Power Amplifier with Frequency Multiplier (x2) Package Avago Tech

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Power Amplifier with Frequency Multiplier (x2) Package Avago Tech

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AMMP-6130
Power Amplifier with Frequency Multiplier (x2) Package
Avago Technologies AMMP-6130 high gain, narrowband doubler output power amplifier designed applications other commercial communication systems. MMIC takes input signal passes through harmonic frequency multiplier (x2) then three stages power amplification. Integrated matching structures filter match input/output integrated input output blocking capacitors bias structures stages. MMIC fabricated using PHEMT technology. backside this package part both ground. This helps simply assembly process reduces assembly related performance variations costs. surface mount package allows elimination "chip wire" assembly lower cost. This MMIC cost effective alternative hybrid (discrete-FET) amplifiers that require complex tuning assembly process.
Features
Surface Mount Package, 1.25 Integrated Block Choke Input Output Match Single Positive Supply Negative Gate Bias
Specifications (Vd=4.5V, Idd=200mA)
Frequency Range 15GHz 30GHz Output Power: Harmonic Suppression: 60dBc Single Positive Supply Requirements: 4.5V, 200mA
Applications
Microwave Radio systems Satellite VSAT, Up/Down Link Broadband Wireless Access)
Connections (Top View)
Function
PACKAGE BASE
Note: These devices sensitive. following precautions strongly recommended. Ensure that approved carrier used when units transported from destination another. Personal grounding worn times when handling these devices. manufacturer assumes responsibilities damage improper storage handling these devices.
Absolute Maximum Ratings
Tstg Tmax
Specifications/ Physical Properties
Unit
Parameters/Condition
Drain Ground Voltage Drain Current Input Power channel temperature Storage temperature Maximum Assembly Temp
+150 +150
Parameter Test Condition
Drain Supply Current under power drive temp.(Vd=4.5 Drain Supply Voltage Thermal Resistance(3)
Unit
Notes. Operation excess these conditions result permanent damage this device. absolute maximum ratings Vdd, were determined ambient temperature 25°C unless noted otherwise.
Ambient operational temperature TA=25°C unless noted Channel-to-backside Thermal Resistance (Tchannel 34°C) measured using infrared microscopy. Thermal Resistance backside temp. (Tb) 25°C calculated from measured data.
AMMP-6130 Specifications (4,5)
Symbol
Freq Gain Pout
25°C, 200mA, Zo=50 Pin=5dBm Parameters Test Conditions
Operational Frequency Conversion Gain(4,5) Output Power(5) Fundamental Suppression Harmonic Suppression
Frequency
Units
Minimum
Maximum
18.5 23.5
Typical
Notes. Small/Large -signal data measured fully de-embedded test fixture form 25°C. tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc.
Typical Distribution Conversion Gain Output Power based 1000 parts
StDev 0.46
StDev 0.39
Conversion Gain 30GHz
Output Power 30GHz
AMMP-6130 Typical Performance
C.G.[dB] 14.5
25°C, Vdd=4.5V, Idd=200 Zout Pin=3dBm unless otherwise stated)
C.G. 2H-1H 15.5 Input Frequency [GHz] [dBm] 2H-1H [dBm] 29.5 30.5 Output Frequency [GHz] Figure Output Power Output Frequency Input Power [dBm] 29.5 Frequency [GHz] Figure Output Power Output Frequency bias levels Return Loss [dB] [dBm] [dBm] Figure Output Power Input Power Input Freq [dBm] 29.5 Frequency [GHz] Figure Output Power Output Freq Temp 25C, -40C 30.5 -40C 14GHz 16GHz 15GHz 30.5 29.5 30.5 Frequency [GHz] 3dBm 5dBm 4dBm
Figure Conversion Gain Fundamental Input Freq [dBm] 3.5V 4.5V
Figure Fundamental, Output Power Output Freq Frequency [GHz] S11[dB] S22[dB]
Figure Input Output Return Loss Freq
[dBm], [dBm]
Typical Scattering Parameters
Freq
25°C, =4.5 Zout
