GaAs MMIC Sub-Harmonic Mixer Package Avago's AMMP-6545 easy-to-us

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GaAs MMIC Sub-Harmonic Mixer Package Avago's AMMP-6545 easy-to-us

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AMMP-6545
GaAs MMIC Sub-Harmonic Mixer Package
Avago's AMMP-6545 easy-to-use broadband sub-harmonic mixer, with injected half frequency that required conventional mixer. MMIC includes 180° balanced diode based mixer. MMIC fabricated using PHEMT technology. surface mount package allows elimination "chip wire" assembly lower cost. This MMIC cost effective alternative multi-chip solution that have higher loss complex assembly.
Features
Frequency 18-40 Frequency 9-20 Frequency DC-3.5 Surface Mount Package Suitable Down Conversion Diode Mixer
Typical 18-30 Performance Connections (Top View)
FUNCTION
Conversion Loss IIP3 2LO-R Leakage 2LO-I Leakage
Typical 30-40 Performance
Conversion Loss IIP3 2LO-R Leakage 2LO-I Leakage
VIEW PACKAGE BASE:
Applications
Microwave radio systems Satellite VSAT, up/down link LMDS Pt-Pt long haul Broadband wireless access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Attention: Observe precautions handling electrostatic sensitive devices. Machine Model Human Body Model (100 Refer Avago Technologies Application Note A004R: Electrostatic Discharge, Damage Control.
Absolute Maximum Ratings[1]
Sym. Tstg Tmax Parameters/Condition Input Power Storage temperature Unit Max. +150
Specifications/ Physical Properties[2]
Operation excess these conditions result permanent damage this device. Ambient operational temperature 25°C unless noted.
Maximum Assembly Temp.
AMMP-6545 Operaqting Conditions
Symbol RFfreq LOfreq IFfreq Parameter Frequency Frequency Frequency Power Units Minimum Typical Maximum
AMMP-6545 Specifications
25°C, dBm, 18-30 Symbol Parameter IIP3 2LO-R 2LO-I Conversion Loss[1] Units 9-15 Min. 10.5 Input Third Order Intercept[1] 18-24 24-30 2LO-R Leakage 2LO-I Leakage Leakage Leakage Typ. Min. 30-40 15-20 Min. Typ. Max.
Note: Production tested upconverter configuration. tested parameters guaranteed with following measurement accuracy: RF=18-24 GHz: ±0.8 RF-leakage, ±2.5 IF-leakage, ±1.2dB Conversion Loss, ±0.5 IIP3 RF=24-30 GHz: ±0.8 RF-leakage, ±4.0 IF-leakage, ±0.6 Conversion Loss, ±0.5 IIP3
AMMP-6545 Typical Performance
25°C, Zout Freq GHz, Power unless noted)
UP-CONVERTER TYP. PERFORMANCE UP-CONVERTER TYP. PERFORMANCE
(dB) (dB) (dB) (dB) (dB)
IIP3 (dBm)
C.L. (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Up-conversion loss (high side
Figure Up-conversion IIP3 (high side
UP-CONVERTER TYP. PERFORMANCE
UP-CONVERTER TYP. PERFORMANCE
IIP3 (dBm)
C.L. (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Up-conversion loss (low side
Figure Up-conversion IIP3 (low side
DOWN-CONVERTER TYP. PERFORMANCE
DOWN-CONVERTER TYP. PERFORMANCE
IIP3 (dBm)
C.L. (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Down-conversion loss (low side
Figure Down-conversion IIP3 (low side
AMMP-6545 Typical Performance
25°C, Zout Freq GHz, Power unless noted)
2*LO-R LEAKAGE (dBm) 2LO-I LEAKAGE (dBm)
FREQUENCY (GHz)
2*LO FREQUENCY (GHz)
Figure 2*LO-R leakage
Figure 2*LO-I leakage
ISOLATION (dB) ISOLATION (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure isolation +17dBm
Figure isolation +17dBm
AMMP-6545 Application Usage
Figure Simplified schematic mixer
Figure Photograph test board
Recommended Attachment Package
AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Agilent Sales Application Engineering. Manual Assembly Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Neither Conductive epoxy hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits. properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127 mils) thick stainless steel which capable producing required fine stencil outline. most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only.
0.093 (2.36) 0.010 (0.25) 0.011 (0.28) 0.016 (0.40) 0.0095 (0.24) 0.60 0.67
0.40 0.46
0.36 0.40 0.126 (3.20) 0.059 (1.50) 0.016 (0.40) 0.012 (0.30)
0.020 (0.50)
2.60 1.80
0.40
0.36
0.30
0.27
0.018 (0.46) 0.018 (0.46) 0.114 (2.90)
0.0095 (0.24)
GROUND VIAS SHOULD SOLDER FILLED 1.60 2.90 NOTES: DIMENSIONS INCHES (MILLIMETERS). GROUNDS MUST SOLDERED MATERIAL ROGERS RO4350, 0.010" THICK.
STENCIL OPENING
Figure land pattern stencil layouts
TEMPERATURE (°C) RAMP PREHEAT RAMP TIME (SECONDS) REFLOW COOLING PEAK MELTING POINT 218°C
Figure Suggested lead-free reflow profile SnAgCu solder paste
AMMP-6545 Part Number Ordering Information
Part Number AMMP-6545-BLKG AMMP-6545-TR1G AMMP-6545-TR2G Devices Container Container Antistatic Reel Reel
Package Dimensions
0.200 (5.08)
AMMP XXXX 043101
0.200 (5.08)
0.075 (1.91)
VIEW
SIDE VIEW
0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 0.014 (0.365)
0.126 (3.2) 0.059 (1.5)
0.016 (0.40)
0.100 (2.54) 0.029 (0.75) 0.016 (0.40)
0.012 (0.30)
0.028 (0.70) 0.100 (2.54) 0.93 (2.36)
DIMENSIONS INCHES (MILLIMETERS) DIMENSIONAL TOLERANCE: 0.002" (0.05
BACK VIEW
Carrier Tape Pocket Dimensions
AMMP XXXX AMMP XXXX AMMP XXXX
4.00 0.10 NOTE 2.00 0.05 1.55 0.05 0.50 TYP. 1.75 0.10 5.50 0.05 SECTION PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 MIN. 5.20 NOM. 5.30 MAX. 5.40 5.20 5.30 5.40 2.10 2.20 2.30 12.00 0.10
8.00 0.10
1.50 (MIN.)
0.30 0.05 SECTION NOTES: MEASURED ABOVE BASE POCKET. PITCHES CUMULATIVE TOLERANCE DIMENSIONS MILLIMETERS (mm).
product information complete list distributors, please website:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies Limited United States other countries. Data subject change. Copyright 2007 Avago Technologies Limited. rights reserved. AV02-0251EN April 2007

GaAs MMIC Sub-Harmonic Mixer Package Avago's AMMP-6545 easy-to-us

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