C-55681/CDR31 THRU CDR35
MIL-C-55681 (Metric Sizes) CDR31 CDR32 CDR33 CDR34 CDR35 Style 0805 1206 1210 1812 1825 Length (mm) 2.00 3.20 3.20 4.50 4.50 Width (mm) 1.25 1.60 2.50 3.20 6.40 Thickness Max. (mm) Min. (mm) Termination Band Max. (mm) Min. (mm)
MIL-C-55681/Chips
Military Part Number Identification CDR31
CDR31 MIL-C-55681/7
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 0805/CDR31 (BP)
F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 0805/CDR31 (BP) cont'd
F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 0805/CDR31 (BX)
1,000 1,200 1,500 1,800 2,200 2,700 3,300 3,900 4,700 5,600 6,800 8,200 10,000 12,000 15,000 18,000
appropriate failure rate appropriate termination finish Capacitance Tolerance complete part number will include additional symbols indicate capacitance tolerance, termination failure rate level.
appropriate failure rate appropriate termination finish Capacitance Tolerance
MIL-C-55681/Chips
Military Part Number Identification CDR32
CDR32 MIL-C-55681/8
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 1206/CDR32 (BP)
F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1206/CDR32 (BP) cont'd
1,000 1,100 1,200 1,300 1,500 1,600 1,800 2,000 2,200 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1206/CDR32 (BX)
5,600 6,800 8,200 10,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000
appropriate failure rate appropriate termination finish Capacitance Tolerance
appropriate failure rate appropriate termination finish Capacitance Tolerance complete part number will include additional symbols indicate capacitance tolerance, termination failure rate level.
MIL-C-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 MIL-C-55681/9/10/11
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 1210/CDR33 (BP)
1,100 1,200 1,300 1,500 1,600 1,800 2,000 2,200 2,400 2,700 3,000 3,300 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1812/CDR34 (BX)
33,000 39,000 47,000 56,000 100,000 120,000 150,000 180,000
Style 1825/CDR35 (BP)
5,100 5,600 6,200 6,800 7,500 8,200 9,100 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1210/CDR33 (BX)
18,000 22,000 27,000 39,000 47,000 56,000 68,000 82,000 100,000
Style 1812/CDR34 (BP)
2,400 2,700 3,000 3,300 3,600 3,900 4,300 4,700 5,100 5,600 6,200 6,800 7,500 8,200 9,100 10,000 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1825/CDR35 (BX)
68,000 82,000 100,000 120,000 150,000 180,000 220,000 270,000 330,000 390,000 470,000
appropriate failure rate appropriate failure rate appropriate termination finish appropriate termination finish Capacitance Tolerance Capacitance Tolerance complete part number will include additional symbols indicate capacitance tolerance, termination failure rate level.
European Detail Specification CECC 101-801/Chips
Standard European Ceramic Chip Capacitors PART NUMBER (example)
0805
Size
Voltage 100V 200V
Dielectric
Capacitance Code
Special Code Std. Product
Capacitance Specification Terminations Marking Tolerance CECC32101-801 Plated Packaging Dielectrics Reel C0G, X7R, Paper/Unmarked
RANGE APPROVED COMPONENTS
Case Size 1BCG 0603 0805 1206 1210 1808 1812 2220 0603 0805 1206 1210 1808 1812 2220 0805 1206 1210 1808 1812 2220 10pF 100nF 10pF 330nF 10pF 470nF 10pF 560nF 10pF 1.8µF 10pF 2.2µF 10pF 6.8nF 10pF 33nF 10pF 100nF 10pF 150nF 10pF 270nF 10pF 470nF 10pF 1.2µF 10pF 6.8nF 10pF 18nF 10pF 68nF 10pF 100nF 10pF 180nF 10pF 330nF 10pF 680nF 10pF 1.2nF 10pF 3.3nF 10pF 18nF 10pF 27nF 10pF 47nF 10pF 100nF 10pF 220nF Dielectric Type 0.47pF 150pF 0.47pF 560pF 0.47pF 3.3nF 0.47pF 4.7nF 0.47pF 6.8nF 0.47pF 15nF 0.47pF 39nF Voltage Capacitance Range 100V 0.47pF 120pF 0.47pF 560pF 0.47pF 3.3nF 0.47pF 4.7nF 0.47pF 6.8nF 0.47pF 15nF 0.47pF 39nF 200V 0.47pF 100pF 0.47pF 330pF 0.47pF 1.5nF 0.47pF 2.7nF 0.47pF 4.7nF 0.47pF 10nF 0.47pF 15nF
Packaging Chip Components
Automatic Insertion Packaging
TAPE REEL QUANTITIES
tape reel specifications compliance with RS481.