-2.166 -2.531 -3.497 -4.889 -4.747 -4.158 -3.851 -3.490 -2.858 -2.405 -2.455 -3.151 -4.322 -4.834 -8.532 -17.084 -4.491 -3.044 -3.366 -3.044 -2.867 -3.422 -4.695 -4.668 -3.628 -3.951 -6.246 -4.878 -2.704 -2.261 -2.438 -4.679 -3.935 -2.625 -2.781 -1.933 -2.389 -3.601 -3.147 -2.535
Phase
73.909 -33.368 -148.095 81.765 -58.704 177.213 65.073 -47.052 -152.082 115.491 30.433 -60.545 -169.451 73.490 -34.070 178.992 -53.423 -155.503 102.797 -9.051 -108.593 162.205 63.767 -51.945 -154.450 115.995 5.230 -139.262 123.438 55.231 -17.264 -129.407 87.568 -0.364 -54.324 -110.128 -179.000 76.661 -52.739 -142.354
Phase
32.383 131.860 4.147 -149.666 14.517 -90.973 125.799 6.552 127.728 -65.533 -163.279 107.046 3.617 -117.593 110.391 6.543 -135.344 136.100 95.071 -14.777 -145.395 82.328 -39.850 -163.461 69.328 -59.027 160.771 0.554 -161.843 45.858 -99.661 124.211 -7.487 -121.959 74.844 -47.149 -142.199 119.631 19.317 -63.508
Phase
96.570 14.797 -81.506 -167.459 -43.361 179.115 90.638 -0.484 -66.346 -143.716 143.963 70.767 -5.502 -76.081 -115.604 176.951 114.486 53.047 10.720 -48.544 -132.798 150.079 77.624 -14.763 -91.783 -133.605 -121.717 154.890 104.130 33.927 -92.384 171.824 82.835 29.124 24.686 -44.356 -103.624 170.138 109.913 59.709
0.779 0.747 0.669 0.570 0.579 0.620 0.642 0.669 0.720 0.758 0.754 0.696 0.608 0.573 0.471 0.140 0.596 0.704 0.679 0.704 0.719 0.674 0.582 0.584 0.659 0.635 0.487 0.570 0.732 0.771 0.755 0.584 0.636 0.739 0.726 0.800 0.760 0.661 0.696 0.747
-80.000 -55.139 -47.131 -35.890 -39.659 -42.499 -40.491 -38.202 -36.449 -39.453 -36.924 -31.920 -25.739 -21.180 -18.548 -17.566 -17.635 -23.293 -18.655 -9.450 -5.991 -4.028 -3.379 -2.061 -0.831 1.569 5.448 8.677 8.718 7.537 4.931 2.021 -2.173 -3.950 -5.113 -14.647 -20.114 -23.728 -29.776 -37.109
0.000 0.002 0.004 0.016 0.010 0.008 0.009 0.012 0.015 0.011 0.014 0.025 0.052 0.087 0.118 0.132 0.131 0.068 0.117 0.337 0.502 0.629 0.678 0.789 0.909 1.198 1.872 2.716 2.728 2.381 1.764 1.262 0.779 0.635 0.555 0.185 0.099 0.065 0.032 0.014
-76.478 -64.437 -60.915 -61.938 -76.478 -60.000 -52.217 -50.903 -51.213 -50.752 -51.057 -51.701 -53.351 -56.773 -58.416 -55.139 -54.895 -55.918 -55.650 -50.604 -48.068 -48.291 -47.033 -49.119 -54.425 -63.098 -54.425 -52.956 -51.535 -44.883 -40.677 -45.352 -47.639 -54.425 -51.213 -50.314 -47.432 -45.514 -48.995 -48.636
0.000 0.001 0.001 0.001 0.000 0.001 0.002 0.003 0.003 0.003 0.003 0.003 0.002 0.001 0.001 0.002 0.002 0.002 0.002 0.003 0.004 0.004 0.004 0.004 0.002 0.001 0.002 0.002 0.003 0.006 0.009 0.005 0.004 0.002 0.003 0.003 0.004 0.005 0.004 0.004
-0.425 -1.765 -3.270 -6.891 -5.259 -5.923 -6.641 -7.851 -8.101 -7.230 -6.848 -7.764 -9.863 -9.730 -7.355 -6.539 -7.803 -10.664 -9.247 -6.265 -11.811 -13.966 -10.858 -13.856 -26.366 -20.510 -14.933 -13.580 -19.160 -10.134 -16.812 -12.958 -7.855 -6.979 -7.925 -12.031 -24.967 -11.511 -8.394 -8.793
0.952 0.816 0.686 0.452 0.546 0.506 0.466 0.405 0.394 0.435 0.455 0.409 0.321 0.326 0.429 0.471 0.407 0.293 0.345 0.486 0.257 0.200 0.287 0.203 0.048 0.094 0.179 0.209 0.110 0.324 0.144 0.225 0.405 0.448 0.402 0.250 0.056 0.266 0.380 0.363
Phase
-101.410 159.979 61.101 -23.500 -102.375 170.014 79.202 -19.043 -114.956 158.758 78.557 -2.902 -100.642 143.433 47.561 -30.885 -107.509 152.353 7.160 -113.148 132.293 -67.065 -171.437 116.377 37.539 -161.333 150.560 94.577 112.029 60.389 -33.753 93.604 28.172 -23.046 -70.880 -120.006 -83.063 -78.816 -129.674 175.556
Note: Data obtained connectorized module
Biasing Operation
AMMP-6130 frequency doubler been designed with fully integrated self bias network; thus, requiring only single 4.5v bias input with typical current draw 200mA. one-stage frequency doubler relies non-linear behavior produce doubled signal output. high-pass filter input shorts reflected harmonic signal ground. input also consists matching components tuned 15GHz. additional LC-filter included input stability. doubler operated pinch-off create halfwave conduction angle ideal generation harmonic. AMMP-6130 also designed stability over temperature.
