5-30 Image Reject Mixer Avago's AMMP-6530 image reject mixer that
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AMMP-6530
5-30 Image Reject Mixer
Avago's AMMP-6530 image reject mixer that operates from GHz. cold channel mixer designed easy-to-use component surface mount application. used drain pumped conversion loss applications, when gate pumped mixer provide high linearity up-conversion. external 90degree hybrid used achieve image rejection voltage reference needed. Intended applications include microwave radios, 802.16, VSAT, satellite receivers. Since this mixer cover several bands, AMMP-6530 reduce part inventory. integrated mixer eliminates complex tuning assembly processes typically required hybrid (discrete-FET diode) mixers. package fully compatible with backside grounding simplify assembly.
drain
Features
Surface Mount Package Broad Band Performance Conversion Loss High Image Rejection 15-20 Good Order Intercept Single -1V, current Supply Bias
Applications
Microwave Radio Systems Satellite VSAT, Up/Down Link LMDS Pt-Pt Long Haul Broadband Wireless Access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Function
LO/RF RF/LO
Absolute Maximum Ratings
Symbol Tstg Tmax Parameters/Conditions Gate Supply Voltage Input Power Operating Channel Temperature Storage Case Temperature Max. Assembly Temp max) Units Min. Max. +150 +150 +300
gate
view package base:
Attention: Observe precautions handling electrostatic sensitive devices.
Machine Model (Class Human Body Model (Class Refer Avago Application Note A004R: Electrostatic Discharge Damage Control.
Note: Operation excess these conditions result permanent damage this device.
AMMP-6530 Specifications/Physical Properties[1]
Symbol Parameters Test Conditions Gate Supply Current (under power drive temperature) Gate Supply Operating Voltage Units Typ.
Note: Ambient operational temperature TA=25°C unless otherwise noted.
AMMP-6530 Typical Performance 25°C, -1V, frequency GHz, Zo=50 Symbol RL_RF RL_LO RL_IF LO-RF Iso. LO-IF Iso. RF-IF Iso. IIP3 Parameters Test Conditions Frequency Range Frequency Range Frequency Range Port Pumping Power Conversion Gain Port Return Loss Port Return Loss Port Return Loss Image Rejection Ratio Port Isolation Port Isolation Port Isolation Input IP3, Fdelta=100 MHz, dBm, Input Port Power gain compression point, Plo=+10 Noise Figure Units Gate Pumped Down Conversion Conversion Drain Pumped Down Conversion
Notes: Small/Large signal data measured fully de-embedded test fixture form 25°C. Specifications derived from measurements test environment.
AMMP-6530 Specifications Gate Pumped Test Configuration[4,
25°C, -1.0V, dBm, Symbol Parameters Test Conditions Conversion Gain[7] Image Rejection Ratio Units -12.5 Typ.
Notes: Pre-assembly into package performance verified 100% on-wafer. This final package part performance verified functional test correlated actual performance. external degree hybrid coupler from M/A-COM: 2032-6344-00. Frequency 1.0- GHz. 100% on-package test done frequency GHz, frequency frequency GHz)
AMMP-6530 Typical Performance under Gate Pumped Down Conversion Operation 25°C, -1V,
drain
gate
Note: external hybrid coupler from M/A-COM: 2032-6344-00. Frequency GHz.
CONVERSION GAIN (dB) CONVERSION GAIN (dB)
USB(dB) LSB(dB)
USB(dB) LSB(dB)
INPUT POWER (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Conversion Gain with terminated High Side Conversion LO=+10 dBm, IF=1 GHz.
Figure Conversion Gain with terminated Side Conversion LO=+10 dBm, IF=1 GHz.
Figure Port Input Power P-1dB. LO=+10 dBm, IF=1 GHz.
NOISE FIGURE (dB)
IIP3 (dBm)
CONVERSION GAIN (dB)
Plo=15(dBm) Plo=10(dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
POWER (dBm)
Figure Noise Figure. LO=+7 dBm, IF=1 GHz.
Figure Input Order Intercept Point. IF=1 GHz.
Figure Conversion Gain Power. RF=21 (-20 dBm), LO=20 GHz.
AMMP-6530 Typical Performance under Gate Pumped Down Conversion Operation 25°C, -1V, o=50)
CONVERSION GAIN (dB), RETURN LOSS (dB)
CONVERSION GAIN (dB)
Conv. Gain (dB) Return Loss (dB)
-1.5
-0.5
FREQUENCY (GHz)
Figure Conversion Gain Match Frequency. RF=20 GHz, LO=10 dBm.