Embossed Punched Carrier Embossed Only Punched Only Qty. Reel/7" Reel Qty. Reel/13" Reel
12mm
0805, 1005, 1206, 1210 0504, 0907 0402, 0603 2,000 4,000 10,000 3,000 10,000 1,000 4,000 1505, 1805, 1808 1812, 1825 2225
Dependent chip thickness. profile chips shown page 5,000 reel reel. 0402 size chips 10,000 reel reels available reels. 3640 size chip contact factory quantity reel.
REEL DIMENSIONS
Tape Size(1)
Max.
Min.
Min.
Min.
+1.0 -0.0 (.331 +.060 -0.0
Max. 14.4 (.567)
Min. (.311) 10.9 Max. (.429) 11.9 Min. (.469) 15.4 Max. (.607)
(12.992) 12mm
(.059)
13.0±0.20 (.512±.008)
20.2 (.795)
(1.969) 12.4 +2.0 -0.0 +.076 (.488 -0.0 18.4 (.724)
Metric dimensions will govern. English measurements rounded reference only. (1)For tape sizes 16mm 24mm (used with chip size 3640) consult RS-481 latest revision.
Embossed Carrier Configuration
Tape Only
Embossed Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 12mm (.059
+0.10 -0.0 +.004 -0.0
Max. 0.600 (.024)
0.10 (.004) Max.
0.75 (.030) Min. Note
0.75 (.030) Min. Note
1.75 0.10 0.10 0.05 (.069 .004) (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size Max. Min. Note Note 4.55 (.179) (.323) 4.55 (.179) (.323) (.039) (.059) (.039) (.059) Min. Note (.984) (1.181) (.984) (1.181)
0.05 0.10 (.138 .002) (.157 .004) 0.05 0.10 (.217 .002) (.157 .004) 0.05 0.10 (.138 .002) 0.79 .004 0.05 0.10 (.217 .002) (.315 .004)
(.098) Max. (.256) Max. (.098) Max. (.256)
+0.3 -0.1 (.315 +.012 -.004 12.0 (.472 .012) +0.3 -0.1 (.315 +.012 -.004 12.0 (.472 .012)
Note
12mm Pitch 12mm Double Pitch
Note
Note
Note
NOTES: determined max. dimensions ends terminals extending from component body and/or body dimensions component. clearance between terminals body component sides depth cavity must within 0.05 (.002) min. 0.50 (.020) max. clearance allowed must also prevent rotation component within cavity more than degrees (see sketches Tape with components shall pass around radius without damage. minimum trailer length (Note Fig. require additional length provide min. embossed tape reels with diameters approaching min. (Table dimension flat area from edge sprocket hole either outward deformation carrier tape between embossed cavities edge cavity whichever less. dimension flat area from edge carrier tape opposite sprocket holes either outward deformation carrier tape between embossed cavity edge cavity whichever less. embossment hole location shall measured from sprocket hole controlling location embossment. Dimensions embossment location hole location shall applied independent each other. dimension reference dimension tape feeder clearance only.
Punched Carrier Configuration
Tape Only
Punched Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 12mm (.059
+0.1 -0.0 +.004 -.000
1.75 0.10 (.069 .004)
0.10 (.004) Max.
0.75 (.030) Min.
0.75 (.030) Min.