Figure Evaluation Test Board (Available qualified customer requests)
Port MLIN TL10
Port
MLIN TL11
MLIN TL12
MLIN TL13
MLOC HP_FET HPFET2 MLIN TL21 MLIN TL15 MLIN TL18
HP_FET HPFET3
MLIN TL22
MLIN TL16 MLIN TL19
HP_FET HPFET4
Port Output_30G
Port Input_15G MLIN
MLIN
MLIN
MLIN HP_FET HPFET1
MLIN TL20
MLIN MLIN TL14 TL17
C15C13
MLOC
Figure Simplified Doubler-Amplifier Schematic
Recommended Attachment Package
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering.
Figure 10a. Suggested Land Pattern Stencil Layout
Figure10b. Stencil Outline Drawing (mm)
Figure10c. Combined Stencil Layouts
Manual Assembly
Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Neither Conductive epoxy hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits.
Temp Ramp Preheat Ramp Seconds Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste Reflow Cooling
Peak Melting point 218°C
properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127mm mils) thick stainless steel which capable producing required fine stencil outline. most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
Package Dimensions
0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 0.014 (0.365)
AMMP XXXX YWWDNN
FRONT VIEW
0.016 (0.40)
0.126 (3.2)
0.059 (1.5)
0.100 (2.54) 0.029 (0.75) SIDE VIEW MAX. 0.213 (5.4) 0.088 (2.25) 0.016 (0.40)
0.012 (0.30)
0.028 (0.70) 0.100 (2.54) 0.93 (2.36) BACK VIEW
DIMENSIONAL TOLERANCE BACK VIEW: 0.002" (0.05
SYMBOL
MIN. 0.198 (5.03) 0.0685 (1.74)
DIMENSIONS INCHES (MM)
NOTES: INDICATES DIMENSIONS INCHES (MILLIMETERS) GROUNDS MUST SOLDERED GROUND
Carrier Tape Pocket Dimensions
4.00 0.10 NOTE 2.00 0.05 1.55 0.05 0.50 TYP. 1.75 0.10 5.50 0.05 SECTION PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 MIN. 5.20 NOM. 5.30 MAX. 5.40 5.20 5.30 5.40 2.10 2.20 2.30 12.00 0.10
8.00 0.10
1.50 (MIN.)
0.30 0.05 SECTION NOTES: MEASURED ABOVE BASE POCKET. PITCHES CUMULATIVE TOLERANCE DIMENSIONS MILLIMETERS (mm).
AMMP XXXX AMMP XXXX AMMP XXXX
AMMP-6130 Part Number Ordering Information
Part Number AMMP-6130-BLKG AMMP-6130-TR1G AMMP-6130-TR2G Devices Container Container Antistatic "7"" Reel" "7"" Reel"
Note: performance degradation seen upto characteristics general show increased leakage lower discharge voltages. user reminded that this device sensitive needs handled with necessary protocols.
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. Obsoletes AV01-0287EN AV02-0514EN June 2007

Power Amplifier with Frequency Multiplier (x2) Package Avago Tech

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