Figure Conversion Gain Gate Voltage. RF=20 GHz, LO=10 dBm.
RETURN LOSS (dB)
ISOLATION (dB)
RF-IF LO-IF LO-RF
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Return Loss. LO=10 dBm.
Figure Isolation. LO=+10 dBm, IF=1 GHz.
AMMP-6530 Typical Performance under Gate Pumped Conversion Operation 25°C, -1V, o=50)
gate
drain
(dB) (dB)
(dB) (dB)
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Up-conversion Gain with terminated Side Conversion. LO=+5 dBm, IF=+5 dBm, IF=1 GHz.
Figure Up-conversion Gain terminated High Side Conversion. LO=+5 dBm, IF=+5 dBm, IF=1 GHz.
CONVERSION LOSS (dB)
ISOLATION (dB)
FREQUENCY (GHz)
PLO=PIF (dB)
Figure LO-RF Up-conversion Isolation.
Figure Up-conversion Gain Pumping Power. power=IF power, IF=1 GHz, RF=25 GHz.
AMMP-6530 Typical Performance under Drain Pumped Down Conversion Operation 25°C, -1V,
drain
gate Note: external hybrid coupler from M/A-COM: 2032-6344-00. Frequency GHz.
CONVERSION GAIN (dB) CONVERSION GAIN (dB)
USB(dBm) LSB(dBm)
(dB) (dB)
INPUT POWER (dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Conversion Gain with terminated Side Conversion. LO=+10 dBm, IF=1 GHz.
Figure Conversion Gain with terminated High Side Conversion. LO=+10 dBm, IF=1 GHz.
Plo=10(dBm) Plo=15(dBm)
Figure Port Input Power P-1dB. LO=+10 dBm, IF=1 GHz.
NOISE FIGURE (dB)
IIP3 (dBm)
CONVERSION GAIN (dB)
(dB)
FREQUENCY (GHz)
POWER (dBm)
Figure Noise Figure. LO=+7 dBm, IF=1 GHz.
Figure Input Order Intercept Point. IF=1 GHz.
Figure Conversion Gain power. RF=21 (-20 dBm), LO=20 GHz.
Biasing Operation
recommended bias condition optimum performance, reliability volts. There current consumption gate biasing because mixer designed passive operation. down conversion, AMMP-6530 configured loss high linearity application. loss configuration, applied through drain (Pin8, power divider side). this configuration, AMMP-6530 "drain pumped mixer". higher linearity applications, applied through gate (Pin, Lange coupler side). this configuration, AMMP-6530 "gate pumped mixer" Resistive mixer). mixer also suitable up-conversion applications under gate pumped mixer operation shown page Please note that image rejection isolation performance dependent selection frequency quadrature hybrid. performance specification frequency quadrature hybrid well phase balance VSWR interface AMMP-6530 will affect overall mixer perfordrain
gate
Figure Simplified MMIC Schematic.
LO/RF
RF/LO
Figure Demonstration Board (available upon request).
AMMP XXXX YWWDNN
Front View
Symbol 0.198 (5.03) 0.0685 (1.74) 0.114 [2.9]
Side View
0.213 (5.4) 0.088 (2.25)
0.011 [0.28] 0.018 [0.46]
0.014 [0.365]
0.016 [0.40] 0.126 [3.2] 0.059 [1.5] 0.100 [2.54] 0.029 [0.75] 0.100 [2.54] 0.016 [0.40] 0.093 [2.36] 0.028 [0.70] 0.012 [0.30]
Back View
Dimensional tolerance back view: 0.002" [0.05 Notes: Indicates Dimensions inches [millimeters] Grounds must soldered Ground
Figure Outline Drawing.
Recommended Attachment Package
Figure 24a. Suggested Land Pattern Stencil Layout
Recommended Attachment
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering.
Stencil Design Guidelines
properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127 mils) thick stainless steel which capable producing required fine stencil outline. combined stencil layout shown Figure
Figure 24b. Stencil Outline Drawing (mm)
Figure 24c. Combined Stencil Layouts
Manual Assembly
Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Conductive epoxy recommended. Hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temperature avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits.
Solder Reflow Profile
most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
Peak Melting point 218°C
Temp (°C)
Ramp Preheat Ramp Reflow Cooling
Seconds
Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste.
Carrier Tape Pocket Dimensions
Device Orientation (Top View)
Part Number Ordering Information
Part Number AMMP-6530-BLK AMMP-6530-TR1 AMMP-6530-TR2 Devices Container Container antistatic Reel Reel
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies, Limited. rights reserved. Obsoletes AV01-0409EN AV02-0502EN June 2007
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