MIN. (.984) Note
0.10 0.05 (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size 0.10 (.157 .004) .010 (.157 .004) 0.10 (.079 .004) 0.05 (.138 .002) 0.05 (.217 .002) 0.05 (.138 .002) +0.3 -0.1 (.315 +.012 -.004 12.0 (.472 .012) +0.3 -0.1 (.315 +.012 -.004 Note Note
12mm Pitch 12mm Double Pitch
0.10 (.315 .004)
0.05 (.217 .002)
12.0 (.472 .012)
NOTES: determined max. dimensions ends terminals extending from component body and/or body dimensions component. clearance between ends terminals body component sides depth cavity must within 0.05 (.002) min. 0.50 (.020) max. clearance allowed must also prevent rotation component within cavity more than degrees (see sketches Tape with components shall pass around radius without damage. (.043) Base Tape (.063) Max. Non-Paper Base Compositions.
Code Labeling Standard
code labeling available follows latest version EIA-556-A.
Bulk Case Packaging
BENEFITS
Easier handling Smaller packaging volume
(1/20 packaging)
BULK FEEDER
Easier inventory control Flexibility Recyclable
Case
Cassette Gate
CASE DIMENSIONS
Shutter Slider 12mm 36mm
Expanded Drawing
Shooter
Mounter Head Chips
110mm Attachment Base
CASE QUANTITIES
Part Size Qty. (pcs cassette) 0402 80,000 0603 15,000 0805 10,000 (T=0.6mm) 5,000
Surface Mounting Guide
Appendix Capacitors PHYSICAL PROPERTIES
properties MLC's decided their chemical composition physical makeup. manufacturers slightly different compositions designs this means that MLC's have identical properties. Most systems are, however, based doped barium titanate materials basically similar designs. There will minor differences value some physical constants quoted these should prove significant practical purposes.
Thermal Conductivity
Ceramic 5W/m Kelvin Termination Bar) 380W/m Kelvin Electrode (Pd/Ag) 140W/m Kelvin These figures show problem predicting thermal behavior MLC's each being different according form number electrodes.
Temperature
Coefficient expansion (CTE) This varies according which axis chip being measured. Across terminations 11ppm/°C Across chip 13ppm/°C Electrode (Pd/Ag) 16ppm/°C should remembered that attempting match circuit board material with MLC's that dynamic system should considered (power temperature rise) static system (uniform temperature rise).
Toper Tamb
CTEsub CTEcap Solder Fillet
Capacitor Maximum Stress Substrate Thermal Stress
Table Coefficients Expansion Conductivity Material (ppm/°C) (W/m Kelvin) Alumina 34.6 Alloy 17.3 BaTi03 doped 9.5-11.5 Copper 17.6 Copper Invar Filled Epoxy 18-25 FR4/G10 Nickel Polyimide/Glass Polyimide/Kevlar Silver 19.6 Steel 46.7 Tantalum Tin/Lead
Ceramic
Toper Tamb CTEsub CTEcap Maximum Stress Capacitor Solder Fillet Substrate
11.5 Electrodes 18ppm
Termination Tin-Lead Nickel Over Silver Glass Frit
Thermal Stress
18ppm Thermal Conductivity Conductivity Materials.
Surface Mounting Guide
Appendix Capacitors
Strength
Flexure Fracture toughness 3Gpa This merely confirms well known high strength compression, strength tension that ceramics normally have.
Exploded View Termination Capacitor Body Showing Forces Exerted Termination
Forces Exerted Termination
Ceramic Body
Expanding Rectangular Annulus
Each Electrode That Enters Capacitor Body Acts Like Wedge Forcing Capacitor Apart Thermal stresses electrodes/ceramic
Thermal Stress Terminations.
Chemical Resistance
Ceramics themselves very resistant chemical attack, providing they processed manner which prevents incidence cracks chips body. cases where cracks etc. present, moisture penetrate cause insulation resistance reduce. Termination, whether silver/palladium nickel barrier solder coated, suffer chemical attack from pollutants packing materials. order preserve their solderability they should kept packing manufacturer supplied until required use. Points watch paper rubber bands, which contain sulphur compounds.
TERMINATION TYPES APPLICATIONS
capacitor termination must designed that good electrical connection internal electrode system good solderability leaching properties with normally used fluxes, solders soldering processes. Surface mount assembly permitted wider range soldering processes than traditionally viable pin-through hole manufacture. This has, turn, placed greater demands capacitor terminations, especially with regard wave-soldering some more prolonged reflow techniques.
Handling
Ceramic chips easily damaged contaminated poor handling storage. chip crack, contamination hands poor storage, metal tweezers (the surface bare ceramic chips very abrasive) induce subsequent defect described above. Care must taken achieve best results.
Storage
Good solderability maintained least twelve months, provided components stored their received" packaging less than 40°C relative humidity.
Solderability
Terminations well tinned after immersion 60/40 tin/lead solder bath ±10°C seconds.
Surface Mounting Guide
Appendix Capacitors
Component Design
Component pads should designed achieve good solder filets minimize component movement during reflow soldering. designs given below most common sizes multilayer ceramic capacitors both wave reflow soldering. basis these designs width equal component width. permissible decrease this component width advisable below this. overlap 0.5mm beneath component. extension 0.5mm beyond components reflow 1.0mm wave soldering.
REFLOW SOLDERING
Dimensions millimeters (inches)
Case Size 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
1.70 (0.07) 2.30 (0.09) 3.00 (0.12) 4.00 (0.16) 4.00 (0.16) 5.60 (0.22) 5.60 (0.22) 5.60 (0.22) 6.60 (0.26) 6.60 (0.26)
0.60 (0.02) 0.80 (0.03) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)
0.50 (0.02) 0.70 (0.03) 1.00 (0.04) 2.00 (0.09) 2.00 (0.09) 3.60 (0.14) 3.60 (0.14) 3.60 (0.14) 4.60 (0.18) 4.60 (0.18)
0.60 (0.02) 0.80 (0.03) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)
0.50 (0.02) 0.75 (0.03) 1.25 (0.05) 1.60 (0.06) 2.50 (0.10) 2.00 (0.08) 3.00 (0.12) 6.35 (0.25) 5.00 (0.20) 6.35 (0.25)
Surface Mounting Guide
Appendix Capacitors WAVE SOLDERING
Case Size 0603 0805 1206 1210 1808 1812 1825 2220 2225
3.10 (0.12) 4.00 (0.15) 5.00 (0.19) 5.00 (0.19) 6.60 (0.26) 6.60 (0.26) 6.60 (0.26) 7.60 (0.29) 7.60 (0.29)
1.20 (0.05) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06)
0.70 (0.03) 1.00 (0.04) 2.00 (0.09) 2.00 (0.09) 3.60 (0.14) 3.60 (0.14) 3.60 (0.14) 4.60 (0.18) 4.60 (0.18)
1.20 (0.05) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06)
0.75 (0.03) 1.25 (0.05) 1.60 (0.06) 2.50 (0.10) 2.00 (0.08) 3.00 (0.12) 6.35 (0.25) 5.00 (0.20) 6.35 (0.25)
Dimensions millimeters (inches)
Component Spacing
wave soldering components, must spaced sufficiently apart avoid bridging shadowing (inability solder penetrate properly into small spaces). This less important reflow soldering sufficient space must allowed enable rework should required.
Preheat Soldering
rate preheat should exceed C/second prevent thermal shock. better maximum figure about C/second. capacitors size 1206 below, with maximum thickness 1.25mm, generally permissible allow temperature differential from preheat soldering 150°C. other cases this differential should exceed 100°C. further specific application process advice please consult AVX.
1.5mm (0.06) (0.04)
Cleaning
Care should taken ensure that capacitors thoroughly cleaned flux residues especially space beneath capacitor. Such residues otherwise become conductive effectively offer resistance bypass capacitor. Ultrasonic cleaning permissible, recommended conditions being Watts/litre 20-45 kHz, with process cycle minutes vapor rinse, minutes immersion ultrasonic solvent bath finally minutes vapor rinse.
(0.04)
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NOTICE: Specifications subject change without notice. Contact your nearest Sales Office latest specifications. statements, information data given herein believed accurate reliable, presented without guarantee, warranty, responsibility kind, expressed implied. Statements suggestions concerning possible products made without representation warranty that such free patent infringement recommendations infringe patent. user should assume that safety measures indicated that other measures required. Specifications typical apply applications.
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